| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 121 | ION-SENSITIVE SENSOR ELEMENT | PCT/DE2011000392 | 2011-04-06 | WO2011127905A8 | 2011-12-15 | PARTSCH UWE; FELLER CLAUDIA; KRETZSCHMAR CHRISTEL; REINHARDT KATHRIN |
| The invention relates to ion-sensitive sensor elements which can be used to determine the amounts of ions contained in an environment or a measurement medium, for example ions of hydrogen, sodium, silver or ammonium. The invention is suitable, in particular, for determining the pH value. At least one ion-selective electrode and at least one reference electrode are arranged on a substrate on a sensor element according to the invention. The ion- selective electrode(s) and the reference electrode(s) are connected in an electrically conductive manner to contact elements, which are arranged on the surface of the substrate, using electrical conductor tracks and the ion- selective electrode(s) is/are formed with at least one metal surface which is connected to an electrical conductor track and is covered with an ion-selective membrane in the direction of the measurement environment. The substrate is formed from a ceramic material which completely surrounds the electrical conductor tracks to which the ion-selective electrode(s) and the reference electrode(s) are connected and are connected to contact elements in an electrically conductive manner. | ||||||
| 122 | IMPROVED PROCESS FOR PRESSURELESS CONSTRAINED SINTERING OF LOW TEMPERATURE CO-FIRED CERAMIC WITH SURFACE CIRCUIT PATTERNS | PCT/US2007013963 | 2007-06-13 | WO2007149298A2 | 2007-12-27 | WANG CARL B; SMITH MICHAEL ARNETT |
| This invention relates to a process which produces crack-free, non-camber, distortion-free, zero-shrink, LTCC bodies, composites, modules or packages from precursor green (unfired) laminates of multilayer structure with one or more different dielectric tape chemistries that are patterned with co-fireable thick film circuitry materials such as conductor, via fill, capacitor, inductor, or resistor for each tape layer including both top and bottom surface tape layers in direct contact with the sacrificial release tape. | ||||||
| 123 | CERAMIC MULTI-LAYER COMPONENT AND METHOD FOR THE PRODUCTION THEREOF | PCT/DE2004002167 | 2004-09-29 | WO2005034255A3 | 2006-05-04 | FLORIAN HEINZ; OTTLINGER MARION; SEDLMAIER PETER |
| The invention relates to a ceramic multi-layer component comprising a stack of alternating ceramic layers and electrode layers containing copper, which are used as internal electrodes and which are connected to external electrodes. The invention also relates to a method for the production of a component. According to the invention, the external contacts contain metallic copper. The external contacts are not oxidised in the defining area which is adjacent to the defining surface between the external contacts and the ceramic layers and the ceramic layer material is not reduced. The adhesive strength of the external contacts on the stack exceeds a value of 50 N. The de-binding process is carried out at a comparatively low temperature at a maximum of 300 °C in a moist nitrogenous atmosphere | ||||||
| 124 | JUNCTION PROCESS FOR A CERAMIC MATERIAL AND A METALLIC MATERIAL WITH THE INTERPOSITION OF A TRANSITION MATERIAL | PCT/IB2005052434 | 2005-07-20 | WO2006024971A8 | 2006-04-20 | LIBERA STEFANO; VISCA ELISEO |
| The invention refers to a method useful for obtaining junctions having high qualities of mechanical resistance and capabilities of heat conduction between materials with different physical properties, and in particular ceramic/metal junctions or ceramic/metal composites in which the different thermal expansion coefficient entails remarkable stresses in the interface both during the junction process and their industrial application. The issues solved with the proposed method are the metal's difficulty of wetting the surfaces to be coupled and the general low mechanical resistance to tensile stress of ceramics or ceramic compounds. The first issue is solved with the application of a Titanium-base alloy that, by combining with the ceramic at a surface level enables metal to wet the surface. The second issue is solved by increasing the specific surface of the ceramic or compound, machining it through long-pitch multi-start thread. | ||||||
| 125 | GREEN CERAMIC INSERT, CERAMIC INSERT, CERAMIC GREEN BODY OR GREEN BODY COMPOSITE AND CERAMIC LAMINATED COMPOSITE PRODUCED THEREBY | PCT/DE0203699 | 2002-09-30 | WO03034446A2 | 2003-04-24 | DE LA PRIETA CLAUDIO; HACHTEL ANDREAS; SCHULTE THOMAS; GLANZ UWE; HIRTH ERHARD |
| The invention relates to a green ceramic insert (20) comprising a green ceramic body (14) provided with a recess (15). Said recess (15) crosses the ceramic body (14) and is filled with a paste (15') which can be converted into an electrical feedthrough. The invention also relates to a ceramic insert consisting of a sintered insert (20) of the same green ceramic type. The invention further relates to a ceramic green body (5) or a green body composite (5') which comprises at least one recess (11), in areas, in which one of the above-mentioned green ceramic inserts (20) is placed. Disclosed is also a ceramic laminated composite consisting of a sintered green body (5) or green body composite (5')of the same green ceramic type. According to the invention, the ceramic insert (20) is especially connected to the laminated composite in a material fit. A conductive paste (16) which is converted into a strip conductor by means of sintering is guided on the laminated composite in such a way that it is electrically insulated from the same. Said ceramic insert connects the upper side of the laminated composite to the lower side thereof in an electroconductive manner by means of the electrical feedthrough. | ||||||
| 126 | INTEGRATED MULTILAYERED MICROFLUIDIC DEVICES AND METHODS FOR MAKING THE SAME | PCT/US9923324 | 1999-10-07 | WO0021659A9 | 2000-09-08 | BURDON JEREMY W; HUANG RONG-FONG; WILCOX DAVID; NACLERIO NICHOLAS J; BRISCOE CYNTHIA ANN GORSUCH; GRODZINSKI PIOTR; YU HUINAN; MARRERO ROBERT; GALLAGHER SEAN ROSS; CHAN YUK-TONG; FOLEY BARBARA MCNEIL; DAI XUNHU |
| A multilayered microfluidic device having a substantially monolithic structure is formed by sintering together a plurality of green-sheet layers. The substantially monolithic structure has an inlet port for receiving fluid, an outlet port for releasing fluid, and an interconnection between the inlet port and the outlet port. The substantially monolithic structure may also include a variety of components to enable useful interaction with the fluid, such as electrically conductive pathways, heaters, fluid sensors, fluid motion transducers, and optically transmissive portions. The components are preferably fabricated using thick-film or green-sheet technology and are preferably co-fired with and sintered to the green-sheet layers to become integral with the substantially monolithic structure. By using an adhesive to bind the green-sheet layers together, the multilayered microfluidic device may be fabricated without the application of high pressures. Selection of an adhesive with a polymer that decomposes at a higher temperature than the binder present in the green-sheet layers promotes stability of the interfaces during the firing process and promotes void-free sintering within the interfacial regions. | ||||||
| 127 | CORROSION-RESISTANT COMPONENTS AND METHODS OF MAKING | EP16810521.1 | 2016-11-16 | EP3377318A1 | 2018-09-26 | SIMPSON, Matthew; DIVAKAR, Ramesh; FILER, Alan |
| A corrosion-resistant component configured for use with a semiconductor processing reactor, the corrosion-resistant component comprising: a) a ceramic insulating substrate; and, b) a corrosion-resistant non-porous layer associated with the ceramic insulating substrate, the corrosion-resistant non-porous layer having a composition comprising at least 15% by weight of a rare earth compound based on total weight of the corrosion-resistant non-porous layer; and, the corrosion-resistant non-porous layer characterized by a microstructure substantially devoid of microcracks and fissures, and having an average grain size of at least about 100 nm and at most about 100 μm. Assemblies including corrosion-resistant components and methods of making are also disclosed. | ||||||
| 128 | METAL-FREE MONOLITHIC EPITAXIAL GRAPHENE-ON-DIAMOND PWB WITH OPTICAL WAVEGUIDE | EP16153822.8 | 2016-02-02 | EP3065515A1 | 2016-09-07 | FINDLEY, David G. |
According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer. A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystallilne diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline silicon carbide surrounded by polycrystalline diamond. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne).
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| 129 | Honeycomb structure | EP10194127.6 | 2010-12-08 | EP2374773B1 | 2016-03-02 | Ido, Takahiko; Koga, Yoshihiro; Asanuma, Takumi; Ito, Takashi |
| 130 | MOLDED ARTICLE | EP11809533.0 | 2011-06-23 | EP2596928B1 | 2016-02-03 | YOSHIOKA Kunihiko; KANEKO Kimihisa; OHMORI Makoto; SUZUKI Kenji |
| A second mold is placed on a planar surface of a first mold having the planar surface, thereby forming a first mold cavity. The first mold cavity is filled with a first material slurry which contains a first material powder, a dispersant, and a gelling agent, so as to mold the slurry, and the molded slurry is caused to set, thereby forming a first molded part on the planar surface of the first mold. A third mold is placed on the planar surface of the first mold from which the second mold is removed and on which the first molded part is formed, thereby forming a second mold cavity. The second mold cavity is filled with a second material slurry which contains a second material powder different in material from the first material powder, a dispersant, and a gelling agent, so as to mold the slurry in such a manner that the slurry comes into contact with the first molded part, and the molded slurry is caused to set, thereby forming a second molded part on the planar surface of the first mold. By this procedure, there can be provided a molded body in which two types of molded parts of different materials are bonded together and which exhibits high bonding strength between the bonding surfaces of the two types of molded parts. | ||||||
| 131 | LAMINATED CERAMIC ELECTRONIC COMPONENT | EP07745061.7 | 2007-06-12 | EP2028664B1 | 2015-12-30 | NISHIZAWA, Yoshihiko |
| 132 | FILM-BONDED STRUCTURE, MANUFACTURING METHOD THEREOF, AND GAS SENSOR | EP15160999.7 | 2015-03-26 | EP2924013A1 | 2015-09-30 | Moriyama, Satoko; Murakami, Mika; Yoshioka, Kunihiko; Sakakibara, Hironori |
A method of the present invention is a method for producing a film laminated structure, including the steps of: (a) preparing a substrate; (b) achieving a state that a mold is charged with a slurry that contains a raw material powder, a gelling agent containing at least two polymerizable organic compounds, and an organic solvent serving as a dispersion medium, and that the substrate is placed at a predetermined position in the mold; (c) molding and hardening the slurry through a polymerization reaction of the gelling agent to combine the substrate and a green film to form a green structure; and (d) firing the green structure to form a film laminated structure, the film laminated structure including a porous film formed from the green film by firing. |
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| 133 | VERFAHREN ZUR HERSTELLUNG EINES KERAMISCHEN SUBSTRATS | EP03783950.3 | 2003-08-04 | EP1525090B1 | 2015-09-30 | ALTHOFF, Anke; GRABNER, Holger |
| 134 | TRANSIENT LIQUID PHASE, PRESSURELESS JOINING OF ALUMINUM NITRIDE COMPONENTS | EP13754902.8 | 2013-02-28 | EP2834839A1 | 2015-02-11 | HARRIS, Jonathan H.; POLESE, Frank J.; TESCH, Robert J.; NOOTENS, Stephen P.; DENESCU, Sorin; BRADBURY, William L.; CLAUSEN, Casey C. |
| A monolithic, hermetic joining or bonding of two or more aluminum nitride ("AIN") ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AIN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y203) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together, in a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing. Such processes can be used to form complex ceramic structures such as a ceramic susceptor used in integrated circuit fabrication. The components can have a plurality of embedded metallized electronic traces which can be electrically interconnected across the interface between the components. | ||||||
| 135 | PROCESS FOR PRODUCING CERAMIC SUBSTRATE | EP06730501.1 | 2006-03-29 | EP1873131B1 | 2014-07-16 | IKEDA, Tetsuya c/o Murata Manufacturing Co., Ltd.; CHIKAGAWA, Osamu c/o Murata Manufacturing Co., Ltd; ITO, Yuki c/o Murata Manufacturing Co., Ltd., |
| 136 | METHOD FOR CONNECTING COMPONENTS AND COMPOSITE STRUCTURE | EP12768735.8 | 2012-08-08 | EP2742016A1 | 2014-06-18 | CHUNG, Hin Yiu Anthony; DOCHNAHL, Axel; STAMPE, Tim; PETZOLD, Werner; REIMANN, Bernd |
| The invention relates to a method for connecting two components (1, 2) having different stiffnesses (E1, E2), comprising: bonding a plate-shaped body (3) onto the component (1) having greater stiffness (E1), the bonding being preferably performed using a joining agent, in particular an adhesive, correcting deformations produced by the bonding on the plate-shaped body (3), and connecting the component (2) having the lower stiffness (E2) to the plate- shaped body (3), in particular by wringing, by anodic bonding or by fusion bonding. The invention also relates to a composite structure (5), which has been produced according to the method and which can serve, for example, as a holding device for a wafer (6). Moreover, the first component (1) can serve as a carrier for the second component (2), e.g. if the latter is embodied as an EUV mirror. | ||||||
| 137 | PROCÉDÉ DE FABRICATION D' UN DISPOSITIF ISOLANT TUBULAIRE ET DISPOSITIF CORRESPONDANT | EP08864788.8 | 2008-10-07 | EP2209615B1 | 2014-04-16 | LECLERCQ, Bérangère; BERNARD, Olivier; POTIER, Alexandre |
| 138 | MOLDED ARTICLE AND PROCESS FOR PRODUCTION OF MOLDED ARTICLE | EP11809533 | 2011-06-23 | EP2596928A4 | 2014-01-15 | YOSHIOKA KUNIHIKO; KANEKO KIMIHISA; OHMORI MAKOTO; SUZUKI KENJI |
| A second mold is placed on a planar surface of a first mold having the planar surface, thereby forming a first mold cavity. The first mold cavity is filled with a first material slurry which contains a first material powder, a dispersant, and a gelling agent, so as to mold the slurry, and the molded slurry is caused to set, thereby forming a first molded part on the planar surface of the first mold. A third mold is placed on the planar surface of the first mold from which the second mold is removed and on which the first molded part is formed, thereby forming a second mold cavity. The second mold cavity is filled with a second material slurry which contains a second material powder different in material from the first material powder, a dispersant, and a gelling agent, so as to mold the slurry in such a manner that the slurry comes into contact with the first molded part, and the molded slurry is caused to set, thereby forming a second molded part on the planar surface of the first mold. By this procedure, there can be provided a molded body in which two types of molded parts of different materials are bonded together and which exhibits high bonding strength between the bonding surfaces of the two types of molded parts. | ||||||
| 139 | Keramische Mehrlagenstruktur und Verfahren zur Herstellung derselben | EP12173735.7 | 2012-06-27 | EP2548734A1 | 2013-01-23 | Haas, Thomas; Schwanke, Dieter; Bittner, Achim; Schmid, Ulrich |
Es wird ein einfaches und kostengünstiges Verfahren zur Herstellung einer keramischen Mehrlagenanordnung unter Verwendung einer ersten Grünfolie (1) enthaltend ein keramisches Material mit den folgenden Schritten angegeben: Ferner wird eine keramische Mehrlagenanordnung herstellbar nach dem obigen Verfahren erläutert.
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| 140 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT | EP11750810.1 | 2011-03-04 | EP2544200A1 | 2013-01-09 | NAKAMURA Akihiro; YAMAMOTO Atsushi; NOMIYA Yuko |
Provided is a ceramic electronic component including a magnetic body part 2 composed of a ferrite material and a conductive part 3 containing Cu as its main constituent, the magnetic body part 2 containing trivalent Fe and divalent elements including at least divalent Ni, and the content of the Fe being 20 to 48% in molar ratio in terms of Fe2O3. The magnetic body part 2 contains Mn in such a way that the ratio of Mn to the total of Fe and Mn is less than 50% in molar ratio each in terms of Mn2O3 and Fe2O3. The magnetic body part 2 and the conductive part 3 are obtained by co-firing in an atmosphere at a pressure equal to or lower than the equilibrium oxygen partial pressure of Cu-Cu2O. Thus, even in the case of co-firing the conductive part 3 containing Cu as its main constituent with the magnetic body part 2, insulating performance can be ensured, and favorable electrical characteristics can be achieved. |
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