| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 61 | 功率模块用基板的制造方法及功率模块用基板 | CN201210118770.7 | 2012-04-20 | CN102751201A | 2012-10-24 | 大井宗太郎 |
| 本发明提供一种功率模块用基板的制造方法及功率模块用基板，该功率模块用基板能够多层层叠陶瓷基板与金属板，并使陶瓷基板两侧的金属板成为连接状态，并且难以产生陶瓷基板与金属板之间的剥离或陶瓷基板的裂纹等。在层叠陶瓷基板(2)及金属板(4A、4C、4D、5A、6)时，向陶瓷基板(2)的贯穿孔(11)内插入长于贯穿孔(11)的柱状金属部件(12)，在接合陶瓷基板及金属板时，加压金属部件(12)使其塑性变形，以在金属部件(12)与贯穿孔(11)的内周面之间形成有间隙的状态，通过金属部件(12)使陶瓷基板(2)两侧的金属板(5A、4A、4D)成为连接状态。 | ||||||
| 62 | 碳组件及制造该碳组件的方法 | CN201110100396.3 | 2011-04-20 | CN102234793A | 2011-11-09 | 箕浦诚司; 大桥纯; 伊藤敏树; 石田考二; 小川史仁 |
| 本发明涉及碳组件及制造该碳组件的方法，所述碳组件内部具有孔道且外表面被覆有陶瓷涂层。所述碳组件包括接合在一起的两个碳平板部件。所述孔道由形成在至少一个所述碳平板部件的配合表面上的凹槽和另一所述碳平板部件的与所述凹槽相对向的配合部分限定。包含所述凹槽表面的所述孔道的内表面全部被覆有陶瓷涂层。 | ||||||
| 63 | 绝缘基板及其制造方法 | CN200980110544.0 | 2009-03-19 | CN101981692A | 2011-02-23 | 采野大介; 久幸晃二 |
| 一种绝缘基板(1)，其包括：电绝缘层(2)、形成于电绝缘层(2)的一面并且由导电材料粉末的放电等离子烧结体形成的配线层(3)、和形成于电绝缘层(2)的另一面且由合金粉末或构成金属复合材料的混合粉末的放电等离子烧结体形成的应力缓和层(4)。配线层(3)由从Al粉末、Cu粉末、Ag粉末和Au粉末中选出的1种粉末的放电等离子烧结体形成。应力缓和层(4)由从Al-Si合金粉末、Cu粉末与Mo粉末的混合粉末、Cu粉末与W粉末的混合粉末、Al粉末与SiC粉末的混合粉末以及Si粉末与SiC粉末的混合粉末中选出的1种粉末的放电等离子烧结体形成。根据该绝缘基板，可以得到可防止散热性能的降低、并且实现耐久性的提高的功率模块。 | ||||||
| 64 | 陶瓷基板、陶瓷基板的制造方法和电源模块用基板的制造方法 | CN200880114640.8 | 2008-11-06 | CN101849445A | 2010-09-29 | 殿村宏史; 北原丈嗣; 石塚博弥; 黑光祥郎; 长友义幸 |
| 含有硅的陶瓷基板，该基板表面的二氧化硅和硅的复合氧化物的浓度为2.7Atom％以下。 | ||||||
| 65 | 熔模铸造 | CN200510088103.9 | 2005-07-29 | CN1727097A | 2006-02-01 | J·J·小马钦 |
| 可这样制造一种产品，即，在具有至少部分地对应于所述产品形状的模具壳中提供网状芯元件。将熔融金属材料引入到所述壳中以使其至少部分地渗入所述网状芯元件中。允许所述熔融金属材料固化。破坏性地去除所述壳和所述网状芯元件。所述去除留下了具有一个或多个透气性多孔区域的产品。 | ||||||
| 66 | 陶瓷与金属的接合方法及用该方法接合的陶瓷与金属的接合体 | CN00802382.4 | 2000-06-19 | CN1174934C | 2004-11-10 | 宫本圣一; 丸山稔正; 佐藤俊文; 糸谷孝行; 小林稔 |
| 本发明的目的是提供一种无需中间材料的将陶瓷与金属接合的方法和使用该方法的陶瓷与金属的接合体。在本发明中，金属侧的接合面面积不超过陶瓷侧接合面面积的90%。 | ||||||
| 67 | 氮化硅陶瓷电路基片及使用该陶瓷基片的半导体器件 | CN96114418.1 | 1996-09-27 | CN1149666C | 2004-05-12 | 加曾利光男; 堀口昭宏; 角野裕康; 上野文雄 |
| 本申请公开了一种包括室温下的热导率为80W/mK以上氮化硅陶瓷板1和通过玻璃层3粘接到氮化硅陶瓷板上1的金属板2的电路板，及一种其中安装在所说电路基片的半导体器件。 | ||||||
| 68 | 超导电路板 | CN88102627 | 1988-05-07 | CN1040937C | 1998-11-25 | 横山博三; 今中佳彦; 山中一典; 龟原伸男; 丹羽纮一; 涡卷拓也; 铃木均; 町敬人 |
| 本发明提供一种超导电路板，它包括含有氧化铝重量百分比大于99%的烧结氧化铝板和在此氧化铝板上形成的超导陶瓷互连电路图形。由于将Ti或Si联结剂加入形成此互连电路图形的涂料中，改进了互连电路图形与氧化铝板的粘合力。用铜粉代替铜氧化物粉作为涂料中形成超导陶瓷的一种成分有利于印制和获得均匀的超导陶瓷电路图形。 | ||||||
| 69 | 氮化硅陶瓷电路基片及使用该陶瓷基片的半导体器件 | CN96114418.1 | 1996-09-27 | CN1155759A | 1997-07-30 | 加曾利光男; 堀口昭宏; 角野裕康; 上野文雄 |
| 本申请公开了一种包括室温下的热导率为80w/mk以上氮化硅陶瓷板1和通过玻璃层3粘接到氮化硅陶瓷板上1的金属板2的电路板，及一种其中安装在所说电路基片的半导体器件。 | ||||||
| 70 | THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE | PCT/DE2013100020 | 2013-01-22 | WO2013113311A3 | 2013-10-03 | MEYER ANDREAS; SCHULZ-HARDER JUERGEN |
| The invention relates to a thermoelectric generator module with a hot zone (1a) and a cold zone (1b) comprising at least a first metal-ceramic substrate (2), which has a first ceramic layer (6) and at least one structured first metallization (4) applied to the first ceramic layer (6) and is assigned to the hot zone, and at least a second metal-ceramic substrate (4), which has a second ceramic layer (7) and at least one structured second metallization (5) applied to the second ceramic layer and is assigned to the cold zone (1b), and also a number of thermoelectric generator components (N, P) located between the first and second structured metallizations (4, 5) of the metal-ceramic substrates (2, 3). Particularly advantageously, the first metal-ceramic substrate (2), assigned to the hot zone (1a), has at least one layer of steel or high-grade steel (8), wherein the first ceramic layer (6) is arranged between the first structured metallization (4) and the at least one layer of steel or high-grade steel (8). The invention also relates to an associated metal-ceramic substrate and to a method for producing it. | ||||||
| 71 | METHOD FOR PRODUCING A ZIRCONIA CERAMIC CASE HAVING A LOGO FOR A PORTABLE ELECTRONIC DEVICE | PCT/KR2011006051 | 2011-08-17 | WO2012023805A3 | 2012-05-18 | LEE JAEHYUNG; JUNG IN CHUL; PARK SEONG TAEK; WOO MYUNG HUN |
| The present invention relates to a method of producing a zirconia ceramic case for a portable electronic device, wherein the case has a logo that is dramatically aesthetically enhanced. The logo is made of zirconia similarly to the zirconia case, and a composition of the logo is the same as that of the zirconia case with the exception of coloring additives. According to the present invention, a zirconia case sintering process, in which the zirconia case shrinks, is performed, and the same process is carried out for the logo, thereby preventing the shape of the logo from becoming warped, and achieving a dramatic aesthetic enhancement for the logo. | ||||||
| 72 | PROCESS FOR PRODUCING CERAMIC COMPOSITE COMPONENTS | PCT/US2013031899 | 2013-03-15 | WO2013191771A3 | 2014-02-20 | KLEINOW CHAD DANIEL |
| A process for producing components containing ceramic materials. The process entails forming a first region of a component with plies containing a reinforcement material in a precursor of a ceramic material. The plies include at least a first set of plies between at least second and third sets of plies. Distal portions of the second and third sets of plies are then folded away from the first set of plies so that they are oriented transverse to the first set of plies. A fourth set of plies is then interleaved among the folded distal portions of the second and third sets of plies. | ||||||
| 73 | THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE | PCT/DE2013100020 | 2013-01-22 | WO2013113311A4 | 2013-11-28 | MEYER ANDREAS; SCHULZ-HARDER JUERGEN |
| The invention relates to a thermoelectric generator module with a hot zone (1a) and a cold zone (1b) comprising at least a first metal-ceramic substrate (2), which has a first ceramic layer (6) and at least one structured first metallization (4) applied to the first ceramic layer (6) and is assigned to the hot zone, and at least a second metal-ceramic substrate (4), which has a second ceramic layer (7) and at least one structured second metallization (5) applied to the second ceramic layer and is assigned to the cold zone (1b), and also a number of thermoelectric generator components (N, P) located between the first and second structured metallizations (4, 5) of the metal-ceramic substrates (2, 3). Particularly advantageously, the first metal-ceramic substrate (2), assigned to the hot zone (1a), has at least one layer of steel or high-grade steel (8), wherein the first ceramic layer (6) is arranged between the first structured metallization (4) and the at least one layer of steel or high-grade steel (8). The invention also relates to an associated metal-ceramic substrate and to a method for producing it. | ||||||
| 74 | METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE | PCT/DE2014100284 | 2014-08-06 | WO2015018397A3 | 2015-05-14 | LEHMEIER BERND |
| The invention relates to a metal-ceramic substrate having a multilayer, plate-shaped ceramic material or substrate, which consists of an inner base layer of a silicon nitride ceramic and of at least one intermediate layer of an oxidic ceramic applied to a surface of the base layer, and having at least one metallisation which is connected to the intermediate layer, which is composed of the oxidic ceramic silicon dioxide (SiO2) in crystalline form in a random distribution or of magnesium silicate (MgSiO3/Mg2Si2O6) with zirconium silicate (ZrSiO4) and/or yttrium silicate (Y2Si2O3), the remainder being silicon dioxide (SiO2) in crystalline form and zirconium oxide (ZrO2), by direct bonding (DCB method). | ||||||
| 75 | METAL-BONDED CERAMIC SUBSTRATE | PCT/KR2011001609 | 2011-03-09 | WO2011111989A2 | 2011-09-15 | KIM KYONG HWAN; HAN MOON SU; PARK JUN HEE |
| The present invention relates to a metal-bonded ceramic substrate. The present invention relates to a ceramic substrate, on the surface of which metal layers are bonded to form a circuit pattern. The metal layers which form the circuit pattern are arranged into columns and rows. An additional metal layer is formed along the edge of at least one surface of the ceramic substrate such that the additional metal layer is located along the peripheries of the metal layers. It is desirable that the gap between the metal layers is the same as the gap between the metal layers and the additional metal layer. According to the present invention, circuit pattern deviation can be reduced during an etching process for forming a circuit to thereby improve the accuracy of dimensions, temperature deviation can be reduced during a heat treatment of a brazing material layer for mounting a semiconductor chip to thereby improve the bonding characteristics of the semiconductor chip, and warpage due to the difference in the coefficients of thermal expansion of a metal and of a ceramic can be mitigated or artificially controlled. | ||||||
| 76 | Composite body, honeycomb structural body, and method for manufacturing composite body | US14640594 | 2015-03-06 | US10115494B2 | 2018-10-30 | Yunie Izumi; Yoshimasa Kobayashi |
| A composite body including a substrate and a forming portion which is composed of a composite phase containing a perovskite oxide and a metal oxide different from the perovskite oxide and which is formed on the substrate. The composite body may be a composite body manufactured by a manufacturing method including a forming step of firing in an oxidizing atmosphere, a laminated body in which an inorganic raw material powder containing a compound powder and a metal powder is disposed on a substrate so as to form a forming portion composed of a composite phase containing a perovskite oxide and a metal oxide different from the perovskite oxide on the substrate. | ||||||
| 77 | Composite body, honeycomb structural body, and method for manufacturing composite body | US14640594 | 2015-03-06 | US10062470B2 | 2018-08-28 | Yunie Izumi; Yoshimasa Kobayashi |
| A composite body including a substrate and a forming portion which is composed of a composite phase containing a perovskite oxide and a metal oxide different from the perovskite oxide and which is formed on the substrate. The composite body may be a composite body manufactured by a manufacturing method including a forming step of firing in an oxidizing atmosphere, a laminated body in which an inorganic raw material powder containing a compound powder and a metal powder is disposed on a substrate so as to form a forming portion composed of a composite phase containing a perovskite oxide and a metal oxide different from the perovskite oxide on the substrate. | ||||||
| 78 | Power-module substrate unit and power module | US15320798 | 2015-06-30 | US09837363B2 | 2017-12-05 | Sotaro Oi; Tomoya Oohiraki |
| In a power-module substrate unit, a circuit layer is structured by a plurality of small circuit layers; a ceramic substrate layer is structured by at least one plate; the small circuit layers are formed to have a layered structure having a first aluminum layer bonded on one surface of the ceramic substrate layer and a first copper layer bonded on the first aluminum layer by solid diffusion; a radiation plate is made of copper or copper alloy; the metal layer and the radiation plate are bonded by solid diffusion. | ||||||
| 79 | Metal-ceramic substrate | US14350661 | 2013-02-13 | US09730310B2 | 2017-08-08 | Andreas Meyer; Christoph Wehe; Jürgen Schulz-Harder; Karsten Schmidt |
| A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy. | ||||||
| 80 | JOINED BODY MANUFACTURING METHOD, MULTILAYER JOINED BODY MANUFACTURING METHOD, POWER-MODULE SUBSTRATE MANUFACTURING METHOD, HEAT SINK EQUIPPED POWER-MODULE SUBSTRATE MANUFACTURING METHOD, AND LAMINATED BODY MANUFACTURING DEVICE | US15320441 | 2015-06-30 | US20170141011A1 | 2017-05-18 | Tomoya Oohiraki; Sotaro Oi; Kimihito Nishikawa |
| A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction. | ||||||
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