子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | JOINT STRUCTURE, JOINING METHOD, WIRING BOARD AND METHOD FOR PRODUCING THE SAME | US12440986 | 2006-09-14 | US20090264028A1 | 2009-10-22 | Toshiaki Chuma |
| A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part. | ||||||
| 142 | SOLDER BALL ATTACHMENT RING AND METHOD OF USE | US11946056 | 2007-11-28 | US20090134207A1 | 2009-05-28 | Poh Leng EU; Lan Chu TAN; Cheng Qiang CUI |
| A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained. | ||||||
| 143 | LOW LEAD SOLDERABLE PLUMBING COMPONENTS | US12141361 | 2008-06-18 | US20080318079A1 | 2008-12-25 | George J. Ballantyne; Benjamin L. Lawrence |
| Plumbing valves, fittings, and other water handling devices are manufactured of a metal, such as silicon bronze, having a lead content below 0.2%. Such devices are subsequently electroplated with a galvanizing solution including saline or alkaline solutions containing nickel and tin. The resultant plated products can be soldered to the remaining copper components of a plumbing system using conventional lead-free solder. | ||||||
| 144 | Method for the Multi-Stage Production of Diffusion Soldered Connections for Power Components Comprising Semiconductor Chips | US10551745 | 2004-03-31 | US20080014460A1 | 2008-01-17 | Edmund Riedl |
| The invention relates to a process for the multi-stage production of diffusion-soldered joints for power components with semiconductor chips, the melting points of diffusion-soldering alloys and diffusion-soldered joints being staggered in such a manner that a first melting point of the first diffusion-soldering alloy is lower than a second melting point of the second diffusion-soldering alloy, and the second melting point being lower than a third melting point of a first diffusion-soldered joint of the first diffusion-soldering alloy. | ||||||
| 145 | Process for producing composite body | US10574515 | 2004-09-29 | US20070119907A1 | 2007-05-31 | Peter Rödhammer |
| A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of one or more elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each nonmetallic component which is to be soldered. Solder material, barrier layer and soldering conditions are adapted to one another in such a manner that during the soldering operation the metallic barrier layer remains at least partially in the solid state, so that after the soldering operation it is still present in a thickness of at least 10 μm at least over the majority of the soldering surface. | ||||||
| 146 | SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same | US10949522 | 2004-09-27 | US07219825B2 | 2007-05-22 | Won-kyoung Choi; Su-hee Chae; Joon-seop Kwak |
| Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is formed of a compound including a first element through a third element, in which the first and third elements together form a compound having a plurality of intermediate phases and solidus lines. | ||||||
| 147 | Method of joining components using amorphous brazes and reactive multilayer foil | US11342450 | 2006-01-30 | US20070023489A1 | 2007-02-01 | Albert Swiston; Timothy Weihs; Todd Hufnagel |
| In accordance with the invention, a first body is joined to a second body by joining a first amorphous braze layer to a surface of the first body and joining a second amorphous braze layer to a surface of the second body. A reactive multilayer foil is then disposed between the first and second amorphous braze layers. The layers are pressed together and the foil is ignited. Since the bodies can be joined to the braze layers by processes that do not require a furnace and the braze-coated bodies can be joined by the foil without a furnace, the method can produce strong brazed joints in typical workshop and field environments. Preferably the amorphous braze is a bulk metallic glass. | ||||||
| 148 | Joining method by Au-Sn brazing material | US11055945 | 2005-02-11 | US20050184135A1 | 2005-08-25 | Kenichi Miyazaki |
| The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining is from 20.65 to 23.5 wt %. The invention has been completed on the basis of the discovery that the true eutectic point of this alloy system corresponds to 20.65 wt % Sn. In the invention, as means for adjusting the composition of a resulting joint, it is necessary to appropriately adjust the composition and thickness of a brazing material according to the thickness of a gold plating. In the invention, the relationship between the brazing material thickness and the gold plating thickness is shown when the brazing material to be used has an Sn content of 21 wt % to 25 wt %. | ||||||
| 149 | Ultrasonic bonding process for making a microfluid device | US10851309 | 2004-05-21 | US06928731B2 | 2005-08-16 | Hue P. Le; Hoi P. Le; Thanh P. Le; Linh B. Tran |
| A piezoelectric ceramic ink-jet print head is made by an inventive ultrasonic bonding process. Specifically, there are several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is an ultrasonic bonding process joining metallic objects with ultrasonic energy. | ||||||
| 150 | Method of controlling thermal waves in reactive multilayer joining and resulting product | US10843352 | 2004-05-12 | US20050136270A1 | 2005-06-23 | Etienne Besnoin; Jiaping Wang; Alan Duckham; Stephen Spey; David Heerden; Timothy Weihs; Omar Knio |
| An embodiment of the invention includes a method of simulating a behavior of an energy distribution within a soldered or brazed assembly to predict various physical parameters of the assembly. The assembly typically includes a reactive multilayer material. The method comprises the steps of providing an energy evolution equation having an energy source term associated with a self-propagating reaction that originates within the reactive multilayer material. The method also includes the steps of discretizing the energy evolution equation, and determining the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using other parameters associated with the assembly. | ||||||
| 151 | Transient eutectic phase process for ceramic-metal bonding metallization and compositing | US10467006 | 2002-01-14 | US20050098609A1 | 2005-05-12 | Victor Greenhut; Thomas Chapman |
| A method for directly joining ceramics (10) and metals (12). The method involves forming a structure having a ceramic component (10), a more refractory metallic component and a less refractory metallic-material-based interlayer (14) disposed between the ceramic component (10) and the metallic component (12); adding a eutectic forming reactant to the metallic interlayer (14); and heating the structure to approximately a eutectic melting temperature of the reactant and the interlayer to form a metallic-material-based eutectic liquid that interacts with the metallic component to form a bond that directly joins the ceramic and metallic components to one another. | ||||||
| 152 | Process and apparatus for producing a turbine component, turbine component and use of the apparatus | US10794459 | 2004-03-05 | US20050005444A1 | 2005-01-13 | Georg Bostanjoglo; Nigel-Philip Cox; Rolf Wilkenhoner |
| Process and apparatus for producing a turbine component, turbine component and use of the apparatus Turbine components have to withstand high thermal and mechanical loads. It therefore proves advantageous for them to be made from a material with a preferred crystal orientation. Hitherto, the turbine components with a preferred crystal orientation have been produced as a single piece, with relatively high scrap rates. The proposed concept makes it possible to produce a preferred turbine component (9, 10) in a particularly simple way by assembling a turbine component (9, 10) at least from a first base part (1) and a build-up material (8), the subregion (7) of the joining zone having a preferred crystal orientation (2), so that disadvantageous properties of a joining zone without a preferred crystal orientation (2) which have hitherto been encountered are avoided. | ||||||
| 153 | Solder application technique | US10419071 | 2003-04-21 | US06840432B1 | 2005-01-11 | Michael M. Ramarge; David P. Bailey; Thomas C. Hartman |
| A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces. | ||||||
| 154 | Methods for preparing brazeable metallizations for diamond components | US09965478 | 2001-09-27 | US06830780B2 | 2004-12-14 | Ronald Petkie |
| A multilayer brazeable metallization structure for diamond components and method for producing it are described. The brazeable metallization finds particular application for the attachment of diamond components such as heat spreaders in electronic packages that incorporate high power semiconductor devices. In the present invention, a diamond component is provided with a multilayer coating of metals including depositing a first layer of chromium for adhesion onto at least a portion of the diamond component, depositing a second barrier layer of a refractory metal for a barrier onto at least portion of the chromium layer, and a top layer of copper, silver or gold for wetting. This top layer is thick (greater than 5 microns), without sacrificing resistance to delamination, particularly at brazing conditions. It is obtained by depositing a layer of a first metal onto at least a portion of the refractory metal layer, and depositing a layer of a second metal onto at least a portion of the first metal layer. The refractory metals for the barrier layer include tungsten, molybdenum, tantalum, niobium, or tungsten-chromium alloy. This multilayer metallization structure provides a robust interface between diamond and standard brazing alloys which are used to join the diamond to electrical leads or a flange made of metals such as copper-tungsten. The interfacial adhesion between the metallization and the diamond is sufficient to withstand exposure to brazing at temperatures less than or equal to 1,100° C. in inert gas atmospheres that may contain hydrogen. | ||||||
| 155 | Microfluid device and ultrasonic bonding process | US10272519 | 2002-10-15 | US06783213B2 | 2004-08-31 | Hue P. Le; Hoi P. Le; Thanh P. Le; Linh B. Tran |
| There is disclosed a piezoelectric ceramic ink-jet print head and made by an inventive ultrasonic bonding process. Specifically, there are disclosed several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is disclosed an ultrasonic bonding process joining metallic objects with ultrasonic energy. | ||||||
| 156 | Braze system and method for reducing strain in a braze joint | US10112792 | 2002-03-28 | US20030234280A1 | 2003-12-25 | Charles H. Cadden; Steven H. Goods; Vincent C. Prantil |
| A system for joining a pair of structural members having widely differing coefficients of thermal expansion is disclosed. A mechanically nullthicknull foil is made by dispersing a refractory metal powder, such as molybdenum, niobium, tantalum, or tungsten into a quantity of a liquid, high expansion metal such as copper, silver, or gold, casting an ingot of the mixture, and then cutting sections of the ingot about 1 mm thick to provide the foil member. These foil members are shaped, and assembled between surfaces of structural members for joining, together with a layer of a braze alloy on either side of the foil member capable of wetting both the surfaces of the structural members and the foil. The assembled body is then heated to melt the braze alloy and join the assembled structure. The foil member subsequently absorbs the mechanical strain generated by the differential contraction of the cooling members that results from the difference in the coefficients of thermal expansion of the members. | ||||||
| 157 | Solder joints with low consumption rate of nickel layer | US10414043 | 2003-04-16 | US20030219623A1 | 2003-11-27 | Cheng Heng Kao; Cheng En Ho; L. C. Shiau |
| A solder joint structure comprises a solder of a Sn alloy especially having Cu element contained therein, a contact region having a Ni layer been composed therein. In which, by means of controlling the Cu concentration to select an interface reaction product for reducing the consumption rate of the Ni layer of the contact region so as to provide an durable strength therefore. | ||||||
| 158 | Solder compositions for attaching a die to a substrate | US10145503 | 2002-05-14 | US20030215981A1 | 2003-11-20 | Floyd Strouse; Lori D. Carroll Shearer; Brant Besser |
| A method for attaching a die (11) to a substrate (15) is provided. In accordance with the method, a die and a substrate are provided which are to be connected to each other across first and second surfaces. The first and second surfaces are contacted with a liquid solder composition (21) having a maximum melting temperature Tm1, of less than about 100 C. The liquid solder composition is contacted with a freezing agent (17 or 19) such that a second composition is formed which has a maximum melting temperature Tm2, wherein T2nullTm1 is at least about 25null C. | ||||||
| 159 | Reaction brazing of tungsten or molybdenum body to carbonaceous support | US09900252 | 2001-07-06 | US06554179B2 | 2003-04-29 | Mervyn H. Horner; Paul W. Trester; Peter G. Valentine |
| Reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous supports enables an x-ray generating anode to be joined to a preferred lightweight substrate. Complementary surfaces are provided on a dense refractory metal body and a graphite or a carbon-carbon composite support. A particulate braze mixture comprising Hf or Zr carbide, Mo or W boride, Hf or Zr powder and Mo or W powder is coated onto the support surface, and hafnium or zirconium foil may be introduced between the braze mixture and the refractory metal body complementary surface. Reaction-brazing is carried out at or near the eutectic point of the components, which may be influenced to some extent by the presence of carbon and boride. Heating to about 1865° C. for a Mo/Hf combination creates a thin, dense, strong braze that securely joins the two bodies and creates a thin barrier of carbide and boride microphases near and along the interface with the carbon support that diminishes carbon diffusion into the metal body during extended exposures at elevated temperatures (above those presently used in x-ray tubes), even well above the eutectoid temperature. | ||||||
| 160 | Connection structure for metallic members and connecting method therefor | US09784454 | 2001-06-11 | US06534195B1 | 2003-03-18 | Kazunori Takikawa; Masayuki Narita |
| Sn—Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn—Ag alloy is used as a solder, the first metallic member and the second metallic member are connected by the solder, and a connection structure of metallic members is therefore produced. Heat degradation of plating and the contact corrosion between solder and plating can thereby be prevented, solderability can be improved, and qualities such as corrosion resistance and connecting strength at the connection structure can be improved. | ||||||
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