子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 一种由CMC材料制造部件的方法 | CN201280058743.3 | 2012-11-22 | CN103998396B | 2017-09-15 | E·布伊隆; E·菲利佩; A·拉丰; F·拉穆鲁 |
| 本发明涉及制造复合材料部件，包括如下步骤：制备加固的纤维预成型体，所述预成型体的纤维为涂布于界面中的碳或陶瓷纤维，所述界面由热解碳(PyC)或掺硼碳(BC)的至少一层形成；获得部分致密化的加固的纤维预成型体，其中部分致密化包括在所述界面上形成第一基体相，所述第一基体相包括与PyC或BC的一个或多个层交替的自愈合材料的多个层；以及通过在所述部分致密化的加固的预成型体内分散碳粉末和/或陶瓷粉末以及通过渗透熔融硅或大部分由硅形成的液体组合物而继续致密化。 | ||||||
| 2 | 层叠陶瓷电子部件的制造方法 | CN201280028907.8 | 2012-04-25 | CN103597563B | 2016-03-23 | 浜中建一; 伊藤英治; 山下泰治; 冈岛健一; 松井透悟 |
| 本发明提供一种可通过对于层叠体芯片的侧面具有所期望的绝缘体部的厚度而获得电气特性稳定的高可靠性的层叠陶瓷电子部件的制造方法。本发明的层叠陶瓷电子部件的制造方法包括如下工序：准备形成为内部电极的两侧端缘于侧面露出的层叠体芯片；将层叠体芯片的一个侧面及另一个侧面抵压至具有任意体积的沟槽且在上述体积的沟槽内填充有绝缘体部用膏的金属板，在将层叠体芯片自金属板拉离时使金属板向任意方向摇动，从而形成第一绝缘体部及第二绝缘体部；进而对形成有第一绝缘体部及第二绝缘体部的层叠体芯片进行烧制。绝缘体部用膏的特征在于粘度为500Pa·s～2500Pa·s、且无机固形物的含量C(vol％)满足特定条件。 | ||||||
| 3 | 一种由CMC材料制造部件的方法 | CN201280058743.3 | 2012-11-22 | CN103998396A | 2014-08-20 | E·布伊隆; E·菲利佩; A·拉丰; F·拉穆鲁 |
| 本发明涉及制造复合材料部件，包括如下步骤：制备加固的纤维预成型体，所述预成型体的纤维为涂布于界面中的碳或陶瓷纤维，所述界面由热解碳(PyC)或掺硼碳(BC)的至少一层形成；获得部分致密化的加固的纤维预成型体，其中部分致密化包括在所述界面上形成第一基体相，所述第一基体相包括与PyC或BC的一个或多个层交替的自愈合材料的多个层；以及通过在所述部分致密化的加固的预成型体内分散碳粉末和/或陶瓷粉末以及通过渗透熔融硅或大部分由硅形成的液体组合物而继续致密化。 | ||||||
| 4 | 层叠陶瓷电子部件的制造方法 | CN201280028907.8 | 2012-04-25 | CN103597563A | 2014-02-19 | 浜中建一; 伊藤英治; 山下泰治; 冈岛健一; 松井透悟 |
| 本发明提供一种可通过对于层叠体芯片的侧面具有所期望的绝缘体部的厚度而获得电气特性稳定的高可靠性的层叠陶瓷电子部件的层叠陶瓷电子部件的制造方法。本发明的层叠陶瓷电子部件的制造方法包括如下工序：准备形成为内部电极的两侧端缘于侧面露出的层叠体芯片；将层叠体芯片的一个侧面及另一个侧面抵压至具有任意体积的沟槽且在上述体积的沟槽内填充有绝缘体部用膏的金属板，在将层叠体芯片自金属板拉离时使金属板向任意方向摇动，从而形成第一绝缘体部及第二绝缘体部；进而对形成有第一绝缘体部及第二绝缘体部的层叠体芯片进行烧制。绝缘体部用膏的特征在于粘度为500Pa·s～2500Pa·s、且无机固形物的含量C(vol％)满足特定条件。 | ||||||
| 5 | Method of fabricating a part out of CMC material | US14361854 | 2012-11-22 | US09440888B2 | 2016-09-13 | Eric Bouillon; Eric Philippe; Andre Lafond; Franck Lamouroux |
| Fabricating a composite material part comprises the steps of making a consolidated fiber preform, the fibers of the preform being carbon or ceramic fibers that are coated in an interphase formed by at least one layer of pyrolytic carbon (PyC) or of boron-doped carbon (BC). Obtaining a partially densified consolidated fiber preform, where partial densification comprises forming a first matrix phase on the interphase, the first matrix phase comprising a plurality of layers of self-healing material alternating with one or more layers of PyC or of BC. Continuing densification by dispersing carbon and/or ceramic powder within the partially densified consolidated preform and by infiltrating molten silicon or a liquid composition formed for the most part of silicon. | ||||||
| 6 | METHOD OF FABRICATING A PART OUT OF CMC MATERIAL | US14361854 | 2012-11-22 | US20150008613A1 | 2015-01-08 | Eric Bouillon; Eric Philippe; Andre Lafond; Franck Lamouroux |
| Fabricating a composite material part comprises the steps of making a consolidated fiber preform, the fibers of the preform being carbon or ceramic fibers that are coated in an interphase formed by at least one layer of pyrolytic carbon (PyC) or of boron-doped carbon (BC). Obtaining a partially densified consolidated fiber preform, where partial densification comprises forming a first matrix phase on the interphase, the first matrix phase comprising a plurality of layers of self-healing material alternating with one or more layers of PyC or of BC. Continuing densification by dispersing carbon and/or ceramic powder within the partially densified consolidated preform and by infiltrating molten silicon or a liquid composition formed for the most part of silicon. | ||||||
| 7 | METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT | US14105387 | 2013-12-13 | US20140096890A1 | 2014-04-10 | Kenichi Hamanaka; Eiji Ito; Yasuharu Yamashita; Kenichi Okajima; Togo Matsui |
| A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition. | ||||||
| 8 | CMC BLADE WITH MONOLITHIC CERAMIC PLATFORM AND DOVETAIL | US15025949 | 2014-09-17 | US20160222802A1 | 2016-08-04 | John E. Holowczak; Michael G. McCaffrey |
| A blade for a gas turbine engine includes a fiber reinforced ceramic matrix composite structure that provides an airfoil with an exposed exterior airfoil surface and a refractory structure that provides at least an outer portion of a root secured relative to the airfoil. | ||||||
| 9 | Method for manufacturing laminated ceramic electronic component | US14105387 | 2013-12-13 | US09111692B2 | 2015-08-18 | Kenichi Hamanaka; Eiji Ito; Yasuharu Yamashita; Kenichi Okajima; Togo Matsui |
| A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition. | ||||||
| 10 | ＣＭＣ材料製の部品の製造方法 | JP2014543954 | 2012-11-22 | JP2015506892A | 2015-03-05 | ブイヨン，エリック; フィリップ，エリック; ラフォン，アンドレ; ラムルー，フランク |
| 複合材料製の部品を製造する方法は、補強された繊維の予備形状体を作るステップであって、予備形状体の繊維が熱分解炭素(PyC)又はホウ素がドープされた炭素(BC)の少なくとも一つの層によって形成された中間相に被覆された炭素繊維又はセラミック繊維であるステップと、部分的に密度が高められて補強された繊維の予備形状体を得るステップであって、部分的に密度を高めるステップが中間相に第一マトリクス相を形成するステップを備え、第一マトリクス相はPyC又はBCの一つ以上の層と交互に重なっている自己修復性の材料の複数の層を備えるステップと、部分的に密度が高められて補強された予備形状体の内部で炭素及び/又はセラミックの粉を分散させ、かつ、溶融シリコン又はシリコンが主成分である液体組成物を浸潤させることによってさらに密度を高めるステップと、を備える。【選択図】図1 | ||||||
| 11 | CMC材料製の部品の製造方法 | JP2014543954 | 2012-11-22 | JP6155439B2 | 2017-07-05 | ブイヨン,エリック; フィリップ,エリック; ラフォン,アンドレ; ラムルー,フランク |
| 12 | セラミックスヒータ型グロープラグの製造方法及びセラミックスヒータ型グロープラグ | JP2016560111 | 2015-10-08 | JPWO2016080106A1 | 2017-06-29 | 勝美 高津 |
| 製造工程を簡易にすることができると共に、製造コストの低減を図ること。セラミックスヒータ(11)と、一端でセラミックスヒータを保持すると共に他端が金属製のハウジング(14)内に挿入されて固定される金属製の外筒(12)と、セラミックスヒータに接続され、セラミックスヒータに通電するリード線(13)と、を備えるセラミックスヒータ型グローブラグ(1)の製造方法であって、セラミックスヒータにおけるリード線と接続される領域にメタライズ層(116)を形成するステップと、セラミックスヒータの少なくともメタライズ層を、セラミックスヒータとリード線とを接続する接続金具(18)に圧入するステップと、メタライズ層を形成する材料が半溶融状態となる温度で、セラミックスヒータ及び接続金具を加熱して、接続金具とメタライズ層の固層間での物質移動による接合を行うステップと、を有する。 | ||||||
| 13 | CMC BLADE WITH MONOLITHIC CERAMIC PLATFORM AND DOVETAIL | EP14852996 | 2014-09-17 | EP3055509A4 | 2016-11-16 | HOLOWCZAK JOHN E; MCCAFFREY MICHAEL G |
| 14 | 積層セラミック電子部品の製造方法 | JP2013520460 | 2012-04-25 | JPWO2012172871A1 | 2015-02-23 | 浜中 建一; 建一 浜中; 伊藤 英治; 英治 伊藤; 泰治 山下; 岡島 健一; 健一 岡島; 透悟 松井 |
| 【課題】積層体チップの側面に対して所望の絶縁体部の厚みを有することにより、電気特性の安定した信頼性の高い積層セラミック電子部品を得ることを可能とする積層セラミック電子部品の製造方法を提供する。【解決手段】内部電極の両側端縁が側面に露出するように形成された積層体チップを用意する工程と、積層体チップの一方側面および他方側面に、任意の体積の溝を有し体積の溝に絶縁体部用ペーストを充填した金属プレートに押し当て、金属プレートから積層体チップを引き離す際に金属プレートを任意の方向に揺動させて、第1絶縁体部および第2絶縁体部を形成する工程と、さらに第1絶縁体部および第2絶縁体部を形成した積層体チップを焼成する工程とを含む積層セラミック電子部品の製造方法である。絶縁体部用ペーストは、粘度が、500Pa・s〜2500Pa・sであり、無機固形分の含有量C(vol%)が、所定の条件を満たすことを特徴とする。 | ||||||
| 15 | 積層セラミック電子部品の製造方法 | JP2013520460 | 2012-04-25 | JP5621925B2 | 2014-11-12 | 浜中 建一; 建一 浜中; 伊藤 英治; 英治 伊藤; 泰治 山下; 岡島 健一; 健一 岡島; 透悟 松井 |
| 16 | CMC 재료 부품의 제조방법 | KR1020147015328 | 2012-11-22 | KR1020140102204A | 2014-08-21 | 보우일론에릭; 필립프에릭; 라폰드안드레; 라무룩스프랑크 |
| 본 발명은 복합 재료 부품의 제조에 관한 것이고, 이것은 고화된 섬유상 예비성형체를 만들되 예비성형체의 섬유는 탄소 또는 세라믹 섬유로서 열분해 탄소(PyC) 또는 붕소를 도프한 탄소(BC) 중 적어도 하나의 층으로 형성된 계면에 코팅하는 단계; 부분적으로 고밀화된 고화된 섬유 예비성형체를 얻되 부분적으로 고밀화는 계면에 제1 매트릭스 상을 형성하는 것을 포함하고, 제1 매트릭스상은 PyC 또는 BC 중 하나 이상의 층과 교대하는 자기 치유 재료의 복수의 층을 포함하는 단계; 그리고 부분적으로 고밀화 고화된 예비성형체 내에 탄소 및/또는 세라믹 분말을 분산시키고, 용융 규소 또는 대부분의 규소 부품을 위해 형성된 액체 조성물을 침투시킴으로써 고밀화를 지속시키는 단계를 포함한다.
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| 17 | METHOD FOR MANUFACTURING CERAMIC HEATER-TYPE GLOW PLUG, AND CERAMIC HEATER-TYPE GLOW PLUG | EP15862078 | 2015-10-08 | EP3222917A4 | 2017-12-06 | TAKATSU KATSUMI |
| A manufacturing process can be simplified, and manufacturing cost is reduced. A method for manufacturing a ceramic heater-type glow plug (1) that includes: a ceramic heater (11); a metallic outer cylinder (12) that holds the ceramic heater at one end and has the other end inserted in and fixed to a metallic housing (14) ; and lead wire (13) that is connected to the ceramic heater and electrifies the ceramic heater, the method for manufacturing a ceramic heater-type glow plug includes the steps of: forming a metalized layer (116) in a region of the ceramic heater that is connected to the lead wire; press-inserting at least the metalized layer of the ceramic heater in a connection fitting (18) that connects the ceramic heater and the lead wire; and heating the ceramic heater and the connection fitting at a temperature at which a material for forming the metalized layer is brought into a semi-molten state and joining by mass transfer between the connection fitting and a solid layer of the metalized layer. | ||||||
| 18 | PROCEDE DE FABRICATION DE PIECE EN MATERIAU CMC | EP12806551.3 | 2012-11-22 | EP2785665B1 | 2017-11-22 | BOUILLON, Eric; PHILIPPE, Eric; LAFOND, André; LAMOUROUX, Franck |
| 19 | METHOD FOR MANUFACTURING CERAMIC HEATER-TYPE GLOW PLUG, AND CERAMIC HEATER-TYPE GLOW PLUG | EP15862078.1 | 2015-10-08 | EP3222917A1 | 2017-09-27 | TAKATSU, Katsumi |
A manufacturing process can be simplified, and manufacturing cost is reduced. A method for manufacturing a ceramic heater-type glow plug (1) that includes: a ceramic heater (11); a metallic outer cylinder (12) that holds the ceramic heater at one end and has the other end inserted in and fixed to a metallic housing (14) ; and lead wire (13) that is connected to the ceramic heater and electrifies the ceramic heater, the method for manufacturing a ceramic heater-type glow plug includes the steps of: forming a metalized layer (116) in a region of the ceramic heater that is connected to the lead wire; press-inserting at least the metalized layer of the ceramic heater in a connection fitting (18) that connects the ceramic heater and the lead wire; and heating the ceramic heater and the connection fitting at a temperature at which a material for forming the metalized layer is brought into a semi-molten state and joining by mass transfer between the connection fitting and a solid layer of the metalized layer. |
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| 20 | PROCEDE DE FABRICATION DE PIECE EN MATERIAU CMC | EP12806551.3 | 2012-11-22 | EP2785665A1 | 2014-10-08 | BOUILLON, Eric; PHILIPPE, Eric; LAFOND, André; LAMOUROUX, Franck |
| The invention relates to the manufacture of a composite material part, includes the steps of: creating a consolidated fibrous preform, the fibers of the preform being carbon or ceramic fibers and being coated with an interphase formed of at least one pyrolytic carbon (PyC) or boron-doped carbon (BC) layer; obtaining a partially densified, consolidated fibrous preform, the partial densification including the formation, on the interphase, of a first matrix phase including a plurality of layers of self-healing material alternating with one or more PyC or BC layers; and pursuing densification by scattering carbon and/or ceramic powder within the partially densified, consolidated preform and permeating with fused silicon or a liquid composition predominantly formed of silicon. | ||||||
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