The present invention provides a ceramic sheath type part capable of preventing the breaking of a conductive wire rod(2, 2A, 2B, 22) and having a thermal resistance and a thermal shock resistance, and a method of manufacturing the same. In this ceramic sheath type part, a conductive wire rod(2, 2A, 2B, 22) is provided in a protective pipe(1, 41) of silicon nitride or SiAlON so as to extend longitudinally from one end toward the other end thereof, and buried in a filler(3, 20) of reaction sintered silicon nitride. The filler(3, 20) comprises two layers, i.e. a core portion(4) having a low sintering time size variation ratio, and a seal portion(5) constituting a boundary layer between the core portion(4) and the protective pipe(1, 41) and having a sintering time size variation ratio higher than that of the core poriton(4). The conductive wire rod(2) comprises a coil(22) of a metal wire. The coil(22) is formed helically along the whole length thereof, and the winding pitch of the coil(22) is set small, large and small in the mentioned order from a front end portion of a shell of the protective pipe(1, 41) toward a base end portion thereof.

A paste for forming a superconducting ceramic film comprises a powder of a superconducting ceramic material or powders of ingredients which form a superconductive ceramic material by firing, an organic binder and a solvent. The paste is to be utilized in producing a multi-layer superconducting circuit substrate formed of a plurality of insulating layers laminated together and having holes penetrated through the layers with interconnection layers of the superconductive ceramic material being located between the insulating layers and the through holes in the insulating layers being filled with superconductive ceramic material electrically connecting the interconnection layers. The superconductive ceramic material is preferably isolated from the insulating layers by noble metal layers encapsulating the superconductive ceramic material. The superconductive ceramic material itself is either an oxide ceramic material represented by one of the general formulae X_aY_1-aZO_b and (X_1-aY_a)₂ZO_b, where O < a < 1; 3 b b <4; X is at least one element selected from the group of Ba, Ca, Sr and Mg; Y is at least one element selected from the group of Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; and Z is at least one element selected from the group of Cu, Ag, and Au; or is one of the superconducting oxides of the Bi-Sr-Ca-Cu-O and TI-Bi-Sr-Ca-Cu-O systems.

A paste for forming a superconducting ceramic film comprises a powder of a superconducting ceramic material or powders of ingredients which form a superconductive ceramic material by firing, an organic binder and a solvent. The paste is to be utilized in producing a multi-layer superconducting circuit substrate formed of a plurality of insulating layers laminated together and having holes penetrated through the layers with interconnection layers of the superconductive ceramic material being located between the insulating layers and the through holes in the insulating layers being filled with superconductive ceramic material electrically connecting the interconnection layers. The superconductive ceramic material is preferably isolated from the insulating layers by noble metal layers encapsulating the superconductive ceramic material. The superconductive ceramic material itself is either an oxide ceramic material represented by one of the general formulae X_aY_1-aZO_b and (X_1-aY_a)₂ZO_b, where O < a < 1; 3 b b <4; X is at least one element selected from the group of Ba, Ca, Sr and Mg; Y is at least one element selected from the group of Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; and Z is at least one element selected from the group of Cu, Ag, and Au; or is one of the superconducting oxides of the Bi-Sr-Ca-Cu-O and TI-Bi-Sr-Ca-Cu-O systems.

A method for reducing X-Y shrinkage during firing of ceramic bodies in which a flexible constraining layer, which becomes porous during firing, is applied to the ceramic body such that the flexible constraining layer conforms closely to the surface of the unfired ceramic body as the assemblage is fired.

A ceramic-metal friction welded composite body includes a ceramic member (7) formed with an annular recess (6) in an outer circumference of its surface and a metal member (9) joined onto the annular recess (6) of the ceramic member by friction welding. The body may be a ceramic insert case piston in which the crown (7) made of a ceramic material has the annular recess (6). The piston main body (5) made of an aluminium alloy is fixed to the crown by insert casting.

There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate con­tains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

Disclosed is a method of manufacturing a ceramic laminate which is adapted to manufacture a laminated ceramic capacitor, for example. This method comprises the steps of stacking a plurality of ceramic green sheets (41) containing ceramic powder and a first binder on a base and forming a metal paste film (42) containing metal powder and a second binder for providing an internal electrode on an upper major surface of a prescribed one of the ceramic green sheets (41) during the stacking step. In such a method, a junction member (47) containing a solvent which can commonly dissolve the first and second binders is prepared in order to join the plurality of ceramic green sheets with no application of pressure, to be applied between adjacent pairs of the plurality of ceramic green sheets (41), which are stacked with each other. The junction member (47) joins the adjacent pairs of ceramic green sheets with each other through chemical function.

A method for forming superconducting ceramics and other ceramic materials with reduced electrical resistivity which have metal cladding is disclosed using certain blends of particles of the ceramic materials (or their precursors) with polymers and plasticizers and blends of certain conductive metal particles with polymers and plasticizers. In accordance with the invention the blends can be shaped by conventional means, the plasticizer can be removed by extraction and/or volatilization, the polymer can be volatilized, and the ceramic particles can be sintered to yield the desired product.

A monolithic ceramic capacitor which comprises a laminate (4) composed of a plurality of dielectric ceramic layers (1) and internal electrode layers (2) provided between said dielectric ceramic layers, and external electrodes (3) provided at both ends of said laminate and electrically connected to said internal electrode layers (2), said dielectric ceramic layers (1) being a dielectric ceramic containing lead oxide and a reduction inhibitor, and said internal electrode layers (2) being copper or a copper alloy.

Disclosed is a method of manufacturing a ceramic laminate which is adapted to manufacture a laminated ceramic capacitor, for example. This method comprises the steps of stacking a plurality of ceramic green sheets (41) containing ceramic powder and a first binder on a base and forming a metal paste film (42) containing metal powder and a second binder for providing an internal electrode on an upper major surface of a prescribed one of the ceramic green sheets (41) during the stacking step. In such a method, a junction member (47) containing a solvent which can commonly dissolve the first and second binders is prepared in order to join the plurality of ceramic green sheets with no application of pressure, to be applied between adjacent pairs of the plurality of ceramic green sheets (41), which are stacked with each other. The junction member (47) joins the adjacent pairs of ceramic green sheets with each other through chemical function.

A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the intercon­nection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a supercon­ducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

A method for forming superconducting ceramics and other ceramic materials with reduced electrical resistivity which have metal cladding is disclosed using certain blends of particles of the ceramic materials (or their precursors) with polymers and plasticizers and blends of certain conductive metal particles with polymers and plasticizers. In accordance with the invention the blends can be shaped by conventional means, the plasticizer can be removed by extraction and/or volatilization, the polymer can be volatilized, and the ceramic particles can be sintered to yield the desired product.