| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 101 | SEMICONDUCTOR UNIT | US14064806 | 2013-10-28 | US20140117508A1 | 2014-05-01 | Shinsuke NISHI; Shogo MORI; Yuri OTOBE; Naoki KATO |
| A semiconductor unit includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first conductive layer bonded to the first surface of the insulating substrate, a second conductive layer bonded to the first surface of the insulating substrate at a position different from that for the first conductive layer, a stress relief layer bonded to the second surface of the insulating substrate, a radiator bonded to the stress relief layer on the side thereof opposite to the insulating substrate, and semiconductor devices electrically bonded to the respective first and second conductive layers. The insulating substrate has a low-rigidity portion provided between the first and second conductive layers and having a lower rigidity than the rest of the insulating substrate, and at least the low-rigidity portion is sealed and covered by a mold resin. | ||||||
| 102 | METHOD FOR PRODUCING A CERAMIC COMPONENT COMPOSED OF A PLURALITY OF JOINED PREFORMS AND COMPONENT OBTAINED BY THE METHOD | US14058432 | 2013-10-21 | US20140044979A1 | 2014-02-13 | PETER POLSTER; ANDREAS KIENZLE; THOMAS PUTZ; ALBIN VON GANSKI; BLASIUS HELL; ALFRED HAEUSLER |
| A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided. | ||||||
| 103 | CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE | US13867439 | 2013-04-22 | US20130232783A1 | 2013-09-12 | Hiroshi Tonomura; Takeshi Kitahara; Hiroya Ishizuka; Yoshirou Kuromitsu; Yoshiyuki Nagatomo |
| Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %. | ||||||
| 104 | METHOD FOR ASSEMBLING PARTS MADE OF SIC MATERIALS BY NON-REACTIVE BRAZING, BRAZING COMPOSITIONS, AND JOINT AND ASSEMBLY OBTAINED BY SAID METHOD | US13394925 | 2010-09-03 | US20120308839A1 | 2012-12-06 | Valérie Chaumat; Jean-François Henne |
| A method for assembling at least two parts made of silicon carbide-based materials by non-reactive brazing is disclosed. The two parts are contacted with a non-reactive brazing composition. The assembly formed by the parts and the brazing composition is heated to a sufficient brazing temperature sufficient to melt the brazing composition. The parts and the brazing composition are cooled so that, after solidification of the brazing composition, a moderately refractory joint is formed. The non-reactive brazing composition is a binary alloy composed, in mass percentages, of about 46% to 99% silicon and 54% to 1% neodymium. | ||||||
| 105 | METHOD OF MANUFACTURING POWER MODULE SUBSTRATE AND POWER MODULE SUBSTRATE | US13447483 | 2012-04-16 | US20120267149A1 | 2012-10-25 | Sotaro Oi |
| [Task] To provide a method of manufacturing a power module substrate and a power module substrate in which multilayers of ceramic substrates and metal plates are laminated, the metal plates on both sides of the ceramic substrates can be in a connected state, and, furthermore, separation between the ceramic substrate and the metal plate, cracking in the ceramic substrates, and the like do not easily arise.[Means for Resolution] When the ceramic substrate 2 and the metal plates 4A, 4C, 4D, 5A, and 6 are laminated, the columnar metallic members 12 that are longer than the penetration holes 11 are inserted into the penetration holes 11 in the ceramic substrate 2, and, when the ceramic substrates and the metal plates are bonded, the metallic members 12 are pressurized and plastically deformed so that the metal plates 5A, 4A, and 4D on both sides of the ceramic substrate 2 are in a connected state through the metallic members 12 in a state in which interspaces are formed between the metallic members 12 and the penetration holes 11. | ||||||
| 106 | SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE | US13241536 | 2011-09-23 | US20120077023A1 | 2012-03-29 | Masanori Nagahiro; Jyunji Oogami; Hiroyuki Komatsu |
| A ceramic sintered member is used as an insulating substrate for mounting of an electronic part and bonded to a copper plate or aluminum plate on at least part of a front face or backside face of the insulating substrate. A powder material to form the ceramic sintered member includes alumina as a main ingredient and further includes as subsidiary ingredients partially stabilized zirconia and magnesia. Content of the partially stabilized zirconia is 1 to 30 percent by weight relative to the entire powder material. Content of the magnesia relative to the entire powder material is within a range 0.05 to 0.50 percent by weight. Mole fraction of yttria in the partially stabilized zirconia being is a range of 0.015 to 0.035. 80 to 100 percent of the zirconia crystals included in the ceramic sintered member is in the tetragonal crystal phase. | ||||||
| 107 | CARBON COMPONENT AND METHOD FOR MANUFACTURING THE SAME | US13090261 | 2011-04-20 | US20110259270A1 | 2011-10-27 | Seiji MINOURA; Jun Ohashi; Toshiki Ito; Koji Ishida; Fumihito Ogawa |
| A carbon component having a hole therein and an outer surface covered with a ceramic coating, and a method for manufacturing the carbon component are provided. The carbon component includes two carbon plate members joined together. The hole is defined by a groove formed on a mating surface of at least one of the carbon plate members and a mating portion of the other of the carbon plate members, which opposes the groove. An inner surface of the hole including a surface of the groove is entirely covered with a ceramic coating. | ||||||
| 108 | Multi-stage enamelled dial | US12710676 | 2010-02-23 | US07951444B2 | 2011-05-31 | Steve Bourban; Rudolf Dinger; Nicolas Blanckaert |
| The dial with an enamel coating (2) includes a base plate (1) made of ceramic material with portions in relief (4, 8) obtained by partial or through shaping or machining, formed by an insert (10) also having an enamel coating (12) and whose thickness defines a recess (4) or an embossment (8). | ||||||
| 109 | INSULATING SUBSTRATE AND METHOD FOR PRODUCING THE SAME | US12736203 | 2009-03-19 | US20110005810A1 | 2011-01-13 | Daisuke Uneno; Koji Hisayuki |
| An insulating substrate 1 includes an electrically insulative layer 2, a wiring layer 3 formed on one side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an electrically conductive material powder, and a stress relaxation layer 4 formed on the other side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an alloy powder or a mixed powder to be formed into a metal composite. The wiring layer 3 is formed of a spark sintered body of a powder selected from the group consisting of an Al powder, a Cu powder, an Ag powder, and an Au powder. The stress relaxation layer 4 is formed of a spark plasma sintered body of a powder selected from the group consisting of an Al—Si alloy powder, a mixed powder of a Cu powder and an Mo powder, a mixed powder of a Cu powder and a W powder, a mixed powder of an Al powder and an SiC powder, and a mixed powder of an Si powder and an SiC powder. Use of the insulating substrate can yield a power module which can prevent a drop in heat radiation performance and can enhance durability. | ||||||
| 110 | Methods for synthesizing bulk, composite and hybrid structures from polymeric ceramic precursors as well as other polymeric substances and compounds | US12584213 | 2009-09-01 | US20100116412A1 | 2010-05-13 | Weifeng Fei; Arnold Hill; Mark Tellam |
| This invention relates to polymer derived ceramics (PDC's) and more particularly, to methods and product made by using polymeric derived ceramic precursors to synthesize dense, crack-free bulk ceramics in a technique using sacrificial molds, coating processes, replication processes, assembly processes and finishing processes; where gas release paths are created and maintained during these processes to release gases generated during pyrolysis of the ceramic precursor.It is a primary objective of the present invention to provide a well defined method to create PDC voxels which are interconnected as a bulk (high density) material. Such a material is effectively a lattice with face centered cubic or hexagonal close pack geometry.A second objective of the present invention is to provide a method for bulk, high density material to be combined with fully dense material in a hybrid material.A third objective of the present invention is to provide a method for different types of bulk and fully dense materials, and other items (optionally), to be combined in to a composite material. | ||||||
| 111 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE | US12400389 | 2009-03-09 | US20090252906A1 | 2009-10-08 | Takehiro HIGUCHI |
| A honeycomb structure includes a ceramic block formed by combining a plurality of honeycomb fired bodies together with an adhesive layer interposed between the plurality of honeycomb fired bodies. The plurality of honeycomb fired bodies each has cell walls extending along a longitudinal direction of the honeycomb fired bodies to define cells. The honeycomb fired bodies adjacent to each other via said adhesive layer each have at least one projected portion on the opposing side faces. The projected portions formed on the honeycomb fired bodies overlap each other when seen from an end face of the honeycomb structure and the projected portions formed on the adjacent honeycomb fired bodies abut each other. | ||||||
| 112 | CERAMIC SUBSTRATE PRODUCTION PROCESS AND CERAMIC SUBSTRATE PRODUCED USING THE PROCESS | US11862722 | 2007-09-27 | US20080308976A1 | 2008-12-18 | Yuki ITO; Osamu CHIKAGAWA; Tetsuya IKEDA |
| A process for producing a multilayered ceramic substrate having a step portion of a desired shape does not require complicated process steps and equipment. An auxiliary-layer-lined unfired ceramic body, which has a step portion in a principal surface thereof, has an unfired ceramic body and an auxiliary layer which is adhered to one principal surface of the unfired ceramic body and which is made of a material that is substantially unsinterable at a temperature at which the unfired ceramic body is fired. The auxiliary-layer-lined unfired ceramic body is fired at a temperature at which the unfired ceramic body is sinterable but the auxiliary layer is substantially unsinterable, while the auxiliary layer remains adhered to the unfired ceramic body. A pressing operation is performed by using a die having a projection placed on the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer, so that the step portion, having a shape corresponding to the outer shape of the die projection, is formed in the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer. | ||||||
| 113 | Method of manufacturing ceramic sheet and method of manufacturing gas sensing element | US11976735 | 2007-10-26 | US20080099126A1 | 2008-05-01 | Eturo Yasuda; Noriaki Kihara; Daisuke Makino; Makoto Shirai; Hirokatsu Mukai; Takumi Ushikubo |
| Methods of manufacturing a ceramic sheet and a gas sensing element are disclosed. At least ceramic powder, a binder and a plasticizer are blended and mixed in slurry. The slurry is formed into unfired green sheets, on which paste is printed. Each of the unfired green sheets has porosity greater than 5%. In the manufacturing methods, the unfired green sheets are pressurized with a pressure of 10 MPa at a temperature above 60° C., after which the paste is printed on surfaces of the unfired green sheets. In the method of manufacturing the gas sensing element, a shielding layer, a porous diffusion resistance layer and the unfired green sheets for a sensing layer, a reference gas airspace forming layer and a heating layer are stacked to form a stacked ceramic body, whish is fired to obtain the gas sensing element. | ||||||
| 114 | Multi-stage enamelled dial | US11231764 | 2005-09-22 | US20060062971A1 | 2006-03-23 | Steve Bourban; Rudolf Dinger; Nicolas Blanckaert |
| The dial with an enamel coating (2) includes a base plate (1) made of ceramic material with portions in relief (4, 8) obtained by partial or through shaping or machining, formed by an insert (10) also having an enamel coating (12) and whose thickness defines a recess (4) or an embossment (8). | ||||||
| 115 | Method of manufacturing ceramic body and firing jig | US11031954 | 2005-01-07 | US20050206050A1 | 2005-09-22 | Kunihiko Yoshioka; Fumitake Takahashi |
| There are disclosed a manufacturing method and a firing jig capable of obtaining a ceramic body having a diaphragm structure having lower deflection of a thin portion. There is provided a method of manufacturing a ceramic body comprising a step of firing a formed body having a diaphragm structure including a thick portion and a plate-like thin portion disposed in such a manner that a concave portion or a hollow portion is formed by the thin and thick portions. In the method, firing is started in a state in which a thermal buffer is disposed in a position covering the thin portion in a contact or non-contact state with respect to the thin portion. There is provided a firing jig comprising: a thermal buffer portion formed of porous ceramic; a spacer disposed on one surface of the thermal buffer portion; and a weight adjusting portion disposed in non-contact with respect to the thermal buffer portion via the spacer. A space is formed between the thermal buffer portion and the weight adjusting portion. | ||||||
| 116 | Composite member comprising bonded different members and method for making the composite member | US09908951 | 2001-07-19 | US06635358B2 | 2003-10-21 | Masayuki Shinkai |
| A composite member includes a ceramic base and a metallic member which are bonded to each other. An active metal foil is disposed on the surface of the ceramic base and a solder material including Au or a solder material including an Au—Ag alloy is disposed on the active metal foil. The active metal foil and the solder material are heated to form a bonding layer and the metallic member is disposed on the surface of the bonding layer, and these are pressed and heated to bond the bonding layer and the metallic member through solid phase bonding. Since in this composite member the bonding layer and the metallic member are bonded by solid phase bonding, the composite members can be effectively inhibited from breakage caused by residual stress at the time of bonding and, moreover, is excellent in thermal cycle characteristics and thermal shock characteristics. | ||||||
| 117 | Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method | US10178624 | 2002-06-24 | US06565621B2 | 2003-05-20 | Masayuki Shinkai; Masahiro Kida |
| An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value. | ||||||
| 118 | Method for fixing a ceramic component in a metallic support | US09799117 | 2001-03-06 | US06531028B2 | 2003-03-11 | Klaus Friedrich Stärk |
| A method for fixing of a ceramic component in a metallic support including a first method step, a bush, consisting of gray cast iron with lamellar graphite, is placed around the ceramic component, in a second method step, the ceramic component including the bush are annealed at temperatures in the range from 500 to 750° C. until the bush has an increase in volume as a result of internal oxidation that causes the ceramic component to be permanently fixed and in that finally, after cooling down, the ceramic component with the bush are introduced into the metallic support and secured in the support. | ||||||
| 119 | Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method | US10178624 | 2002-06-24 | US20030035975A1 | 2003-02-20 | Masayuki Shinkai; Masahiro Kida |
| An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value. | ||||||
| 120 | Power semiconductor device | US09845272 | 2001-05-01 | US20020060356A1 | 2002-05-23 | Hiroshi Nishibori; Masakazu Fukada; Takanobu Yoshida; Naoki Yoshimatsu; Haruo Takao; Nobuyoshi Kimoto; Yasumi Uegai |
| It is an object to provide a power semiconductor device having a circuit pattern and a lower pattern made of an Al alloy for cost reduction and enabling reduction in heat resistance and improvement in resistance of a soldering layer to heat cycle. A substrate of semiconductor elements is mounted on a metal base plate made of a Cu alloy. The substrate of semiconductor elements includes an insulating substrate made of ceramics or the like. The circuit pattern and the lower pattern both made of an Al alloy are formed on an upper surface and a lower surface of the insulating substrate. The lower pattern is provided on an entire surface of the insulating substrate and joined onto the metal base plate through the soldering layer. Thicknesses of the metal base plate and the insulating substrate are respectively set to be 3.5 to 5.5 mm and 0.5 to 1 mm, for example. A thickness of the circuit pattern is set to be 0.4 to 0.6 mm and thicknesses of the lower pattern and the soldering layer are respectively set to be 0.2 mm or less and 100 to 300 nullm. | ||||||
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