序号 | 专利名 | 申请号 | 申请日 | 公开(公告)号 | 公开(公告)日 | 发明人 |
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121 | JPH06502379A - | JP51659591 | 1991-07-12 | JPH06502379A | 1994-03-17 | |
122 | Carbon ceramic friction disks and process for their preparation | EP10197447.5 | 2010-12-30 | EP2472136B1 | 2015-05-27 | Güther, Hans-Michael; Persi, Luigi; Koch, Christoph; Orlandi, Marco; Kahler, Michael |
123 | PROCESS FOR PRODUCING CERAMIC SUBSTRATE | EP06730501.1 | 2006-03-29 | EP1873131B1 | 2014-07-16 | IKEDA, Tetsuya c/o Murata Manufacturing Co., Ltd.; CHIKAGAWA, Osamu c/o Murata Manufacturing Co., Ltd; ITO, Yuki c/o Murata Manufacturing Co., Ltd., |
124 | Process for making inorganic sheet | EP12290361.0 | 2012-10-22 | EP2722143A1 | 2014-04-23 | Zhang, Wen; Gasgnier, Gilles; Sevagen, Alexandre |
Methods for making an inorganic sheet (7), a sintered ceramic sheet and a sintered multilayered ceramic composite, an inorganic sheet (7), sintered ceramic sheet and a sintered multilayered ceramic composite obtainable by such methods, and an apparatus configured to carry out such methods. |
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125 | SUBSTRATE AND PRODUCTION METHOD THEREFOR | EP01999133.0 | 2001-11-28 | EP1339271B1 | 2011-07-27 | Yamamoto, Reo, c/o Tokuyama Corporation; Kamiyama, Yoshihide, c/o Tokuyama Corporation; Minabe, Yuichiro, c/o Tokuyama Corporation |
An aluminum nitride substrate having a via hole (3) and an inner conductive layer (2), wherein an aluminum nitride sintered body has a high thermal conductivity, has a high bonding strength to the layer (2) and the via hole (3), and are excellent in other properties. The substrate comprises a conductor layer (2) formed thereinside, and an aluminum nitride sintered body formed with at least one conductive via hole (3) between the inner conductive layer (2) and one surface of the substrate, characterized in that the aluminum nitride sintered body has a thermal conductivity at 25°C of at least 190 W/mK and a bonding strength to the inner conductive layer (2) of at least 5.0 kg/mm2. | ||||||
126 | PROCESS FOR PRODUCING CERAMIC SUBSTRATE, AND CERAMIC SUBSTRATE | EP06730501 | 2006-03-29 | EP1873131A4 | 2010-10-20 | IKEDA TETSUYA; CHIKAGAWA OSAMU; ITO YUKI |
127 | DIELECTRIC PORCELAIN COMPOSITION AND ELECTRONIC PARTS | EP01974760.9 | 2001-10-10 | EP1262467B1 | 2007-07-25 | KOBAYASHI, Hisashi; UCHIDA, Tomoko; SATO, Shigeki; NOMURA, Takeshi |
A dielectric porcelain composition which comprises a main component comprising barium titanate, a first auxiliary component comprising an AE oxide (wherein AE represents at least one selected from among Mg, Ca, Ba and Sr) and a second auxiliary component comprising an R oxide (wherein R represents at least one selected from among Y, Dy, Ho and Er), wherein the amounts of the first auxiliary component and the second auxiliary component relative to 100 moles of the main component are 0 mole < the first auxiliary component < 0.1 mole and 1 mole < the second auxiliary component < 7 mole, respectively. The composition exhibits an elevated relative permittivity, can retain initial insulation resistance for a long period of time, exhibits a capacity-temperature characteristic satisfying the X8R characteristic of EIA specification, and can be subjected to a firing treatment in a reducing atmosphere. | ||||||
128 | SUBSTRATE AND PRODUCTION METHOD THEREFOR | EP01999133 | 2001-11-28 | EP1339271A4 | 2006-10-11 | YAMAMOTO REO; KAMIYAMA YOSHIHIDE; MINABE YUICHIRO |
An aluminum nitride substrate having a via hole (3) and an inner conductive layer (2), wherein an aluminum nitride sintered body has a high thermal conductivity, has a high bonding strength to the layer (2) and the via hole (3), and are excellent in other properties. The substrate comprises a conductor layer (2) formed thereinside, and an aluminum nitride sintered body formed with at least one conductive via hole (3) between the inner conductive layer (2) and one surface of the substrate, characterized in that the aluminum nitride sintered body has a thermal conductivity at 25°C of at least 190 W/mK and a bonding strength to the inner conductive layer (2) of at least 5.0 kg/mm2. | ||||||
129 | GRAPHITE ARTICLE HAVING PREDETERMINED ANISOTROPIC CHARACTERISTICS AND PROCESS THEREFOR | EP02763890.7 | 2002-04-01 | EP1383645A1 | 2004-01-28 | MERCURI, Robert, Angelo; NORLEY, Julian; SMALC, Martin, David |
The invention presented is a graphite article having predetermined anisotropic characteristics, as well as a process for preparing the article. More particularly, the article is prepared by a process involving determining the desired anisotropic characteristics for a finished flexible graphite article (FIg. 1a); intercalating and then exfoliating flakes of graphite to form exfoliated graphite particles; forming a substrate graphite article by compressing the exfoliated graphite particles into a coherent article formed of graphene layers; and producing a controlled directional alignment of the graphene layers in the substrate graphite article to provide a finished graphite article having the desired anisotropic ratio. The article may be embossed and the relative amount of structure in an embossed flexible graphite wall can and will lead to differing anisotropic properites. The embossing apparatus (10) comprises two opposed elements (20) and (30). | ||||||
130 | Holding material for catalytic converter and method for producing the same | EP03007017.1 | 2003-03-27 | EP1348841A2 | 2003-10-01 | Anji, Toshiyuki, Nichias Corporation; Tanaka, Masafumi, Nichias Corporation; Sakane, Tadashi, Nichias Corporation, Hamamatsu; Mochida, Takahito, Nichias Corporation, Hamamatsu |
A holding material (3) for a catalytic converter is interposed in a gap between a catalyst carrier (1) and a metal casing (2) receiving the catalyst carrier. The holding material (3) includes a mat including alumina fiber (3A) and mullite fiber (3B), wherein the alumina fiber (3A) and the mullite fiber (3B) are unitarily collected to form the holding material (3) having a predetermined thickness. |
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131 | ALUMINUM NITRIDE SINTERED BODY, METHOD FOR PRODUCING ALUMINUM NITRIDE SINTERED BODY, CERAMIC SUBSTRATE AND METHOD FOR PRODUCING CERAMIC SUBSTRATE | EP01997469.0 | 2001-11-22 | EP1340732A1 | 2003-09-03 | HIRAMATSU, Yasuji; ITO, Yasutaka |
The purpose of the present invention is to provide a method for manufacturing a ceramic substrate hardly causing cracks and damages and the like attributed to pushing pressure and the like since the strength of the above-mentioned ceramic substrate is higher than that of a conventional one even in the case of manufacturing a large size ceramic substrate capable of placing a semiconductor wafer with a large diameter and the like. The present invention is to provide a method for manufacturing a ceramic substrate having a conductor formed on the surface thereof or internally thereof, including the steps of: firing a formed body containing a ceramic powder to produce a primary sintered body; and performing an annealing process to the primary sintered body at a temperature of 1400°C to 1800°C, after the preceding step. |
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132 | SUBSTRATE AND PRODUCTION METHOD THEREFOR | EP01999133.0 | 2001-11-28 | EP1339271A1 | 2003-08-27 | Yamamoto, Reo, c/o Tokuyama Corporation; Kamiyama, Yoshihide, c/o Tokuyama Corporation; Minabe, Yuichiro, c/o Tokuyama Corporation |
The object of the present invention is to provide a sintered aluminum nitride substrate which has a via hole and an internal electrically conductive layer, having high thermal conductivity and high adhesion strength between the sintered aluminum nitride substrate and the internal electrically conductive layer or the via hole and having other excellent properties. The substrate according to the invention comprising an internal electrically conductive layer, at least one electrically conductive via hole formed between the internal electrically conductive layer and at least one surface of the substrate, wherein the thermal conductivity of the aluminum nitride sintering product at 25°C is 190 W/mK or more, and the adhesion strength between the aluminum nitride sintering product and the internal electrically conductive layer is 5.0 kg/mm2 or more. |
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133 | Metal/ceramic bonding article | EP02007405.0 | 2002-03-28 | EP1298108A2 | 2003-04-02 | Tsukaguchi, Nobuyoshi; Nakamura, Jyunji; Wada, Masahiko; Namioka, Makoto; Kimura, Masami |
There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 µm and which is 250 µm or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25 % or more of the thickness of the metal plate. |
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134 | Ceramic product | EP91300727.4 | 1991-01-30 | EP0441528B1 | 1996-10-02 | Clegg, William John; Kendall, Kevin |
135 | JOINING METHODS FOR CERAMIC COMPOSITE BODIES | EP91917956.0 | 1991-07-12 | EP0538417A1 | 1993-04-28 | WANG, James, Cheng-Koung; CLAAR, Terry, Dennis; ROACH, Philip, Joseph; SCHIROKY, Gerhard, Hans |
Nouveau procédé d'assemblage d'au moins un premier corps auto-porteur avec au moins un second corps auto-porteur d'un composition similaire ou différente de celle dudit premier corps auto-porteur au moins, et nouveaux produits résultant d'un tel assemblage. Dans certains de ces aspects les plus spécifiques, l'invention concerne différentes techniques d'assemblage de corps composites matriciels céramiques avec d'autres corps composites matriciels céramiques de caractéristiques similaires, et d'assemblage de corps composites matriciels céramiques avec des corps présentant des caractéristiques différentes (par exemple des métaux). On produit les corps composites matriciels céramiques de l'invention par infiltration réactive d'un métal de base fondu dans un lit ou dans une masse contenant au moins une matière servant de source de bord et/ou une matière servant de source de carbone et/ou une matière servant de source d'azote, et, facultativement une ou plusieurs matières de remplissage inerte. | ||||||
136 | Method of producing a multilayer material having a gradually changing composition | EP87111403.9 | 1987-08-06 | EP0255954A2 | 1988-02-17 | Niino, Masayuki; Yatsuyanagi, Nobuyuki; Ikeuchi, Jun; Sata, Nobuhiro; Hirano, Tohru; Sumiyoshi, Kanichiro |
A method of producing a material having a layer of ceramic as a first component, a layer of a metal as a second component and an intermediate layer lying between said layers and including said first and second components in continuously gradient ratios so that the properties of the material may change continuously; including a step to form said intermediate layer by igniting the mixture of powders of metallic and nonmetallic constitutive elements of said ceramic and powder of said metal and causing synthetic reaction of the powder mixture. |
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137 | SURFACE TREATMENT METHOD FOR CERAMIC | US15636661 | 2017-06-29 | US20180148383A1 | 2018-05-31 | Li-Wen Weng; Chun-Chieh Tseng; Yau-Chia Liu; Chih-Lung Lin |
A ceramic surface treatment method includes the following steps. An antibacterial ion and a sol-gel solution containing a silane compound are mixed to form a treatment solution. Next, a ceramic substrate is placed in the treatment solution to perform a treatment bonding reaction such that the antibacterial ion in the treatment solution can be grafted to the surface of the ceramic substrate via the silane compound. Next, a sintering condensation reaction is performed on the ceramic substrate after the treatment bonding reaction to form a protective film on the surface of the ceramic substrate. The protective film is attached to the surface of the ceramic substrate via a hydrophobic layer, and the antibacterial ion is spread on the hydrophobic layer. | ||||||
138 | CERAMIC JOINED BODY, HEAT-RESISTANT COMPONENT AND METHOD FOR MANUFACTURING CERAMIC JOINED BODY | US14783644 | 2014-03-19 | US20160068447A1 | 2016-03-10 | Mingxu HAN |
A ceramic assembly is provided with a first ceramic component having a first surface, a second ceramic component having a second surface, and a joining section comprising a CVD ceramic which fills the region where the first surface and the second surface face each other. | ||||||
139 | METHOD FOR PRODUCING BONDED BODY | US14231829 | 2014-04-01 | US20140290852A1 | 2014-10-02 | Yasuyuki OOKOUCHI; Yasunori KAWAMOTO |
A method for producing a bonded body of ceramic and metal bodies includes stacking a ceramic body, metal body, gap layer capable of preventing oxidation and hindering heat conduction, first intermediate layer and second intermediate layer with the gap layer between the ceramic body and the metal body in the stacking direction. The first intermediate layer is between the ceramic body and gap layer, and the second intermediate layer is between the gap layer and metal body, linear expansion coefficients of the first and second intermediate layers being between those of the ceramic body and the metal body. Diffusion bonding is performed between the ceramic body and the first intermediate layer, and between the metal body and the second intermediate layer simultaneously. The gap layer is then removed from between the first and second intermediate layers. The first and second intermediate layers are then bonded to each other. | ||||||
140 | Method of joining superconductor materials | US13490429 | 2012-06-06 | US08808492B2 | 2014-08-19 | Kun-Ping Huang; Chih-Chen Chang; Yu-Tse Hsieh; Chih-Wei Luo; Chih-Hsiang Su; Wen-Yen Tzeng |
A method of joining superconductor materials is described. A microwave chamber including a first heat absorption plate and a second heat absorption plate corresponding to the first absorption plate is provided. A first superconductor material and a second superconductor material are disposed between the first heat absorption plate and the second heat absorption plate in the microwave chamber. The first superconductor material and the second superconductor material have an overlapping region therebetween, and a pressure is applied to the first heat absorption plate and the second heat absorption plate. Microwave power is supplied to the microwave chamber. The first heat absorption plate and the second heat absorption plate transform the microwave power into thermal energy so as to join the first superconductor material and the second superconductor material at the overlapping region. |