| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 61 | Ultrananocrystalline Diamond Films With Optimized Dielectric Properties For Advanced RF MEMS Capacitive Switches | US13708401 | 2012-12-07 | US20140167168A1 | 2014-06-19 | Anirudha V. Sumant; Orlando H. Auciello; Derrick C. Mancini |
| An efficient deposition process is provided for fabricating reliable RF MEMS capacitive switches with multilayer ultrananocrystalline (UNCD) films for more rapid recovery, charging and discharging that is effective for more than a billion cycles of operation. Significantly, the deposition process is compatible for integration with CMOS electronics and thereby can provide monolithically integrated RF MEMS capacitive switches for use with CMOS electronic devices, such as for insertion into phase array antennas for radars and other RF communication systems. | ||||||
| 62 | Ultrananocrystalline Diamond Films with Optimized Dielectric Properties for Advanced RF MEMS Capacitive Switches | US13080255 | 2011-04-05 | US20120193684A1 | 2012-08-02 | Anirudha V. Sumant; Orlando H. Auciello; Derrick C. Mancini |
| An efficient deposition process is provided for fabricating reliable RF MEMS capacitive switches with multilayer ultrananocrystalline (UNCD) films for more rapid recovery, charging and discharging that is effective for more than a billion cycles of operation. Significantly, the deposition process is compatible for integration with CMOS electronics and thereby can provide monolithically integrated RF MEMS capacitive switches for use with CMOS electronic devices, such as for insertion into phase array antennas for radars and other RF communication systems. | ||||||
| 63 | Method and apparatus for an actuator system having buried interconnect lines | US11097599 | 2005-04-01 | US07741685B1 | 2010-06-22 | Clifford F. Knollenberg; Michael Albert Helmbrecht |
| A micromachined actuator including a body or platform mounted to a suspension system anchored to a substrate. In one embodiment, the suspension system is comprised of a set of one or more spring flexures connecting the actuator body to the substrate with strain relief provided via connecting torsional elements. In another embodiment, the suspension system includes a first set of one or more spring flexures each with one end anchored to a largely rigid intermediate frame and the other end attached to the body. A second set of one or more flexures is attached between the intermediate frame and the substrate. A third actuator embodiment maximizes force electrode area to minimize voltage required for electrostatic actuation. A fourth embodiment provides electrical interconnect to an actuator or an actuator array using polysilicon with silicon nitride isolation. Actuators may be fabricated by combining the key features of all four embodiments or actuators may be fabricated using any combination of two or three of the embodiments. | ||||||
| 64 | Swtich, Method and System For Switching The State of a Signal Path | US12087962 | 2007-01-19 | US20090314616A1 | 2009-12-24 | Joachim Oberhammer |
| The invention relates to a method, a system and a multi stable arranged to switch the configuration of the signal path for electrical signals comprising a first moving element (12) and a second moving element (14), wherein the first and second element can be arranged into at least two mechanically stable states: a mechanical interlocked state, wherein the first moving element is mechanically interlocked with the second moving element wherein a signal path in the switch is arranged in a closed configuration; and a non interlocked state, wherein the first moving element is separated from the second moving element and the signal path in the switch is arranged in an open configuration; wherein the switch further comprises a fixated electrostatic electrode (10) configured with a first fixated electrode part arranged to actuate and move at least one of the moving elements when an electrical potential difference is applied between the first fixated electrode and at least one of the moving elements, transitioning the moving elements from one state to another. | ||||||
| 65 | Micro electromechanical switch and method of manufacturing the same | US11375518 | 2006-03-14 | US07463126B2 | 2008-12-09 | Takahiro Masuda; Tomonori Seki |
| A micro electromechanical relay opens and closes an electrical circuit by contact/separation between a fixed contact disposed on a base and a movable contact disposed on an actuator by driving of a movable electrode by electrostatic attraction by application of voltage between a fixed electrode disposed on the base and a movable electrode of the actuator. The actuator comprises a supporting portion disposed on the base, a beam portion extending in a cantilevered manner from the supporting portion, and a movable electrode and a movable contact elastically supported by the beam portion. The beam portion elastically supports, in order from the supporting portion end, the movable electrode and the movable contact. A slit is formed from the side of the supporting portion in the portion of the actuator connecting the beam portion and the movable electrode. | ||||||
| 66 | High Frequency Mems Switch Having a Bent Switching Element and Method for its Production | US10590699 | 2005-02-25 | US20070215446A1 | 2007-09-20 | Ulrich Prechtel; Volker Ziegler |
| A high-frequency MEMS switch comprises a signal conductor which is arranged on a substrate and an oblong switching element which has a bent elastic bending area and is fastened on the substrate in a cantilevered manner. An electrode arrangement generates an electrostatic force which bends the switching element toward the signal conductor. The switching element is arranged longitudinally parallel to the signal conductor, and has a contact area which extends transversely to the switch element over the signal conductor. Under the effect of the electrostatic force, the elastic bending area of the switching element progressively approaches the electrode arrangement in a direction parallel to the signal line. The switching element has, for example, two mutually parallel extending switching arms, which are mutually connected by a bridge as the contact area and are arranged on both sides of the signal line and parallel thereto. | ||||||
| 67 | Micro-electro mechanical switch designs | US11092462 | 2005-03-29 | US07218191B2 | 2007-05-15 | Carl O. Bozler; Shaun R. Berry; Jeremy Muldavin; Craig L. Keast |
| A capacitive RF switch and DC RF switch include a fixed electrode having a thin layer of metal and at least one pull-down electrode. A moving plate has a plurality of corrugations and a selective finger design. The capacitive switch includes a selective finger that comes into contact with the fixed electrode so as to minimize the stiction between the moving plate and the fixed electrode when the switch is closed. The DC switch comprises a plurality of dimples that are formed on the selective portion of the moving plate and are positioned to come into contact with the fixed electrode when the switch is closed so as to increase the contact force and lower the resistance between the moving plate and fixed electrode. | ||||||
| 68 | Component comprising a variable capacitor | US11442420 | 2006-05-26 | US20060213044A1 | 2006-09-28 | Fabrice Casset; Guillaume Bouche; Maurice Rivoire |
| A variable capacitor having a groove portion formed in an insulating substrate, two upper portions of the substrate located on either side of the groove portion forming two lateral edges, a conductive layer covering the inside of the groove portion, a flexible conductive membrane, placed above the groove portion by bearing on the edges, a dielectric layer covering the conductive layer or the membrane to insulate the conductive layer and the membrane, and terminals of application of a voltage between the conductive layer and the membrane, and such that the depth of the groove portion continuously increases from one of the edges to the bottom of the groove portion, and that the conductive layer covers the inside of the groove portion at least to reach one of the two edges, that it may cover. | ||||||
| 69 | Micro electromechanical switch and method of manufacturing the same | US11375518 | 2006-03-14 | US20060208837A1 | 2006-09-21 | Takahiro Masuda; Tomonori Seki |
| A micro electromechanical relay opens and closes an electrical circuit by contact/separation between a fixed contact disposed on a base and a movable contact disposed on an actuator by driving of a movable electrode by electrostatic attraction by application of voltage between a fixed electrode disposed on the base and a movable electrode of the actuator. The actuator comprises a supporting portion disposed on the base, a beam portion extending in a cantilevered manner from the supporting portion, and a movable electrode and a movable contact elastically supported by the beam portion. The beam portion elastically supports, in order from the supporting portion end, the movable electrode and the movable contact. A slit is formed from the side of the supporting portion in the portion of the actuator connecting the beam portion and the movable electrode. | ||||||
| 70 | Electroplating pcb components | US10548277 | 2004-03-08 | US20060175203A1 | 2006-08-10 | Timothy Davis; Breet Sexton |
| Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath. | ||||||
| 71 | Switch | US10490395 | 2004-04-07 | US20040239455A1 | 2004-12-02 | Yoshito Nakanishi; Kunihiko Nakamura |
| A switch that is capable of responding at a high rate at a lower DC potential while providing high isolation. In this switch, a microstructure group, having microstructures, is used. By slightly moving the microstructures a small amount the group, as a whole, achieves a large amount of movement. Also, by this configuration, it is possible to decrease a DC potential to apply to control electrodes of the microstructures. As a result, a high isolation switch capable of operating at a high rate at a lower DC potential is realized. | ||||||
| 72 | Actuator apparatus and method for improved deflection characteristics | US10705213 | 2003-11-07 | US20040160118A1 | 2004-08-19 | Clifford F. Knollenberg; Michael Albert Helmbrecht |
| A micromachined actuator including a body or platform mounted to a suspension system anchored to a substrate. In one embodiment, the suspension system is comprised of a set of one or more spring flexures connecting the actuator body to the substrate with strain relief provided via connecting torsional elements. In another embodiment, the suspension system includes a first set of one or more spring flexures each with one end anchored to a largely rigid intermediate frame and the other end attached to the body. A second set of one or more flexures is attached between the intermediate frame and the substrate. A third actuator embodiment maximizes force electrode area to minimize voltage required for electrostatic actuation. A fourth embodiment provides electrical interconnect to an actuator or an actuator array using polysilicon with silicon nitride isolation. Actuators may be fabricated by combining the key features of all four embodiments or actuators may be fabricated using any combination of two or three of the embodiments. | ||||||
| 73 | Gradually-actuating micromechanical device | US09895286 | 2001-06-29 | US06707355B1 | 2004-03-16 | Ian Y. K. Yee |
| In a method for forming a micromechanical device, a force associated with operation of the device is varied between locations spaced across a conductive element of the device. The method may be used to form a switch adapted such that a force associated with actuation of the switch varies between locations spaced across a contact element of the switch. The varied force may include a required closing force for the switch, an applied force during actuation of the switch, a restoring force tending to open the switch, and/or a sticking force tending to keep the switch closed. A variable-valued circuit element having a conductive element and conductive pad may also be formed, adapted such that a fraction of the conductive element which is moved to the proximity of the conductive pad is variable depending on a total magnitude of a force applied. | ||||||
| 74 | Microelectromechanic relay and method for the production thereof | US10049260 | 2002-06-26 | US06639325B1 | 2003-10-28 | Helmut Schlaak; Martin Hanke |
| The invention relates to a relay, especially a miniaturized electrostatic relay, comprising a bridge-type make contact. The contact spring is designed as a torsion spring that is linked with a switching spring (3) via multiply bent spring parts (7). It is thus possible in particular to compensate fixed contacts (2) of different heights. The invention further relates to a method for producing the relay as a micro-mechanical electrostatic relay. | ||||||
| 75 | Micro-switching device actuated by low voltage | US10202899 | 2002-07-26 | US20030099081A1 | 2003-05-29 | Jin-Woo Cho |
| A micro-switching device actuated by a low voltage is provided. The micro-switching device includes a spring operating elastically; a membrane formed on one side of the spring, being held by the spring; and a lower electrode formed below the membrane, for generating an electrostatic attraction when a voltage is applied thereto, wherein the membrane is non-planar. This micro-switching device is advantageous in that it can be actuated by a low voltage and prevents the adhesion that occurs commonly in micro devices. | ||||||
| 76 | Microswitch and method of fabricating a microswitch with a cantilevered arm | US09934844 | 2001-08-23 | US06512432B2 | 2003-01-28 | Kenichiro Suzuki |
| A microswitch is realized that can be driven by low voltage, and at the same time, that has increased impedance between switch terminals when the switch is OFF. The relation between upper electrode (4), lower electrode (6), contact electrode (7), and signal lines (8) is arranged such that the minimum distance between contact electrode 7 and signal lines 8 is greater than the minimum distance between upper electrode 4 and lower electrode 6 when the microswitch is in the OFF state. | ||||||
| 77 | MEMS device members having portions that contact a substrate and associated methods of operating | US09822128 | 2001-03-30 | US06496351B2 | 2002-12-17 | Edward A. Hill; Ramaswamy Mahadevan |
| MEMS devices include a substrate, an anchor attached to the substrate, and a multilayer member attached to the anchor and spaced apart from the substrate. The multilayer member can have a first portion that is remote from the anchor and that curls away from the substrate and a second portion that is adjacent the anchor that contacts the substrate. Related methods are also disclosed. | ||||||
| 78 | Electrostatically controlled variable capacitor | US09464010 | 1999-12-15 | US06373682B1 | 2002-04-16 | Scott Halden Goodwin-Johansson |
| A MEMS (Micro Electro Mechanical System) electrostatically operated high voltage variable controlled capacitor device is provided. This device can store high energy over a wide range while using relatively low electrostatic operating voltages. The MEMS device comprises a microelectronic substrate, a substrate signal electrode, and one or more substrate control electrodes. The MEMS device also includes a moveable composite overlying the substrate, having a composite signal electrode, one or more composite control electrodes, and a biasing element. In cross-section, the moveable composite comprises at least one electrode layer and, in most instances, a biasing layer. In length, the moveable composite comprises a fixed portion attached to the underlying substrate and a distal portion moveable with respect to the substrate electrode. The distal and/or medial portions of the moveable composite are biased in position when no electrostatic force is applied. Additionally, the MEMS device comprises insulators to electrically isolate the substrate and electrodes. Applying a variable controlled voltage between the substrate control electrode and moveable composite control electrode, controls the bias of the moveable composite and, in turn, controls the capacitance between the substrate signal electrode and the composite signal electrode. Various embodiments further define the various layering alternatives if the moveable composite, shaping of the electrodes and placement of the electrodes. Additionally, a system for electrostatically controlled variable capacitance comprises a variable controlled voltage source coupled to the control electrodes of the MEMS device of the present invention and a circuit signal electrically coupled to the signal electrodes of the MEMS device. A method of using and a method for making the aforementioned electrostatic MEMS device are also provided. | ||||||
| 79 | Variable capacitor and associated fabrication method | US09461247 | 1999-12-15 | US06229684B1 | 2001-05-08 | Allen Bruce Cowen; Vijayakumar Rudrappa Dhuler; Edward Arthur Hill; David Alan Koester; Ramaswamy Mahadevan |
| A variable capacitor having low loss and a correspondingly high Q is provided. In addition to a substrate, the variable capacitor includes at least one substrate electrode and a substrate capacitor plate that are disposed upon the substrate and formed of a low electrical resistance material, such as HTS material or a thick metal layer. The variable capacitor also includes a bimorph member extending outwardly from the substrate and over the at least one substrate electrode. The bimorph member includes first and second layers formed of materials having different coefficients of thermal expansion. The first and second layers of the bimorph member define at least one bimorph electrode and a bimorph capacitor plate such that the establishment of a voltage differential between the substrate electrode and the bimorph electrode moves the bimorph member relative to the substrate electrode, thereby altering the interelectrode spacing as well as the distance between the capacitor plates. As such, the capacitance of the variable capacitor can be controlled based upon the relative spacing between the bimorph member and the underlying substrate. A method is also provided for micromachining or otherwise fabricating a variable capacitor having an electrode and a capacitor plate formed of a low electrical resistance material such that the resulting variable capacitor has low loss and a correspondingly high Q. The variable capacitor can therefore be employed in high frequency applications, such as required by some tunable filters. | ||||||
| 80 | Apparatus and method for a micromechanical electrostatic relay | US09486261 | 2000-02-22 | US06191671B1 | 2001-02-20 | Helmut Schlaak; Lothar Kiesewetter |
| An apparatus and method for a micromechanical electrostatic relay that includes a base substrate and a carrier layer deposited onto the base substrate. The carrier layer includes an armature and stationary-contact spring tongues that engage each other at their respective free ends. Once engaged, the armature spring tongue moving contacts overlaps the respective stationary-contact spring tongue stationary contacts. During an electrostatic rest state, the armature and stationary-contact spring tongues curve away from the base substrate wherein their respective free ends no longer engage. | ||||||
QQ群二维码
意见反馈
意见反馈