子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 121 | Plate heat exchanger | US14382668 | 2013-03-28 | US09694435B2 | 2017-07-04 | Per Sjödin; Kristian Walter |
| Disclosed is a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1100° C., provided beside each other and forming a plate package with first plate interspaces for a first medium and second plate interspaces for a second medium, wherein the first and second plate interspaces are provided in an alternating order in the plate package. Each heat exchanger plate comprises a heat transfer area and an edge area which extend around the heat transfer area. The heat transfer area comprises a corrugation of elevations and depressions, wherein said corrugation of the plates are provided by pressing the plates. Also disclosed is a plate heat exchanger produced by the method. | ||||||
| 122 | Plate heat exchanger | US14382639 | 2013-03-27 | US09694434B2 | 2017-07-04 | Per Sjödin; Kristian Walter |
| Disclosed is a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1100° C., provided beside each other and forming a plate package with first plate interspaces for a first medium and second plate interspaces for a second medium, wherein the first and second plate interspaces are provided in an alternating order in the plate package, wherein each heat exchanger plate comprises a heat transfer area and an edge area comprising bent edges which extend around the heat transfer area, wherein a first surface of the plates forms a convex shape and a second surface of the plates forms a concave shape, wherein the heat transfer area comprises a corrugation of elevations and depressions, wherein said corrugation of the plates and the bent edges are provided by pressing the plates. Also disclosed is a plate heat exchanger produced by the method. | ||||||
| 123 | METHOD FOR MANUFACTURING SHEET METAL BLANKS, IN PARTICULAR HYBRID SHEET METAL BLANKS | US15006516 | 2016-01-26 | US20160214162A1 | 2016-07-28 | Gerhard ALBER |
| Method for manufacturing sheet metal blanks, in particular hybrid sheet metal blanks, a first sheet metal part being manufactured from a first sheet metal part material, a second sheet metal part being manufactured from a second sheet metal part material, an elongate connecting sheet metal strip being provided, and the connecting sheet metal strip being connected along a first longitudinal edge to the first sheet metal part by a thermal joint, and the connecting sheet metal strip being connected along a second longitudinal edge to the second sheet metal part by means of a preferably thermal joint, characterized in that, in a first process step, the connecting sheet metal strip is connected to the first sheet metal part and, in a second process step, the connecting sheet metal strip is connected to the second sheet metal part, the first and the second process steps taking place within a production line. | ||||||
| 124 | BRAZE ALLOY LAYERED PRODUCT | US14388552 | 2013-03-27 | US20150093188A1 | 2015-04-02 | Per Sjödin; Kristian Walter |
| The present invention relates to a method for providing a braze alloy layered product comprising the following steps: —applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; —heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product. | ||||||
| 125 | Method for applying soft solder to a mounting surface of a component | US13578327 | 2011-02-22 | US08745858B2 | 2014-06-10 | Dominic Schroeder; Matthias Schroeder |
| The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface. | ||||||
| 126 | METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEANS OF SOLID STATE DIFFUSION OR PHASE TRANSFORMATION | US14232911 | 2011-08-30 | US20140154867A1 | 2014-06-05 | Klaus Martinschitz; Markus Wimplinger; Bernhard Rebhan; Kurt Hingerl |
| A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused. | ||||||
| 127 | GLAZING WITH A SOLDERED CONNECTOR | US13261769 | 2012-05-02 | US20140138155A1 | 2014-05-22 | Michael Lyon; Naotaka Ikawa; Kazuo Inada; Mamoru Yoshida; Takashi Muromachi; Kazuhisa Ono; Kozo Okamoto; Takashi Suzuki |
| A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing. | ||||||
| 128 | Wafer-level chip scale package | US13361716 | 2012-01-30 | US08710664B2 | 2014-04-29 | Efren M. Lacap; Subhash Rewachand Nariani; Charles Nickel |
| A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more solder layers into the socket, or optionally, depositing a base metal layer into the socket and applying the solder layer to the base metal layer. The geometry of a solder bars may be rectangular, square, or other regular or irregular geometry. Solder bars provide a greater utilization of the connectivity footprint and increase the electrical and thermal flow capacity. Solder bars also provide a robust connection. | ||||||
| 129 | Compositions and methods for dissimilar material welding | US12303674 | 2007-08-27 | US08695868B2 | 2014-04-15 | Barry Messer; Shawn Seitz |
| Devices and methods of welding dissimilar materials are contemplated in which an adaptor is used in an intermediate position between the dissimilar materials. Most preferred adaptors are manufactured by friction stir welding from two dissimilar materials that are identical or similar to the dissimilar materials to be welded together. Therefore, coupling of dissimilar materials in the field via the adaptors is greatly simplified as conventional welding methods can now be employed. | ||||||
| 130 | LAMINATE AND METHOD FOR PRODUCING LAMINATE | US13885862 | 2011-11-17 | US20130236738A1 | 2013-09-12 | Yuichiro Yamauchi; Shinji Saito; Masaru Akabayashi; Satoshi Hirano |
| It is possible to obtain a laminate having high adhesion strength between ceramic and a metal coating by providing the following: an insulating ceramic substrate; an intermediate layer formed on the surface of the ceramic substrate and having a metal-containing principal component metal layer and an active ingredient layer including metal, a metal oxide, or a metal hydride; and a metal coating formed on the surface of the intermediate layer by accelerating a metal-containing powder with gas, and depositing the same on the surface thereof by spraying while in a solid state. | ||||||
| 131 | Wafer-Level Chip Scale Package | US13361716 | 2012-01-30 | US20130026638A1 | 2013-01-31 | Efren M. Lacap; Subhash Rewachand Nariani; Charles Nickel |
| A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more solder layers into the socket, or optionally, depositing a base metal layer into the socket and applying the solder layer to the base metal layer. The geometry of a solder bars may be rectangular, square, or other regular or irregular geometry. Solder bars provide a greater utilization of the connectivity footprint and increase the electrical and thermal flow capacity. Solder bars also provide a robust connection. | ||||||
| 132 | X-ray tube target, X-ray tube using the same, X-ray inspection device and method of producing X-ray tube target | US12985631 | 2011-01-06 | US08149992B2 | 2012-04-03 | Akihisa Nitta; Shinichi Yamamoto; Hiromichi Horie |
| According to one embodiment, there is provided an X-ray tube target. The X-ray tube target has a structure in which a carbon base material is bonded with an Mo base material or Mo alloy base material with a joint layer. The joint layer includes an MoNbTi diffusion phase, an NbTi alloy phase, an Nb-rich phase and a ZrNb alloy phase when the ratios of components in the joint layer are detected by EPMA. | ||||||
| 133 | PROCESS FOR FLUXLESS BRAZING OF ALUMINIUM AND BRAZING FILLER ALLOY FOR USE THEREIN | US13099052 | 2011-05-02 | US20110204124A1 | 2011-08-25 | Adrianus Jacobus WITTEBROOD |
| This relates to a process for controlled atmosphere brazing including, brazing an aluminium alloy without flux in a controlled atmosphere, while using brazing sheet including an aluminium alloy core upon which on at least one side a layer of filler alloy is clad, the filler clad layer having an inner-surface and an outer-surface, the inner-surface is facing the core, and wherein the filler alloy has a composition which is Na-free, Li-free, K-free, and Ca-free, and including, in wt. %: Si 3% to 15%, Cu 0.3% to 5%, Mg 0.05% to 1%, one or more elements selected from the group of: Bi, Pb, and Sb, and the sum of these elements being 0.35% or less, Fe 0 to 0.6%, Mn 0 to 1.5%, the balance aluminium. | ||||||
| 134 | Diffusion soldered semiconductor device | US10551745 | 2004-03-31 | US07851910B2 | 2010-12-14 | Edmund Riedl |
| The invention relates to a process for the multi-stage production of diffusion-soldered joints for power components with semiconductor chips, the melting points of diffusion-soldering alloys and diffusion-soldered joints being staggered in such a manner that a first melting point of the first diffusion-soldering alloy is lower than a second melting point of the second diffusion-soldering alloy, and the second melting point being lower than a third melting point of a first diffusion-soldered joint of the first diffusion-soldering alloy. | ||||||
| 135 | METHODS OF JOINING AND MATERIAL DEPOSITION FOR A WORKPIECE WITH A WORKPIECE AREA MADE FROM A TITANIUM-ALUMINIDE ALLOY | US12682330 | 2008-10-10 | US20100297468A1 | 2010-11-25 | Ulrike Hecht; Victor Vituesevych; Christian Holzschuh |
| The invention concerns a method to create fusion-integrated joints of workpieces, in which a workpiece area formed on a workpiece made from a TiAl alloy and a workpiece area formed on another workpiece made from a TiAl alloy or a different high temperature material are joined in a joint area using a joining additive, where the joining additive contains at least one of the elements gallium and indium. The invention also concerns a method to create a material deposit on a workpiece, in which a deposit material is applied to a workpiece area made from a TiAl alloy, where a fusion-integrated joint is produced between the deposit material and the workpiece area, where the deposit material contains at least one of the elements gallium and indium and a filler material. | ||||||
| 136 | Light emitting device and method of fabricating light emitting device | US11883078 | 2006-01-26 | US07829910B2 | 2010-11-09 | Hitoshi Ikeda; Masayoshi Obara |
| Each second electrode formed on a second main surface of a compound semiconductor layer of a light emitting device has an alloyed contact layer disposed contacting the second main surface, aimed at reducing contact resistance with the compound semiconductor layer, and a solder layer connecting the alloyed contact layer to the conductive support. The solder layer forms therein a Sn-base solder layer disposed on the alloyed contact layer side having a melting point lower than the alloyed contact layer, and a Au—Sn-base solder layer disposed contacting the Sn-base solder layer opposed to the alloyed contact layer side, containing total Au and Sn of 80% or more, and having a melting point higher than the Sn-base solder layer. This configuration can provide excellent reliability of bonding between the Au—Sn-base solder layer and the alloyed contact layer, and consequently less causative of delamination of the Au—Sn-base solder layer. | ||||||
| 137 | METHOD FOR THE PERMANENT CONNECTION OF TWO COMPONENTS BY MEANS OF GLASS OR METAL SOLDER | US12666310 | 2008-06-23 | US20100276473A1 | 2010-11-04 | Jan Hagen; Thorsten Faber; Ralner Kubler; Gunter Kleer |
| The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof. | ||||||
| 138 | Solder preform and a process for its manufacture | US12073690 | 2008-03-07 | US07793820B2 | 2010-09-14 | Naohiko Hirano; Akira Tanahashi; Yoshitsugu Sakamoto; Kaichi Tsuruta; Takashi Ishii; Satoshi Soga |
| A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example. | ||||||
| 139 | METHODS AND DESIGNS FOR FORMING JOINTS BETWEEN METALLIC MEMBERS | US12635542 | 2009-12-10 | US20100176095A1 | 2010-07-15 | HANCUN CHEN; MICHAEL STERUD; SYED NAVEED; VERIVADA CHANDRASEKARAN; VITTO MONNI |
| Disclosed are methods and structures for joining metallic members. A welding material can be used between two metallic members that comprise different metals. The different metals can normally form brittle intermetallic compounds when welded to one another, and the welding material can inhibit the formation of the brittle intermetallic compounds. | ||||||
| 140 | Workpiece structure modification | US10528966 | 2003-09-11 | US07667158B2 | 2010-02-23 | Bruce Guy Irvine Dance; Ewen James Crawford Kellar |
| A method of modifying the structure of workpiece (1) is provided. The method comprises a first step of causing relative movement between a power beam and the workpiece (1) so that a region (3) of the workpiece (1) is melted and the melted material displaced to form a projection (2) at a first location in the region (3) and a hole (4) at a different location in the region. The melted material is then allowed to at least partially solidify after which the first step is repeated one or more times, with the region corresponding to each repeat intersecting the region (3) of the first step. | ||||||
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