子分类：
- C04B2237/52： ..连接表面的预处理,如清洁,加工
- C04B2237/54： ..连接前氧化表面
- C04B2237/55： ..基底的氧化处理之外的涂覆或不涂覆预处理,以形成活性连接层
- C04B2237/56： ..烧结前或烧结过程中使用抑制层
- C04B2237/58： ..在叠层或连接物件之间形成成分或性质梯度
- C04B2237/59： ..中间层结构相关的特征
- C04B2237/60： ..在中间粘结层或连接层间形成特定反应相或反应区,如活性组分从中间层向基底或从基底向中间层扩散,或在中间层形成碳化物
- C04B2237/61： ..连接两个基底,其中一个基底是被液体渗透过的多孔基底,例如熔融金属,引发两基质的粘结,如通过两个多孔碳基质渗透熔融硅连接
- C04B2237/62： ..层压或连接含有孔,通道或其他类型开口的制品
- C04B2237/64： ..层压或连接有沟槽的制品
- C04B2237/66： ..层压或连接具有高精确维度的制品,如展现出翘曲
- C04B2237/68： ..层压或连接的制品,其中至少一个基体包含宏观不同的两部分,如一个陶瓷基体层和一个嵌入导体或电极的基体
- C04B2237/70： ..层压或连接含有特定的、不常见厚度的层的制品
- C04B2237/72： ..形成的层压或连接制品包含至少两个连接在一起中间层
- C04B2237/74： ..形成的层压或连接制品包含至少两个被一个基底分开的两个中间层
- C04B2237/76： ..形成的层压或连接制品包含至少一个片状或圆盘状之外的组成部件,如,两个管状,或一个管状一个片或圆盘状
- C04B2237/78： ..侧面连接,如,连接两个盘状物的侧边
- C04B2237/80： ..一个基底的最大表面与另一基底的较小表面连接,如头部连接T形
- C04B2237/82： ..两个基底没有完全相互覆盖,如两个盘状物错开连接
- C04B2237/84： ..第二基底部分位于第一基底内与第一基底连接,并且连接区域部分位于第一基底内,如一个管状物在另一管状物内
- C04B2237/86： ..两个基底以最大表面相连,一个表面被完全连接并覆盖,另一表面则不是,如一个小盘状物的最大表面与另一较大盘状物的最大表面连接
- C04B2237/88： ..两个连接基底,其中一个基底连接材料的实质部分在连接处之外,从而在结合处外部形成接合体
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | Multilayered microfluidic DNA analysis system and method | US10340057 | 2003-01-10 | US20030129646A1 | 2003-07-10 | Cynthia G. Briscoe; Huinan Yu; Piotr Grodzinski; Robert Marrero; Jeremy W. Burdon; Rong-Fong Huang |
| A multilayered microfluidic DNA analysis system includes a cell lysis chamber, a DNA separation chamber, a DNA amplification chamber, and a DNA detection system. The multilayered microfluidic DNA analysis system is provided as a substantially monolithic structure formed from a plurality of green-sheet layers sintered together. The substantially monolithic structure has defined therein a means for heating the DNA amplification chamber and a means for cooling the DNA amplification chamber. The means for heating and means for cooling operate to cycle the temperature of the DNA amplification chamber as required for performing a DNA amplification process, such as PCR. | ||||||
| 162 | Method for manufacturing multilayer ceramic electronic element | US10318264 | 2002-12-13 | US20030111158A1 | 2003-06-19 | Shingo Okuyama; Hiroyoshi Takashima; Akira Hashimoto; Shinichi Kokawa |
| A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed. | ||||||
| 163 | Substrate and production method therefor | US10182366 | 2002-07-26 | US20030108729A1 | 2003-06-12 | Reo Yamamoto; Yoshihide Kamiyama; Yuichiro Minabe |
| The object of the present invention is to provide a sintered aluminum nitride substrate which has a via hole and an internal electrically conductive layer, having high thermal conductivity and high adhesion strength between the sintered aluminum nitride substrate and the internal electrically conductive layer or the via hole and having other excellent properties. The substrate according to the invention comprising an internal electrically conductive layer, at least one electrically conductive via hole formed between the internal electrically conductive layer and at least one surface of the substrate, wherein the thermal conductivity of the aluminum nitride sintering product at 25null C. is 190 W/mK or more, and the adhesion strength between the aluminum nitride sintering product and the internal electrically conductive layer is 5.0 kg/mm2 or more. | ||||||
| 164 | GREENSHEET CARRIERS AND PROCESSING THEREOF | US09757071 | 2001-01-08 | US20030096085A1 | 2003-05-22 | John U. Knickerbocker; Govindarajan Natarajan |
| A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that that the frame and greensheet side are substantially coplanar. | ||||||
| 165 | Conductive paste and laminated ceramic electronic component | US09899323 | 2001-07-05 | US20030064210A1 | 2003-04-03 | Takaharu Miyazaki; Tsuyoshi Yamana |
| A laminated ceramic electronic component, for example, monolithic ceramic capacitor, in which the delamination does not occur during baking and having superior thermal shock and moisture load resistance characteristics is provided. A conductive paste, used with advantage to form an internal electrode of the laminated ceramic electronic component, and a laminated ceramic electronic component using the conductive paste is provided. The conductive paste is composed of a conductive powder which is primarily Ni, an organic vehicle, a compound A containing at least one of Mg and Ca and which is an organic acid metal salt, oxide powder, metal organic complex salt and/or an alkoxide, and a compound B, having a hydrolyzable reactive group containing at least one of Ti and Zr, which adheres to the surface of the conductive powder. | ||||||
| 166 | Graphite article having predetermined anisotropic characteristics and process therefor | US09826229 | 2001-04-04 | US20020164483A1 | 2002-11-07 | Robert Angelo Mercuri; Julian Norley; Martin David Smalc |
| The invention presented is a graphite article having predetermined anisotropic characteristics, as well as a process for preparing the article. More particularly, the article is prepared by a process involving determining the desired anisotropic characteristics for a finished flexible graphite article; intercalating and then exfoliating flakes of graphite to form exfoliated graphite particles; forming a substrate graphite article by compressing the exfoliated graphite particles into a coherent article formed of graphene layers; and producing a controlled directional alignment of the graphene layers in the substrate graphite article to provide a finished graphite article having the desired anisotropic ratio. | ||||||
| 167 | Method for manufacturing powdered raw material for dielectric ceramic | US09474217 | 1999-12-29 | US06436862B1 | 2002-08-20 | Masuhisa Hirota; Shozo Kojima; Masami Yabuuchi |
| A method for manufacturing a powdered raw material of a basic powdered dielectric ceramic composition having compounds containing metal elements thereon. The method comprises the steps of dispersing a basic powdered dielectric ceramic composition in water to form a slurry, adding a silicon compound to the slurry to coat the powder, adding a solution containing the metal elements and a precipitating agent reactive therewith to form a precipitate, while the slurry is being stirred, and rinsing and drying the slurry. | ||||||
| 168 | Process for producing layered ceramic product | US115674 | 1993-09-02 | US5591287A | 1997-01-07 | William J. Clegg; Kevin Kendall |
| Process for producing a layered ceramic product which includes sintering layers of sinterable particulate ceramic material while in face-to-face contact. Before such contact, the surface of at least one of the layers is modified to provide a zone of weakness between the layers. This zone acts to deflect a crack propagating across the layers thereby increasing the work required to break the product. The product may also have improved fracture toughness. | ||||||
| 169 | Joining methods for ceramic composite bodies | US960406 | 1993-01-11 | US5400947A | 1995-03-28 | James C.-K. Wang; Terry D. Claar; Philip J. Roach; Gerhard H. Schiroky |
| This invention relates generally to a novel method for joining at least one first self-supporting body to at least one second self-supporting body which is similar in composition to or different in composition from said at least one first self-supporting body and to novel products which result from such joining. In some of its more specific aspects, this invention relates to different techniques for joining ceramic matrix composite bodies to other ceramic matrix composite bodies of similar characteristics and for joining ceramic matrix composite bodies to bodies which have different characteristics (e.g., metals). The ceramic matrix composite bodies of this invention are produced by a reactive infiltration of a molten parent metal into a bed or mass containing at least one of a boron source material, a carbon source material, and a nitrogen source material and, optionally, one or more inert fillers. | ||||||
| 170 | Method for joining ceramic composite bodies and articles formed thereby | US803709 | 1991-12-04 | US5133494A | 1992-07-28 | James C. Wang; Terry D. Claar; Philip J. Roach |
| This invention relates generally to a novel method for joining at least one first self-supporting body, to at least one second self-supporting body which is similar in composition to or different in composition from said at least one first self-supporting body and to novel products which result from such joining. In some of its more specific aspects, this invention relates to different techniques for joining ceramic matrix composite bodies to other ceramic matrix composite bodies of similar characteristics and for joining ceramic matrix composite bodies to bodies which have different characteristics (e.g., metals). The ceramic matrix composite bodies of this invention are produced by a reactive infiltration of a molten parent metal into a bed or mass containing a boron source material and a carbon source material (e.g., boron carbide) and/or a boron source material and a nitrogen source material (e.g., boron nitride) and, optionally, one or more inert fillers. | ||||||
| 171 | Method of producing composite materials | US82487 | 1987-08-07 | US4778649A | 1988-10-18 | Masayuki Niino; Nobuyuki Yatsuyanagi; Jun Ikeuchi; Nobuhiro Sata; Tohru Hirano; Kanichiro Sumiyoshi |
| A method of producing a material having a layer of ceramic as a first component, a layer of a metal as a second component and an intermediate layer lying between said layers and including said first and second components in continuous gradient ratios so that the properties of the material may change continuous, including a step of forming said intermediate layer by igniting a powder mixture of metallic and nonmetallic constitutive elements of said ceramic component and said metal component so as to cause a synthetic reaction in the powder mixture. | ||||||
| 172 | 銅/セラミックス接合体、及び、絶縁回路基板 | JP2017119683 | 2017-06-19 | JP2018008869A | 2018-01-18 | 寺▲崎▼ 伸幸 |
| 【課題】窒化化合物層におけるクラックの発生を抑制でき、銅部材と窒化ケイ素からなるセラミックス部材とが確実に接合された信頼性の高い銅/セラミックス接合体、及び、この銅/セラミックス接合体からなる絶縁回路基板を提供する。 【解決手段】銅又は銅合金からなる銅部材と窒化ケイ素からなるセラミックス部材との銅/セラミックス接合体であって、前記銅部材とセラミックス部材との接合界面には、セラミックス部材側から順に、Ti,Nb,Hf,Zrから選択される一種又は二種以上の窒化物形成元素を含む窒化化合物層31と、Ag−Cu共晶層と、が形成されており、窒化化合物層31の厚さは0.15μm以上1.0μm以下であり、前記銅部材と前記セラミックス部材との間には、前記窒化物形成元素とSiを含む金属間化合物からなる金属間化合物相が存在しており、窒化化合物層31の粒界31aにはCu及びSi34が存在している。 【選択図】図3 |
||||||
| 173 | 接合体の製造方法 | JP2013075641 | 2013-04-01 | JP5772861B2 | 2015-09-02 | 大河内 泰幸; 河本 保典 |
| 174 | 回路基板および電子装置 | JP2013523888 | 2012-06-29 | JPWO2013008651A1 | 2015-02-23 | 石峯 裕作; 裕作 石峯; 森山 正幸; 正幸 森山; 健司 小松原 |
| 【課題】回路部材間における絶縁破壊が起こりにくく、放熱特性に優れているとともに、回路部材が支持基板に強固に接合されている回路基板およびこの回路基板における回路部材上に電子部品を搭載してなる電子装置を提供する。【解決手段】セラミック焼結体からなる支持基板1の第1主面に、第1の接合層3を介して複数の回路部材2が接合されて配置されている回路基板10であって、第1主面における回路部材配置領域および回路部材間領域に突起1aが存在し、回路部材間領域に存在する突起1a1の平均高さが、回路部材配置領域に存在する突起1a2の平均高さよりも低い回路基板である。【選択図】図1 | ||||||
| 175 | Joining method of the superconducting material | JP2012198260 | 2012-09-10 | JP5568612B2 | 2014-08-06 | 昆平 黄; 志振 張; 宇澤 謝; 志偉 羅; 志翔 蘇; 文彦 曽 |
| 176 | Carbon ceramic friction disk and a method of manufacturing the same | JP2013546727 | 2011-12-30 | JP2014505841A | 2014-03-06 | ギューター ハンス−ミヒャエル; ペルスィ ルイジ; コッホ クリストフ; オルランディ マルコ; カーラー ミヒャエル |
| 本発明は、少なくとも１つのキャリヤボディと、通気ダクトを有する少なくとも１つの通気層と、選択的に、少なくとも１つの摩擦層とを有する、少なくとも１つの個々のキャリヤボディのグリーン体と、少なくとも１つの個々の通気層のグリーン体と、選択的に、少なくとも１つの個々の摩擦層のグリーン体とを、それらの固体状態または硬化した状態において接合し、前記グリーン体は熱可塑性または熱硬化性材料を含み、その後、炭素化、および炭化物形成元素の含浸による炭素化およびセラミック化することによって形成される、多層カーボンセラミックブレーキディスクに関する。 | ||||||
| 177 | Ceramic joined body and method for producing the same | JP2011192800 | 2011-09-05 | JP2013053047A | 2013-03-21 | IZUTSU YASUHISA; ARIMA SHUN; KONDO NAOKI; HOTTA MIKINORI; KITA HIDENORI |
| PROBLEM TO BE SOLVED: To provide a ceramic joined body, in which a bonding portion has high joining strength close to the strength of materials to be joined.SOLUTION: The ceramic joined body is obtained by joining silicon nitride ceramic materials to be joined to each other through a bonding portion comprising both silicon nitride particles and a silicon oxynitride glass. The bonding portion has a microstructural texture in which silicon nitride particles and a silicon oxynitride glass are observed. The ratio, based on two-dimensional cross-section observation, of the amount of the silicon oxynitride glass to the total amount of the silicon nitride particles and the silicon oxynitride glass in the field of view of observation is 97:3 to 60:40. The silicon nitride particles contained in the bonding portion are columnar. | ||||||
| 178 | Substrate and a method of manufacturing the same | JP2002546472 | 2001-11-28 | JP4498678B2 | 2010-07-07 | 鍋 雄一郎 三; 本 玲 緒 山; 山 美 英 神 |
| 179 | Metal - ceramic bonding | JP2001304277 | 2001-09-28 | JP4168114B2 | 2008-10-22 | 潤二 中村; 雅彦 和田; 信芳 塚口; 正美 木村; 睦 浪岡 |
| 180 | Manufacturing method and the ceramic substrate of the ceramic substrate | JP2006535894 | 2006-03-29 | JP3969458B2 | 2007-09-05 | 優輝 伊藤; 哲也 池田; 修 近川 |
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