| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 121 | Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method | US10178624 | 2002-06-24 | US20030035975A1 | 2003-02-20 | Masayuki Shinkai; Masahiro Kida |
| An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value. | ||||||
| 122 | Power semiconductor device | US09845272 | 2001-05-01 | US20020060356A1 | 2002-05-23 | Hiroshi Nishibori; Masakazu Fukada; Takanobu Yoshida; Naoki Yoshimatsu; Haruo Takao; Nobuyoshi Kimoto; Yasumi Uegai |
| It is an object to provide a power semiconductor device having a circuit pattern and a lower pattern made of an Al alloy for cost reduction and enabling reduction in heat resistance and improvement in resistance of a soldering layer to heat cycle. A substrate of semiconductor elements is mounted on a metal base plate made of a Cu alloy. The substrate of semiconductor elements includes an insulating substrate made of ceramics or the like. The circuit pattern and the lower pattern both made of an Al alloy are formed on an upper surface and a lower surface of the insulating substrate. The lower pattern is provided on an entire surface of the insulating substrate and joined onto the metal base plate through the soldering layer. Thicknesses of the metal base plate and the insulating substrate are respectively set to be 3.5 to 5.5 mm and 0.5 to 1 mm, for example. A thickness of the circuit pattern is set to be 0.4 to 0.6 mm and thicknesses of the lower pattern and the soldering layer are respectively set to be 0.2 mm or less and 100 to 300 nullm. | ||||||
| 123 | Circuit substrate | US09910787 | 2001-07-24 | US20020037435A1 | 2002-03-28 | Yutaka Hirashima; Yoshitaka Taniguchi; Yasuhito Hushii; Yoshihiko Tujimura; Katsunori Terano; Takeshi Gotoh; Syoji Takakura; Nobuyuki Yoshino; Isao Sugimoto; Akira Miyai |
| A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a layer comprising Al and Cu. | ||||||
| 124 | Joined articles and a process for producing such joined articles | US09271965 | 1999-03-18 | US06268069B1 | 2001-07-31 | Tsuneaki Ohashi; Tomoyuki Fujii |
| A process is disclosed for producing a joined article between a ceramic member and another member, which process includes the steps of brazing the ceramic member with another member by using a brazing material composed of 50 to 99 wt % of copper, 0.5 to 20 wt % of aluminum, 0.5 to 5 wt % of at least one kind of active metal selected from the group consisting of titanium, zirconium, hafnium, vanadium and niobium, thereby obtaining a joined body including the ceramic member, another member and a layer of the brazing material, and heating the brazing material layer in an oxidative atmosphere. | ||||||
| 125 | Cutting elements and methods of manufacture thereof | US09390074 | 1999-09-03 | US06248447B1 | 2001-06-19 | Nigel Dennis Griffin; Malcolm Roy Taylor |
| A cutting element for a rotary drill bit includes at least one insert of polycrystalline diamond of a kind incorporating a carbonate as a sintering binder-catalyst. The insert is mounted by being at least partly surrounded by a support body of conventional polycrystalline diamond of a kind incorporating a sintering binder-catalyst selected from cobalt and other iron group elements or alloys thereof. The insert and support body may be integrally bonded to a substrate during manufacture. Either the insert or support body may be pre-sintered or sintered during formation of the cutting element. | ||||||
| 126 | Joining of rough carbon-carbon composites with high joint strength | US09265714 | 1999-03-09 | US06174605B1 | 2001-01-16 | Liang An Xue; Dave Narasimhan |
| Carbon—carbon composite parts are joined with minimum surface preparation. A reactive-bonding joint interlayer having thickness greater than 1 mil is formed of fine particles of carbide-forming metallic ingredients and carbon. The joint interlayer is sandwiched between the two carbon—carbon parts to be joined and the assembly is heated under a compressive pressure to a temperature sufficient to complete the bonding reaction. No special surface preparation is required for the carbon—carbon parts due to the nature of the reactive-bonding. The mechanical properties of the joint are assured by selecting the metal-carbon ingredients so that thermal expansion mismatch is minimized. Shear strength exhibited by the resulting joints is greater than the interlaminar shear strength of the carbon—carbon composite material. | ||||||
| 127 | Silicon nitride circuit substrate and semiconductor device containing same | US42453 | 1998-03-16 | US6107638A | 2000-08-22 | Hiroyasu Sumino; Akihiro Horiguchi; Mitsuo Kasori; Fumio Ueno |
| Disclosed is a silicon nitride circuit substrate, a manufacturing procee thereof, and a semiconductor device therewith. The circuit substrate comprises: a silicon nitride substrate; a metal circuit plate; and a intermediate layer being interposed between the silicon nitride board and the metal circuit plate for joining the silicon nitride substrate and the metal circuit plate, and having a compound containing an aluminum oxide component. The concentration of the aluminum oxide component in the intermediate layer is higher in the side of the metal circuit plate than in the side of the silicon nitride board. | ||||||
| 128 | Joining of rough carbon-carbon composites with high joint strength | US699751 | 1996-08-20 | US5972157A | 1999-10-26 | Liang An Xue; Dave Narasimhan |
| Carbon--carbon composite parts are joined with minimum surface preparation. A reactive-bonding joint interlayer having thickness greater than 1 mil is formed of fine particles of carbide-forming metallic ingredients and carbon. The joint interlayer is sandwiched between the two carbon--carbon parts to be joined and the assembly is heated under a compressive pressure to a temperature sufficient to complete the bonding reaction. No special surface preparation is required for the carbon--carbon parts due to the nature of the reactive-bonding. The mechanical properties of the joint are assured by selecting the metal-carbon ingredients so that thermal expansion mismatch is minimized. Shear strength exhibited by the resulting joints is greater than the interlaminar shear strength of the carbon--carbon composite material. | ||||||
| 129 | Brazing materials for producing metal-ceramics composite substrates | US850183 | 1997-05-02 | US5955686A | 1999-09-21 | Masami Sakuraba; Masami Kimura; Junji Nakamura; Takashi Ono |
| A brazing material having 0.25-0.9 wt % of titanium oxide added to a basic formula consisting of 60-94.25 wt % Ag, 5-30 wt % Cu and 0.5-4.5 wt % of an active metal is processed to form a paste, which is applied to an AlN substrate and overlaid with a copper plate and heat treated to form a joint between the AlN substrate and the copper plate. A resist is applied to the copper plate to form a circuit pattern, which is etched to form a metallized circuit, thereby producing a metal-ceramics composite substrate capable of operation on high electrical power. The substrate is improved in various characteristics of a power module device over the composite substrates produced by using the conventional brazing materials. | ||||||
| 130 | Joining product of oxide superconducting material and process for producing the same | US313053 | 1994-09-30 | US5786304A | 1998-07-28 | Keiichi Kimura; Katuyoshi Miyamoto; Misao Hashimoto |
| A joining product of oxide superconducting materials having a high current density and process for producing the same. A joining product comprising a plurality of oxide superconducting materials having an identical crystal orientation joined with each other through a superconducting phase of the same type as described above which has the same crystal orientation as the oxide superconducting materials and a lower peritectic temperature than the oxide superconducting materials. A joining method comprising the steps of: regulating oxide superconducting materials to be joined so that they have an identical crystal orientation; either inserting as a solder a material comprising elements constituting an oxide superconductor having a lower peritectic temperature than the oxide superconducting materials or bringing the material comprising elements constituting an oxide superconductor having a lower peritectic temperature than the oxide superconducting materials into contact with the oxide superconducting materials to be joined; heating the assembly to a temperature below the peritectic temperature of the superconducting materials to be joined and above the peritectic temperature of the solder; and gradually cooling the heated assembly to orient and grow the same type of oxide superconductor at the joining interface. A junction product of oxide superconducting materials free from such crystal grain boundary as to inhibit the current flow and having a high critical current density can be provided and can be utilized as a magnet, a magnetic shield and a current leading material. | ||||||
| 131 | Metal-bonded, carbon fiber-reinforced composites | US252601 | 1994-06-01 | US5495979A | 1996-03-05 | Suri A. Sastri; J. Paul Pemsler; Richard A. Cooke; John K. Litchfield; Mark B. Smith |
| Metal bonded carbon fiber-reinforced composites are disclosed in which the metal and the composite are strongly bound by (1) providing a matrix-depleted zone in the composite of sufficient depth to provide a binding site for the metal to be bonded and then (2) infiltrating the metal into the matrix-free zone to fill a substantial portion of the zone and also provide a surface layer of metal, thereby forming a strong bond between the composite and the metal. The invention also includes the metal-bound composite itself, as well as the provision of a coating over the metal for high-temperature performance or for joining to other such composites or to other substrates. | ||||||
| 132 | Gold-nickel-vanadium-molybdenum brazing materials | US925569 | 1992-08-04 | US5385791A | 1995-01-31 | Howard Mizuhara; Eugene Huebel |
| A ductile brazing material containing, by weight, 75-98% gold, 0.5-20% nickel, 0.5-6% vanadium, 0.25-5.9% molybdenum and, optionally chromium is disclosed for directly bonding ceramic/ceramic, ceramic/metal or metal/metal systems over an optimum temperature range. | ||||||
| 133 | Gold-nickel-vanadium braze joint | US924848 | 1992-08-04 | US5273832A | 1993-12-28 | Howard Mizuhara; Eugene Huebel |
| A ductile brazing material containing gold, nickel, vanadium and, optionally chromium or molybdenum is disclosed for directly bonding ceramic to ceramic or ceramic to metal over an optimum temperature range. | ||||||
| 134 | Method and apparatus for laser soldering of microelectronic lead-pad assemblies on ceramic substrates | US960348 | 1992-10-13 | US5272307A | 1993-12-21 | Marshall G. Jones |
| This invention relates to an method and apparatus for soldering microelectronic lead connections to pads on a ceramic substrate with the aid of a fiber based Neodymium:yttrium-aluminum-garnet (Nd:YAG) laser. Such structures of this type, generally, provide a means of delivering sufficient localized heating to the ceramic substrate to reflow solder plate or melt solder cream (paste) within the lead connection without any substrate preheating. | ||||||
| 135 | Ceramic-metal composite substrate and method for producing the same | US789074 | 1991-11-07 | US5251803A | 1993-10-12 | Yoshihiro Kashiba; Masaru Okada |
| A method for producing a ceramic-metal composite substrate, which comprises integrally bonding together a ceramic base member, metal members of a material selected from the group consisting of copper and alloys thereof, and a constraining member to be bonded to the metal member, wherein improvement comprises: bringing the metal member into close contact with ceramic base member through a thin film layer having a thickness of from 0.1 .mu.m to 3 .mu.m and containing therein an active metal; and heating the combination of the ceramic base member, the metal member, and the constraining member in an atmosphere which is difficult to react with the active metal, to a temperature ranging from a melting point of an alloy to be formed of the metal member and the active metal to a temperature below the melting point of the metal member, while applying a pressing force to combination in the direction of its thickness, thereby realizing the integral bonding. | ||||||
| 136 | Transient liquid phase ceramic bonding | US817540 | 1992-01-07 | US5234152A | 1993-08-10 | Andreas M. Glaeser |
| Ceramic and metal articles are joined using three metal layers one of which is a refractory metal or alloy. The refractory metal layer is placed between the other two layers, which each include a metal or alloy having a lower melting point than the refractory metal layer. The three metal layers are pressed between two articles to be bonded to form an assembly. The assembly is heated to a bonding temperature, at which the refractory metal layer remains solid, but the other two layers melt to form a liquid. The assembly is held at the bonding temperature. The refractory metal layer dissolves in surrounding liquid and a single solid bonding layer is eventually formed, at the bonding temperature, between the two articles. The bonding method may be referred to as a transient-liquid-phase or isothermal bonding method. | ||||||
| 137 | Ceramic-metal composite substrate | US675063 | 1991-03-26 | US5153077A | 1992-10-06 | Yoshihiro Kashiba; Masaru Okada |
| A ceramic-metal composite substrate which comprises: a ceramic base member; metal members of a material selected from the group consisting of copper and copper alloys, which is bonded to said ceramic base member; and a constraining member bonded to said metal member, said constraining member being made up of a metal selected from the group consisting of molybdenum, tungsten and alloys thereof, and having a thickness in a range of from 1/20 to 1/3 of the thickness of said metal member. | ||||||
| 138 | Shaped fiber-reinforced ceramic composite article | US445398 | 1989-12-04 | US5110652A | 1992-05-05 | Roger A. Allaire; G. Daniel Lipp |
| A ceramic matrix composite article having a varying thickness is fabricated by a process wherein multiple prepreg sheets comprising reinforcing fibers and powdered matrix material are stacked to provide a multi-layer prepreg stack wherein, through each cross-sectional dimension perpendicular to the plane of the sheets, the number of prepreg sheets contributing to the aggregate sheet thickness of the stack varies in proportion to the relative thickness desired in the layered article. The stack may consolidated to a composite article with a smoothly varying thickness profile without undue fiber breakage or ply wrinkling in the composite structure consolidated into a composite article having a smoothly varying thickness profile with reduced internal fiber bowing or breakage. Preferably, the exterior surfaces of the article comprise long, substantially continuous fibers and are free of ply drops. | ||||||
| 139 | Reinforced electrolyte function elements | US319043 | 1989-03-06 | US5110442A | 1992-05-05 | Takao Kojima; Hiroyuki Ishiguro; Yoshiki Kawachi; Tetsusyo Yamada |
| A zirconia-base solid electrolyte function element comprising a zirconia-base solid electrolyte substrate, wherein a reinforcing layer is formed directly on each side of said zirconia-base solid electrolyte substrate, the ratio of the shrinkage modulus to the zirconia-base electrolyte substrate to the reinforcing layers is 1.01 to 1.08, and the substrate and the reinforcing layers have been sintered simultaneously. | ||||||
| 140 | Process for brazing metallized components to ceramic substrates | US508871 | 1990-04-12 | US5033666A | 1991-07-23 | Roupen L. Keusseyan; William J. Nebe; James J. Osborne |
| A process for brazing a metallized component to a metallized ceramic-based substrate comprising the steps of:(a) applying a second conductor composition over the metallizations on the substrate such that the metallizations are covered by said second conductor composition which consists essentially of a metal powder and an organic medium;(b) drying said second conductor composition;(c) firing said second conductor composition at a temperature sufficient to sinter the metal powder of the second conductor composition and drive off said organic medium thereby forming a second metallization layer;(d) forming an assembly by positioning at least one metallized component on said second metallization layer and a brazing composition at the component-second metallization layer interface; and(e) heating said assembly at a temperature sufficient for said brazing composition to form a joint between said component and said second metallization layer. | ||||||
QQ群二维码
意见反馈
意见反馈