| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 21 | 金属陶瓷衬底或铜陶瓷衬底的制造方法以及用于所述方法中的支架 | CN200580036953.2 | 2005-10-05 | CN101049056A | 2007-10-03 | 于尔根·舒尔茨-哈德; 安德列斯·K·弗瑞茨曼; 亚历山大·罗格; 卡尔·伊格赛尔 |
| 本发明公开了一种用于制造金属陶瓷衬底的方法，在其两侧利用直接键合工艺金属化。根据所述方法，通过加热到直接键合温度，在支架(1)的隔离层(2)上形成至少一个包括第一和第二金属层(3，5)以及位于所述金属层(3，5)之间的陶瓷层(4)的DCB堆叠。在键合过程中，至少一个所述金属层(3，5)支撑在隔离层(2)上，该隔离层由多孔层或涂层组成，该多孔层或涂层由包括多铝红柱石、Al2O3、TiO3、ZrO2、MgO、CaO、CaCO2的组中的隔离层材料或所述材料中至少两种材料的混合物制成。 | ||||||
| 22 | SILICON CARBIDE-NATURED REFRACTORY BLOCK | US16232851 | 2018-12-26 | US20190202743A1 | 2019-07-04 | Kenji Yanagi |
| A silicon carbide-natured refractory block includes a fire-resistant block body, and a calcination coated layer.The fire-resistant block body includes a silicon carbide-natured refractory having a predetermined configuration. The calcination coated layer includes silicon oxide made by heating an outer superficial portion of the fire-resistant block body to oxidize at least some of silicon carbide therein to turn the silicon carbide into the silicon oxide. The silicon oxide sinters the calcination coated layer to increase the corrosion resistance. | ||||||
| 23 | Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier | US15088088 | 2016-03-31 | US10000423B1 | 2018-06-19 | Thomas Spann |
| Top and bottom metal plates of a DMB panel stack are simultaneously direct-bonded to the central ceramic sheet in a single high-temperature step. During this step, the DMB panel rests on an array of very small upwardly projecting ceramic contacts of a ceramic carrier. An amount of unoxidized carbon (e.g., a layer of graphite) is disposed on each contact projection such that an amount of carbon is disposed between the top of the contact projection and the metal oxide skin of the bottom metal plate. The carbon bonds with oxygen from the metal oxide skin, thereby preventing connection or direct-bonding of the ceramic contact projection to the second metal plate. This reduces imperfections in the metal of the bottom plate and reduces the amount of ceramic particles bonded to metal at contact sites. As a result, less post-bonding processing is required to make a high quality DMB substrate. | ||||||
| 24 | Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate | US14238097 | 2012-08-10 | US09066433B2 | 2015-06-23 | Yoshirou Kuromitsu; Yoshiyuki Nagatomo; Nobuyuki Terasaki; Toshio Sakamoto; Kazunari Maki; Hiroyuki Mori; Isao Arai |
| A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities. | ||||||
| 25 | HONEYCOMB STRUCTURED BODY, EXHAUST GAS PURIFYING HONEYCOMB FILTER, AND EXHAUST GAS PURIFYING DEVICE | US14499249 | 2014-09-29 | US20150013284A1 | 2015-01-15 | Kohei OTA; Shohei SHIMADA; Toshihide ITO |
| A honeycomb structured body includes a plurality of silicon carbide-based honeycomb fired bodies and adhesive layers. The plurality of silicon carbide-based honeycomb fired bodies each include silicon carbide particles and cell walls. The silicon carbide particles have a surface coated with a silicon-containing oxide layer. The cell walls are provided along a longitudinal direction of the plurality of silicon carbide-based honeycomb fired bodies to define cells. Each of the cells has a first end and a second end opposite to the first end along the longitudinal direction. Either the first end or the second end is sealed. The adhesive layers are provided between the plurality of silicon carbide-based honeycomb fired bodies to bond the plurality of silicon carbide-based honeycomb fired bodies. The adhesive layers include alumina fibers and inorganic balloons. | ||||||
| 26 | CERAMIC/METAL COMPOSITE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | US13354176 | 2012-01-19 | US20120114966A1 | 2012-05-10 | Wei-Hsing TUAN; Shao-Kuan Lee |
| A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%. A method of manufacturing the ceramic/metal composite structure is also provided. | ||||||
| 27 | Method for the Manufacture of Double-Sided Metallized Ceramic Substrates | US13158190 | 2011-06-10 | US20110303348A1 | 2011-12-15 | Werner Weidenauer; Thomas Spann; Heiko Knoll |
| The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue. | ||||||
| 28 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE | US13022544 | 2011-02-07 | US20110250382A1 | 2011-10-13 | Takahiko IDO; Yoshihiro Koga; Takumi Asanuma; Takashi Ito |
| A honeycomb structure includes at least one pillar-shaped honeycomb unit and a pair of electrodes. The pillar-shaped honeycomb unit includes an outer peripheral wall and cell walls. The cell walls extend along a longitudinal direction of the honeycomb unit to define cells. The cell walls are composed of a ceramic aggregate having pores. The cell walls contain a substance having an electrical resistivity lower than an electrical resistivity of ceramic forming the ceramic aggregate. The pair of electrodes is arranged at the cell walls and/or the outer peripheral wall. | ||||||
| 29 | Method for Making Hybrid Metal-Ceramic Matrix Composite Structures and Structures Made Thereby | US12044052 | 2008-03-07 | US20090226746A1 | 2009-09-10 | Buddhadev Chakrabarti; Leanne Lehman; Ali Yousefiani; William P. Keith |
| A laminated ceramic matrix composite structure is strengthened with one or more layers of a metal reinforcement. The metal reinforcement is selected to provide optimal strength and thermal compatibility with the ceramic matrix composite. The metal reinforcement includes an outer oxidized layer that bonds to the ceramic matrix composite. It may also include a barrier layer on the surface of the metal that helps prevent further oxidation. The structure is formed using standard composite prepreg layup techniques. | ||||||
| 30 | Ceramic-Copper Foil Bonding Method | US12336239 | 2008-12-16 | US20090152237A1 | 2009-06-18 | Wen-Chung Chiang; Keng-Chung Wu; Jun-Jae Wu |
| A ceramic-copper foil bonding method includes wet-oxidizing a copper foil such that a surface of the copper foil is oxidized to a copper oxide layer, contacting the copper oxide layer with a surface of a ceramic substrate, and bonding the copper oxide layer of the copper foil to the surface of the ceramic substrate by heat treatment. Preferably, a protective layer is provided on an opposite surface of the copper foil so that the opposite surface is not oxidized during wet-oxidizing the copper foil. | ||||||
| 31 | METHOD OF MANUFACTURING CERAMIC/METAL COMPOSITE STRUCTURE | US12029340 | 2008-02-11 | US20080190542A1 | 2008-08-14 | Wei-Hsing TUAN |
| A method of manufacturing a ceramic/metal composite structure includes the steps of: performing a multi-stage pre-oxidizing process on a copper sheet; placing the copper sheet on a ceramic substrate; and heating the copper sheet and the ceramic substrate to a joining temperature to join the copper sheet and the ceramic substrate together. | ||||||
| 32 | Method of Bonding Metals to Ceramics | US11565313 | 2006-11-30 | US20070231590A1 | 2007-10-04 | John B. Blum |
| A metal layer is bonded to a ceramic substrate in a method, wherein a first metal layer (e.g., a copper film) is first applied to a surface of the ceramic substrate. The ceramic substrate, with the first metal layer applied thereto, is then heated in an atmosphere including oxygen (e.g., to a temperature below the eutectic temperature of the metal oxide) to form an adhesion-promotion layer. A second metal layer (e.g., a copper foil) is then bonded to the adhesion-promotion layer. Where the metal is copper, the adhesion promotion layer can include copper oxide and copper aluminum oxide. | ||||||
| 33 | Metal-ceramic joined article and production method | US11145315 | 2005-06-03 | US20050271891A1 | 2005-12-08 | Kaoru Kuzuoka; Katsunori Yamada; Takao Kobayashi |
| A metal-ceramic joined article comprises a ceramic member, a thin metal layer joined onto the surface of the ceramic member and a surface layer, formed on the surface of the thin metal layer, having the function to prevent carbon and/or nitrogen diffusing into the thin metal layer. The thin metal layer contains a first oxide film forming element capable of forming a first oxide film having the function to suppress carbon and/or nitrogen from diffusing into the thin metal layer, and the surface layer preferably comprises the first oxide film formed by oxidizing the surface of the thin metal layer before joining. | ||||||
| 34 | Gas-tight metal/ceramic or metal/metal seals for applications in high temperature electrochemical devices and method of making | US10260630 | 2002-09-27 | US20040060967A1 | 2004-04-01 | Zhenguo Yang; Christopher Andrew Coyle; Suresh Baskaran; Lawrence Andrew Chick |
| A method of joining metal and metal, or metal and ceramic parts, wherein a first metal part is selected and then processed to form a bond coat that will effectively bond to a sealing material which in turn bonds to a second metal or ceramic part without degrading under the operating conditions of electrochemical devices. Preferred first metal parts include alumina forming alloys from the group consisting of ferritic stainless steels (such as Fecralloys), austinetic stainless steels, and superalloys, and chromia forming alloys formed of ferritic stainless steels. In the case of chromia forming ferritic stainless steels, this bond coat consists of a thin layer of alumina formed on the surface, with a diffusion layer between the first metal part and this thin layer. The bond coat provides a good bonding surface for a sealing layer of glass, braze or combinations thereof, while at the same time the diffusion layer provides a durable bond between the thin alumina layer and the first metal part. In the case of alumina forming alloys, the bond coat consists of cauliflower-like growths of an aluminum oxide nodules embedded in the surface of the alumina forming alloys. | ||||||
| 35 | Metal ceramic composite structure | US387390 | 1995-02-13 | US5543130A | 1996-08-06 | Nobuo Tsuno; Tomoyuki Fujii |
| A multi-layer metal-ceramic material including an alumina layer and a metallic layer including an Mg-containing alloy. The alumina layer and metallic layer are bonded together via a reaction layer including MgAl.sub.2 O.sub.4 spinel. The alumina and metallic layers are pressed together and heated to a temperature below the solidus of the Mg-containing alloy, whereby the Mg migrates through the metallic layer to the interface and reacts with the alumina layer to form the spinel reaction layer. The bonded interface is excellent in resistance to Na attack. | ||||||
| 36 | Metal-ceramic structure with intermediate high temperature reaction barrier layer | US984613 | 1992-12-02 | US5290333A | 1994-03-01 | Herman F. Nied; Richard L. Mehan |
| A Si--SiC ceramic layer is bonded to a non-porous SiC substrate with the Si etched from the layer to form a relatively porous surface on the otherwise non-porous high strength SiC substrate. A quartz layer is softened by heating and forced into the pores of the porous layer to form a mechanical bond to the SiC substrate. A refractory metal layer is bonded to the quartz layer to complete the joint. A refractory metal support component is then bonded to the refractory layer whereby the quartz serves as a high strength, high temperature reaction barrier between the metal of the refractory layer and the silicon of the SiC substrate. | ||||||
| 37 | Eutectic bonding of metal to ceramic | US699534 | 1991-05-14 | US5108026A | 1992-04-28 | Ming-Yih Su; John W. Somers |
| An improved eutectic oxide bonding method is applied for bonding a metallic copper foil to a nonmetallic substrate by forming a liquid phase derived from a eutectic oxide composition. A metallic copper thin film is initially deposited onto the substrate and heated in a low oxygen atmosphere under suitable conditions to form a cuprous oxide film. A metallic copper foil is positioned on the substrate in contact with the cuprous oxide film. Preferably, the assembly is initially heated at a temperature below the eutectic melting point to soften the foil and promote intimate contact between the foil and the cuprous oxide film. Thereafter, the assembly is heated above the eutectic melting point to form a liquid phase at the interface of the foil and the cuprous oxide film, and maintained at the temperature for a time sufficient to dissolve the oxide film, whereupon the liquid phase wets the substrate. The assembly is cooled, and the liquid phase is solidified to bond the foil to the substrate. In addition to copper, the method may be adopted to bond foils of other metals, including chromium, iron, cobalt and nickel, using low melting eutectic oxides thereof. | ||||||
| 38 | Joined metal composite and method for production thereof | US368166 | 1989-06-16 | US4985097A | 1991-01-15 | Kazuo Matsumura; Mitsuhiro Nagata; Tadashi Tanaka |
| Disclosed is a joined ceramic-metal composite having a copper sheet directly joined to a ceramic substrate and a method for the production thereof. This composite is characterized by having a plurality of parallel grooves formed on the surface of the copper sheet to be joined to the ceramic substrate. The products of this invention show substantially none of the defects such as blisters inflicated on the copper sheet during the course of union by heating and, therefore, serve advantageously as ceramic circuit substrates for use in transistor modules, for example. | ||||||
| 39 | Method for directly bonding ceramic and metal members and laminated body of the same | US41335 | 1987-04-22 | US4849292A | 1989-07-18 | Nobuyuki Mizunoya; Hajime Kohama; Yasuyuki Sugiura |
| A laminated body comprising a ceramic member and a metal member, and a method of forming the laminated body are described. The laminated body is characterized in that the ceramic member contains in its surface portion a bonding agent and the metal member is directly bonded to the surface of the ceramic member. The method of forming the laminated body is characterized in that a bonding agent-containing layer is first formed in the surface of the ceramic member and then the bonding agent-containing layer is heated while being contacted with the metal member. | ||||||
| 40 | Ceramic bonded structure and method of manufacturing the same | US599579 | 1984-04-12 | US4542073A | 1985-09-17 | Shun-ichiro Tanaka; Nobuyuki Mizunoya; Shigeo Abe |
| A ceramic bonded structure with a high bonding strength has a first member of a ceramic, a ceramic-modified bonding layer formed on at least a bonding surface of the first member by a thermal treatment, a metal layer formed on the ceramic-modified bonding layer, and a second member of a ceramic or metal bonded with the first member through the metal layer. | ||||||
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