| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | Annular sliding body for a sliding seal and process for use thereof | US568122 | 1983-12-09 | US4714257A | 1987-12-22 | Juergen Heinrich; Axel Krauth; Karl-Heinz Victor; Heinz Peeken |
| The invention concerns a sliding body for sliding systems in which sliding surfaces of sliding and counter components form a gap in which there is a fluid, whereby the sliding body (1) at least in the area of sliding surfaces (10) is comprised of several stacked thin form elements stamped out of foils or cards, which are solidly bonded together on the contact faces. The invention also concerns a process for the production of the sliding body, whereby foils are produced from ceramic slips, in which various hollow chambers and/or recesses are stamped or impressed, a laminating agent is applied to the foils or cards, the foils or cards are stacked into a sliding body packet and the layers of the stack are laminated together, the organic components are partially baked off, after which a post-treatment of the sliding body takes place, then the remainder of the organic components are removed, and then the laminated sliding body is sintered between 1200.degree. and 2200.degree. C., after which an optional post-treatment takes place. The novel sliding body is used especially for production of hydrodynamic enhancement shapes in the sliding surface. | ||||||
| 142 | Method for forming hermetic seals | US765978 | 1985-08-15 | US4650108A | 1987-03-17 | Brian D. Gallagher |
| A firmly adherent film 16 of bondable metal, such as silver, is applied to the surface 10 of glass or other substrate by decomposing a layer 14 of a solution of a thermally decomposable metallo-organic deposition (MOD) compound such as silver neodecanoate in xylene. The MOD compound thermally decomposes into metal and gaseous by-products. Sealing is accomplished by depositing a layer 18 of bonding metal, such as solder or a brazing alloy, on the metal film and then forming an assembly with another high melting point metal surface 20 such as a layer of Kovar. When the assembly is heated above the temperature of the solder, the solder flows, wets the adjacent surfaces and forms a hermetic seal between the metal film 14 and metal surface 20 when the assembly cools. | ||||||
| 143 | Ceramic substrate with metal plate | US464945 | 1983-02-08 | US4497875A | 1985-02-05 | Hideo Arakawa; Keiichi Kuniya; Akio Chiba; Seiki Shimizu |
| A ceramic substrate with metal plate, wherein a metal plate consisting mainly of copper is bonded to a ceramic substrate through a brazing layer consisting of a mixture of copper oxide and copper. | ||||||
| 144 | Brazable layer for indexable cutting insert | US331377 | 1981-12-16 | US4460382A | 1984-07-17 | John M. Ohno |
| A composite wafer bonded to a carbide substrate is formed by preparing a dispersion of super-hard crystals and carbon black in a temporary binder such as paraffin, by preparing a base mixture of carbon fiber, carbon black and filler in the temporary binder, and by preparing an additional mixture of cobalt and carbon black in the temporary binder. The dispersion, base mixture and additional mixture are compacted to form an intermediate composite, the additional mixture forming a layer on one surface of the base mixture. The intermediate composite is heated to allow for the removal of the temporary binder and the infiltration of liquefied silicon into the composite which is then reaction sintered to form the composite wafer. | ||||||
| 145 | Diamond and cubic boron nitride grinding wheels with improved silver alloy bonds | US961722 | 1978-11-17 | US4239502A | 1980-12-16 | Glen A. Slack; Warren S. Knapp |
| A silver-manganese-zirconium brazing alloy with a high percentage of silver at least exceeding 80 percent is used in a process for fabricating strong, high thermal conductivity bonds between diamond or cubic boron nitride (CBN) and a molybdenum or tungsten support member. Typical diamond or CBN-alloy-metal products with the improved alloy bond are semiconductor device heat sinks, grinding wheels and tools. | ||||||
| 146 | Metallized gyromagnetic ferrite | US513021 | 1974-10-08 | US3969086A | 1976-07-13 | Victor A. Vaguine; Dennis R. Nichols |
| A ferrite-to-metal bond suitable for the environment of a high-power microwave circulator is disclosed. The bonding surface of a gyromagnetic ferrite or garnet button is metallized by a sputtering process that deposits successive layers of nichrome, copper and gold thereon. During the sputtering process, a flexible stainless steel band surrounds the button to prevent sputtered material from being deposited on other than the bonding surface of the button. The metallized bonding surface is then soldered to a metal wall of the circulator. The bond so formed is capable of withstanding a peak power level in the circulator of 2.0 megawatts and an average power level of 3.5 kilowatts under standing-wave conditions. | ||||||
| 147 | Ferrite to metal bond for high-power microwave applications | US513030 | 1974-10-08 | US3960512A | 1976-06-01 | Victor A. Vaguine; Dennis R. Nichols |
| A ferrite-to-metal bond suitable for the environment of a high-power microwave circulator is disclosed. The bonding surface of a gyromagnetic ferrite or garnet button is metallized by a sputtering process that deposits successive layers of nichrome, copper and gold thereon. During the sputtering process, a flexible stainless steel band surrounds the button to prevent sputtered material from being deposited on other than the bonding surface of the button. The metallized bonding surface is then soldered to a metal wall of the circulator. The bond so formed is capable of withstanding a peak power level in the circulator of 2.0 megawatts and an average power level of 3.5 kilowatts under standing-wave conditions. | ||||||
| 148 | Method of bonding a boron nitride body to a refractory metal | US39827464 | 1964-09-22 | US3344505A | 1967-10-03 | RIVELY CLAIR M; LIVERA PHILLIP A |
| 149 | Process for sealing vacuum-tight spinel bodies | US11218161 | 1961-05-24 | US3239322A | 1966-03-08 | CARTER RALPH E |
| 150 | Thermally devitrifiable sealing glasses and composite articles | US463760 | 1960-01-26 | US3113878A | 1963-12-10 | MARTIN FRANCIS W |
| 151 | Ceramic circuit board and electronic device | US15040405 | 2016-02-10 | US10147663B2 | 2018-12-04 | Makoto Tani; Yoshihiro Tanaka; Takashi Ebigase |
| A ceramic circuit board includes a ceramic substrate, a first metal plate bonded to a front surface of the ceramic substrate, and a member bonded to a front surface side of the metal plate. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the first metal plate, and which exhibits a higher Young's modulus than that of the first metal plate. | ||||||
| 152 | LOCAL TWO-LAYER THERMAL BARRIER COATING | US15776920 | 2016-11-02 | US20180334914A1 | 2018-11-22 | Fathi Ahmad; Daniela Koch; Radan Radulovic |
| A turbine blade with a ceramic thermal barrier coating system has a substrate designed as a blade platform and as a blade airfoil. On the substrate is a first ceramic layer as a thermal barrier coating, which protects the substrate in the exposed high temperature region and there is locally an increase of the thermal barrier coating for locally reinforcing the thermal barrier. The increase includes a material that is different from the material of the first ceramic layer. The local reinforcement is arranged over the first ceramic layer, without the first ceramic layer having a reduced layer thickness. The local reinforcement is provided at most on 30% of the area of the blade airfoil and is arranged close to a platform extending over the entire pressure side in the direction of flow and with an extent thereto in the radial direction of the blade airfoil is at most 30%. | ||||||
| 153 | Power-module substrate unit and power module | US15306559 | 2015-04-24 | US10068829B2 | 2018-09-04 | Sotaro Oi; Tomoya Oohiraki |
| A power-module substrate unit having at least one power-module substrate including one ceramic substrate, a circuit layer formed on one surface of the ceramic substrate, and a metal layer formed on another surface of the ceramic substrate, and a heat sink on which the metal layer of the power-module substrate is bonded, in which the metal layer is made of an aluminum plate having purity of 99.99 mass % or higher; the heat sink is made of an aluminum plate having purity of 99.90 mass % or lower; and the circuit layer has a stacking structure of a first layer made of an aluminum plate having the purity of 99.99 mass % or higher and being bonded to the ceramic substrate and a second layer made of the aluminum plate having the purity lower than 99.90 mass % and being bonded on a surface of the first layer. | ||||||
| 154 | Method for manufacturing plate for cement industry tube mill | US13816463 | 2011-08-31 | US10058958B2 | 2018-08-28 | Xiaoru Li |
| A manufacture method of a lining plate structure for use with a tube mill for the cement industry. The manufacture method has the following three technical solutions: 1) metal lining plate, 2) ceramic lining plate, and 3) combined lining plate. The manufacture method includes: lining the concave-convex space, formed in the combination of metal lining plate and tube body, with corundum ceramic lining plate; then installing the combined lining plate on the steel plate of the tube body through inlaying, sticking and local welding. Under the same reference conditions of the present method, the weight of lining plate is reduced 50%, saving the steel material consumption by more than 50%; and the service life of the lining plate for use with the tube mill of cement industry is doubled, up to 15000-20000 hours. | ||||||
| 155 | METHOD FOR PRODUCING A COMPOSITE MATERIAL | US15576424 | 2016-05-13 | US20180213639A1 | 2018-07-26 | Andreas MEYER; Stefan BRITTING; Dieter KNÖCHEL; David BIERWAGEN |
| A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterised by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 μm; heating the base material and the additional layer on the first surface to at least partially melt the solder layer and connecting the base material to the at least one additional layer. | ||||||
| 156 | CMC blade with integral 3D woven platform | US14933290 | 2015-11-05 | US10024173B2 | 2018-07-17 | Michael G McCaffrey |
| A method of forming a component for use in a gas turbine engine includes the steps of forming an airfoil/root assembly; creating a platform assembly structure having an opening; inserting the airfoil/root assembly into the opening; and bonding the platform assembly structure to the airfoil/root assembly to form the component. | ||||||
| 157 | ARTICLE HAVING CERAMIC WALL WITH FLOW TURBULATORS | US15354083 | 2016-11-17 | US20180135457A1 | 2018-05-17 | Tracy A. Propheter-Hinckley |
| An article includes a ceramic wall that defines at least a side of a passage. The ceramic wall includes a flow turbulator that projects into the passage. The flow turbulator is formed of ceramic matrix composite. | ||||||
| 158 | Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate | US14435554 | 2013-10-11 | US09968012B2 | 2018-05-08 | Nobuyuki Terasaki; Yoshiyuki Nagatomo; Yoshirou Kuromitsu |
| A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface. | ||||||
| 159 | Power-module substrate and manufacturing method thereof | US14388953 | 2013-03-27 | US09862045B2 | 2018-01-09 | Toshiyuki Nagase; Takeshi Kitahara; Ryo Muranaka |
| To provide a power-module substrate and a manufacturing method thereof in which small voids are reduced at a bonded part and separation can be prevented. Bonding a metal plate of aluminum or aluminum alloy to at least one surface of a ceramic substrate by brazing, when a cross section of the metal plate is observed by a scanning electron microscope in a field of 3000 magnifications in a depth extent of 5 μm from a bonded interface between the metal plate and the ceramic substrate in a width area of 200 μm from a side edge of the metal plate, residual-continuous oxide existing continuously by 2 μm or more along the bonded interface has total length of 70% or less with respect to a length of the field. | ||||||
| 160 | Method of Joining Metal-Ceramic Substrates to Metal Bodies | US15706692 | 2017-09-16 | US20180002239A1 | 2018-01-04 | Heiko Knoll |
| A method of joining a metal-ceramic substrate having metalization on at least one side to a metal body by using a metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm, and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body. | ||||||
QQ群二维码
意见反馈
意见反馈