专利检索_ .陶瓷加热层压或与其他陶瓷制品的加热法连接相关的加工特征专利检索_ .陶瓷加热层压或与其他陶瓷制品的加热法连接相关的加工特征专利检索查询

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序号	专利名	申请号	申请日	公开（公告）号	公开（公告）日	发明人
141	Composite articles made by process for joining bronze part and silicon carbide ceramic part	US13172274	2011-06-29	US08361634B2	2013-01-29	Hsin-Pei Chang; Wen-Rong Chen; Huann-Wu Chiang; Cheng-Shi Chen; Wen-Feng Hu
A process for joining a bronze part and a silicon carbide ceramic part comprising: providing a bronze part, a SiC ceramic part, a Al foil and a Ni foil; placing the SiC ceramic part, the Al foil, the Ni foil, and the bronze part into a mold, the Al foil and the Ni foil located between the SiC ceramic part and the bronze part, the Al foil abutting against the SiC ceramic part, the Ni foil abutting against the bronze part and the Al foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the bronze part, the SiC ceramic part, the Al foil, and the Ni foil at least until the bronze part, the SiC ceramic part, the Al foil and the Ni foil form a integral composite article.
142	Composite articles made by process for joining stainless steel part and titanium carbide ceramic part	US13158572	2011-06-13	US08247081B2	2012-08-21	Hsin-Pei Chang; Wen-Rong Chen; Huann-Wu Chiang; Cheng-Shi Chen; Wen-Feng Hu
A process for joining a stainless steel part and a titanium carbide ceramic part comprising: providing a SUS part, a TiC ceramic part, a Ti foil and a Fe foil; placing the TiC ceramic part, the Ti foil, the Fe foil, and the SUS part into a mold, the Ti foil and the Fe foil located between the TiC ceramic part and the SUS part, the Ti foil abutting the TiC ceramic part, the Fe foil abutting the SUS part and the Ti foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part, the TiC ceramic part, the Ti foil, and the Fe foil at least until the SUS part, the TiC ceramic part, the Ti foil and the Fe foil form a integral composite article.
143	PROCESS FOR JOINING BRONZE PART AND SILICON CARBIDE CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME	US13172274	2011-06-29	US20120148868A1	2012-06-14	HSIN-PEI CHANG; WEN-RONG CHEN; HUANN-WU CHIANG; CHENG-SHI CHEN; WEN-FENG HU
A process for joining a bronze part and a silicon carbide ceramic part comprising: providing a bronze part, a SiC ceramic part, a Al foil and a Ni foil; placing the SiC ceramic part, the Al foil, the Ni foil, and the bronze part into a mold, the Al foil and the Ni foil located between the SiC ceramic part and the bronze part, the Al foil abutting against the SiC ceramic part, the Ni foil abutting against the bronze part and the Al foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the bronze part, the SiC ceramic part, the Al foil, and the Ni foil at least until the bronze part, the SiC ceramic part, the Al foil and the Ni foil form a integral composite article.
144	PROCESS FOR JOINING STAINLESS STEEL PART AND TITANIUM CARBIDE CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME	US13158572	2011-06-13	US20120100388A1	2012-04-26	HSIN-PEI CHANG; WEN-RONG CHEN; HUANN-WU CHIANG; CHENG-SHI CHEN; WEN-FENG HU
A process for joining a stainless steel part and a titanium carbide ceramic part comprising: providing a SUS part, a TiC ceramic part, a Ti foil and a Fe foil; placing the TiC ceramic part, the Ti foil, the Fe foil, and the SUS part into a mold, the Ti foil and the Fe foil located between the TiC ceramic part and the SUS part, the Ti foil abutting the TiC ceramic part, the Fe foil abutting the SUS part and the Ti foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part, the TiC ceramic part, the Ti foil, and the Fe foil at least until the SUS part, the TiC ceramic part, the Ti foil and the Fe foil form a integral composite article.
145	Ceramic multilayer substrate and method for manufacturing the same	US11738658	2007-04-23	US07655103B2	2010-02-02	Osamu Chikagawa
In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including an external terminal electrode to produce a ceramic multilayer substrate having the ceramic chip electronic component inside, a paste layer is disposed in advance between the ceramic chip electronic component and the green ceramic stack, and these three are fired.
146	Method for manufacturing multilayer ceramic electronic element	US11611552	2006-12-15	US07547370B2	2009-06-16	Shingo Okuyama; Hiroyoshi Takashima; Akira Hashimoto; Shinichi Kokawa
A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.
147	Method of producing a ceramic laminate	US10123206	2002-04-17	US07468112B2	2008-12-23	Kazuhide Sato; Hidekazu Hattori; Ikuo Ito; Syouichi Takenouchi; Toshiaki Kamiya
A high reliability ceramic laminate suppresses delamination and cracks. Wide ceramic sheets are temporarily laminated by heat and pressure to form a pre-laminate which is cut to form a unit body. Unit bodies are laminated to obtain a ceramic laminate. Dewaxing removes not less than 90% of a binder resin before the ceramic laminate is sintered.
148	CERAMIC SUBSTRATE PRODUCTION PROCESS AND CERAMIC SUBSTRATE PRODUCED USING THE PROCESS	US11862722	2007-09-27	US20080308976A1	2008-12-18	Yuki ITO; Osamu CHIKAGAWA; Tetsuya IKEDA
A process for producing a multilayered ceramic substrate having a step portion of a desired shape does not require complicated process steps and equipment. An auxiliary-layer-lined unfired ceramic body, which has a step portion in a principal surface thereof, has an unfired ceramic body and an auxiliary layer which is adhered to one principal surface of the unfired ceramic body and which is made of a material that is substantially unsinterable at a temperature at which the unfired ceramic body is fired. The auxiliary-layer-lined unfired ceramic body is fired at a temperature at which the unfired ceramic body is sinterable but the auxiliary layer is substantially unsinterable, while the auxiliary layer remains adhered to the unfired ceramic body. A pressing operation is performed by using a die having a projection placed on the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer, so that the step portion, having a shape corresponding to the outer shape of the die projection, is formed in the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer.
149	CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME	US11738658	2007-04-23	US20070184251A1	2007-08-09	Osamu CHIKAGAWA
In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including an external terminal electrode to produce a ceramic multilayer substrate having the ceramic chip electronic component inside, a paste layer is disposed in advance between the ceramic chip electronic component and the green ceramic stack, and these three are fired.
150	Method of producing a composite sheet and method of producing a laminate by using the composite sheet	US10652890	2003-08-28	US07018494B2	2006-03-28	Shinichi Suzuki; Koichi Nagata; Takayuki Ikeuchi; Yuji Tanaka; Yasuhiro Sasaki; Shigeki Yamada; Yasuhiko Yoshihara; Masamitsu Onitani
A method of producing a composite sheet in which a through hole formed in a predetermined portion of the first ceramic sheet is buried with a different kind of sheet having substantially the same thickness as the first ceramic sheet, such as a resin sheet a metal sheet or a ceramic sheet of a material different from that of the first ceramic sheet. A first method comprises a step of preparing a first ceramic sheet from a ceramic powder, and a different kind of sheet; a step of forming a through hole in a predetermined portion of the first ceramic sheet; a step of laminating the different kind of sheet on the ceramic sheet in which the through hole is formed; and a step of preparing a composite sheet by pressing the portion of the first ceramic sheet where the through hole is formed from the side of the different kind of sheet, such that the first ceramic sheet and the different kind of sheet are integrated together. A second method comprises a step of preparing a first ceramic sheet and a different kind of sheet, and laminating the first ceramic sheet and the different kind of sheet one upon the other; and a step of preparing a composite sheet by pressing a predetermined portion of the laminate from the side of the different kind of sheet, such that the pressed portion of the different kind of sheet is transferred onto the side of the first ceramic sheet to integrate the first ceramic sheet and the different kind of sheet together. A further method is for producing a laminate by laminating the obtained composite sheet on other first ceramic sheet or on other composite sheet.
151	Aluminum nitride sintered body, ceramic substrate, ceramic heater and electrostatic chuck	US10442967	2003-05-22	US06929874B2	2005-08-16	Yasuji Hiramatsu; Yasutaka Ito
The object of the present invention is to provide an aluminum nitride sintered body which has excellent mechanical strength and in which ceramic particles is prevented from coming off from the surface and/or side thereof and generation of free particles is suppressed. The aluminum nitride sintered body of the present invention is wherein it contains sulfur.
152	Translucent ceramic, method of producing the same and optical devices	US10969190	2004-10-21	US20050104265A1	2005-05-19	Nobuhiko Tanaka; Yukio Higuchi; Masayoshi Katsube; Mitsuru Sube
A ceramic material powder for a translucent ceramic is molded with a binder, and the resulting green compact is embedded in a ceramic powder having the same composition with the ceramic material powder. After removing the binder, the green compact embedded in the ceramic powder is fired in an atmosphere having an oxygen concentration higher than that in the removal procedure of the binder and thereby yields a translucent ceramic represented by Formula I: Ba{(SnuZr1-u)xMgyTaz}vOw, Formula II: Ba(ZrxMgyTaz)vOw or Formula III: Ba{(SnuZr1-u)x(ZntMg1-t)yNbz}vOw. The translucent ceramic has a refractive index of 1.9 or more and is paraelectric.
153	Ceramic heater and ceramic joined article	US10363310	2002-07-08	US20050045618A1	2005-03-03	Yasutaka Ito
A ceramic heater capable of stably supporting a semiconductor safer and evenly heating the whole of a semiconductor wafer or the like without generating any warp in the semiconductor wafer or the like. The ceramic heater includes a disk-like ceramic substrate, a heating element formed on a surface of or inside the ceramic substrate, and through holes for letting lifter pins pass through the ceramic substrate. The number of the formed through holes is three or more, and the through holes are formed in an area whose distance from the center of the ceramic substrate is ½ or more of the distance from the center to the outer edge of the ceramic substrate.
154	Method for manufacturing multilayer ceramic electronic element	US10925447	2004-08-25	US20050016661A1	2005-01-27	Shingo Okuyama; Hiroyoshi Takashima; Akira Hashimoto; Shinichi Kokawa
A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.
155	Greensheet carriers and processing thereof	US10411906	2003-04-11	US06790515B2	2004-09-14	John U. Knickerbocker; Govindarajan Natarajan
A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.
156	Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets	US10092966	2002-03-05	US06773533B2	2004-08-10	Hiroomi Hanai
A manufacturing method of a ceramic green sheet comprising steps of; forming a predetermined electrode pattern on an adhesive layer separable by being heated or an adhesive layer separable by being cured with UV of a carrier sheet, wherein the carrier sheet comprising the separable adhesive layer on one side of a base film, and forming a ceramic green sheet with a ceramic slurry on the separable adhesive layer with the electrode pattern formed thereon. The electrodes in the ceramic green sheet obtained may be formed with good patterning accuracy and the carrier sheet may easily separated after formation of the ceramic green sheet.
157	Substrate and production method therefor	US10182366	2002-07-26	US06762496B2	2004-07-13	Reo Yamamoto; Yoshihide Kamiyama; Yuichiro Minabe
A sintered aluminum nitride substrate which has a via hole and an internal electrically conductive layer, having high thermal conductivity and high adhesion strength between the sintered aluminum nitride substrate and the internal electrically conductive layer or the via hole and having other excellent properties. The substrate comprising an internal electrically conductive layer, at least one electrically conductive via hole formed between the internal electrically conductive layer and at least one surface of the substrate, wherein the thermal conductivity of the aluminum nitride sintering product at 25° C. is 190 W/mK or more, and the adhesion strength between the aluminum nitride sintering product and the internal electrically conductive layer is 5.0 kg/mm2 or more.
158	Aluminum nitride sintered body, method for producing aluminum nitride sintered body, ceramic substrate and method for producing ceramic substrate	US10181724	2002-09-27	US20040097359A1	2004-05-20	Yasuji Hiramatsu; Yasutaka Ito
The purpose of the present invention is to provide a method for manufacturing a ceramic substrate hardly causing cracks and damages and the like attributed to pushing pressure and the like since the strength of the above-mentioned ceramic substrate is higher than that of a conventional one even in the case of manufacturing a large size ceramic substrate capable of placing a semiconductor wafer with a large diameter and the like. The present invention is to provide a method for manufacturing a ceramic substrate having a conductor formed on the surface thereof or internally thereof, including the steps of: firing a formed body containing a ceramic powder to produce a primary sintered body; and performing an annealing process to the primary sintered body at a temperature of 1400null C. to 1800null C., after the preceding step.
159	Holding material for catalytic converter and method for producing the same	US10400529	2003-03-28	US20030185724A1	2003-10-02	Toshiyuki Anji; Masafumi Tanaka; Tadashi Sakane; Takahito Mochida
A holding material for a catalytic converter is interposed in a gap between a catalyst carrier and a metal casing receiving the catalyst carrier. The holding material includes a mat including alumina fiber and mullite fiber, wherein the alumina fiber and the mullite fiber are unitarily collected to form the holding material having a predetermined thickness.
160	Method of fabricating a ceramic stack structure	US10376299	2003-03-03	US20030168784A1	2003-09-11	Akio Iwase; Takeshi Matsui
A method of fabricating a ceramic stack structure having dielectric layers which are not easily cracked or delaminated is disclosed. In fabricating a ceramic stack structure having a plurality of dielectric layers and a plurality of internal electrode layers stacked alternately with each other, a carrier film (20) is prepared and a plurality of internal electrode print portions (21) are formed. A large print portion (225) is formed in such a manner as to cover the internal electrode print portions (21). The large print portion (225) is dried and a coat layer (23) is formed in such a manner as to smooth out the unevenness of the surface of the large print portion (225). The large print portion (225) is removed from the carrier film (20) and punched to produce an unsintered unit. The unsintered unit is punched while at the same time stacking and attaching the particular unsintered unit on another unsintered unit under pressure. This process is repeated to produce an unsintered stack body including a plurality of the unsintered units. The unsintered stack body is sintered into a ceramic stack structure.

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