子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | METHOD AND SYSTEM FOR DOUBLE-SIDED PATTERNING OF SUBSTRATES | PCT/US2006046256 | 2006-11-30 | WO2007067488A2 | 2007-06-14 | CHOI BYUNG-JIN; SREENIVASAN SIDLGATA V |
| The present invention is directed towards a method and a system of patterning first and second opposed sides of a substrate. The method and system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly. In a further embodiment, the method and system may employ a first and a second mold assembly. | ||||||
| 162 | PROCESS FOR THE MANUFACTURE OF PRINTING SUPPORT FOR ROLLERS FOR THE PRINTING OF LAMINAR MATERIALS, MACHINE FOR IMPLEMENTING THE PROCESS AND THE PRINTING SUPPORT FOR PRINTING ROLLERS | PCT/IB2006002508 | 2006-09-08 | WO2007031842B1 | 2007-05-31 | RUGGIERO RICARDO ANGEL |
| A printing support is wholly manufactured within an irradiating machine (36) equipped with visible marks located on the lower plate and on the machine (3OB, 30L) . The laminar support supports the plates positioned on a dimensionally stable substrate sheet (23) on which marks are made accurately in the same location relative to the overall image as a reference axis for subsequent positioning on the roller and on which also matching marks (30B) are printed or engraved. Some of these marks are repeated on films which restrict the passage of ultraviolet light (59A, 59A') , one of the films having transparent areas which present elements of one colour of the image which has to be printed (61A) while the remaining film represents mounts surrounding such elements (61A') . | ||||||
| 163 | IMAGE-DRAWING METHOD, IMAGE-DRAWING DEVICE, IMAGE-DRAWING SYSTEM, AND CORRECTION METHOD | PCT/JP2006303534 | 2006-02-21 | WO2006088262A3 | 2007-03-29 | HIRASHIMA TAKUYA |
| A correction method for an image-drawing device which carries out alignment on an object on the basis of reference position data acquired by reading a position reference mark or pattern provided at the object, and which carries out image-drawing on the object in accordance with image data while moving the object in a scanning direction is provided. The correction method carries out correction of an image-drawing position with respect to deformation of the object before correction of an image-drawing position with respect to a position of the object. In this way, a processing ability of the image-drawing device can be improved. | ||||||
| 164 | IMAGE RECORDING DEVICE AND IMAGE RECORDING METHOD | PCT/JP2005018502 | 2005-09-29 | WO2006036019A3 | 2006-12-14 | OKUTSU HIROKAZU |
| An image recording device recording an image on an image-forming region of a strip-shaped flexible substrate stretched between a supply reel and a take-up reel, the device having: a stage section structured to suck the flexible substrate, and to be movable along a predetermined conveying path; an alignment section disposed above the conveying path of the stage section, and sensing at least an alignment mark of the flexible substrate; a correcting section which, based on the alignment mark sensed by the alignment section, corrects image data to be recorded on the image-forming region of the flexible substrate; and a recording section disposed above the conveying path of the stage section and at a downstream side, in a conveying direction of the flexible substrate, of the alignment section, the recording section recording, on the image-forming region of the flexible substrate, the image data corrected. | ||||||
| 165 | IMPRINT LITHOGRAPHY TEMPLATES HAVING ALIGNMENT MARKS | PCT/US2004030269 | 2004-09-16 | WO2005038523A3 | 2006-06-15 | BAILEY TODD C; JOHNSON STEPHEN C; COLBURN MATTHEW E; CHOI BYUNG J; SMITH BRITAIN J; EKERDT JOHN G; WILLSON CARLTON G; SREENIVASAN SIDLGATA V |
| One embodiment of the present invention is an imprint template for imprint lithography that comprises alignment marks embedded in bulk material of the imprint template. | ||||||
| 166 | METHOD AND APPARATUS FOR REGISTRATION CONTROL IN PRODUCTION BY IMAGING | PCT/IL0200154 | 2002-02-28 | WO02069053A2 | 2002-09-06 | CABIRI OZ; ATIYA YOSSEF; MIKLETZKI EFFRAIM |
| A method and apparatus for imaging an overlying pattern over an underlying pattern on a substrate, by determining deviations between the actual locations and the nominal locations of predetermined reference targets in the underlying pattern on the substrate; and utilizing the determined deviations for modifying the scanning control data used for imaging the image data of the overlying pattern in order to reduce misregistration thereof with respect to the underlying pattern. Preferably, the reference targets are predetermined connection sites in the underlying pattern to be precisely located with respect to connection sites in the overlying pattern. The reference features may be assigned different weights according to their registration importance, and the deviations may be determined according to a threshold, which varies with the weight assigned to the respective reference feature. | ||||||
| 167 | METHOD AND DEVICE FOR ALIGNING TWO PHOTO MASKS WITH EACH OTHER AND OPTIONALLY, AN UNEXPOSED PRINTED CIRCUIT BOARD BLANK, AND FOR SUBSEQUENT SIMULTANEOUS EXPOSURE IN THE PRODUCTION OF DOUBLE-SIDED PRINTED CIRCUIT BOARDS | PCT/EP9908451 | 1999-11-04 | WO0028385A3 | 2000-10-12 | GEBUREK FRANK |
| The invention relates to a method and device for aligning an unexposed printed circuit board blank and two photo masks with each other without additional mechanical aids such as adjustable positioning pins for the printed circuit board, and for subsequent exposure in order to produce double-sided printed circuit boards, using optical positioning aids on the edge of the photo masks and the printed circuit board. The invention enables the double-sided alignment of two photo masks with each other and optionally, with a printed circuit board blank through a sequence of individual steps, so that the existing process tolerances such as the bore-hole/hole position tolerance, dimensional stability of the base material and dimensional stability of the films can be optimised. | ||||||
| 168 | METHOD AND APPARATUS FOR AN IMAGING SYSTEM | US16036663 | 2018-07-16 | US20180330911A1 | 2018-11-15 | Frederick A. Flitsch |
| The present invention provides apparatus for an imaging system comprising a multitude of chemical emitting elements upon a substrate. In some embodiments the substrate may be approximately round with a radius of approximately one inch. Various methods relating to using and producing an imaging system of chemical emitters are disclosed. | ||||||
| 169 | Maskless lithography for web based processing | US15026810 | 2014-09-25 | US10073350B2 | 2018-09-11 | Christopher Dennis Bencher |
| The present disclosure generally relates to a method and apparatus for processing a web-based substrate. As the substrate travels between rollers, the substrate may be stretched and thus distorted. Once the substrate reaches the roller, the substrate distortion is fixed. By adjusting the processing parameters, the distorted substrate is processed without correcting the distortion. | ||||||
| 170 | Method and system for overlay control | US14733300 | 2015-06-08 | US10031426B2 | 2018-07-24 | Yang-Hung Chang; Chih-Ming Ke; Kai-Hsiung Chen |
| A method for overlay monitoring and control is introduced in the present disclosure. The method includes selecting a group of patterned wafers from a lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot. | ||||||
| 171 | MEASUREMENT DEVICE AND MEASUREMENT METHOD, EXPOSURE APPARATUS AND EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD | US15627707 | 2017-06-20 | US20180129144A1 | 2018-05-10 | Akihiro UEDA |
| An alignment system is equipped with: an alignment system having an objective optical system, an irradiation system and a beam receiving system; and a calculation system, the objective optical system including an objective transparent plate that faces a wafer movable in a Y-axis direction, the irradiation system irradiating a grating mark provided at the wafer with measurement beams via the objective transparent plate while scanning the measurement beams in the Y-axis direction, the beam receiving system receiving diffraction beams from the grating mark of the measurement beams via the objective optical system, and the calculation system obtaining positional information of the grating mark on the basis of the output of the beam receiving system, wherein the objective transparent plate deflects or diffracts the diffraction beams diffracted at the grating mark toward the beam receiving system. | ||||||
| 172 | Positioning method in microprocessing process of bulk silicon | US15315640 | 2015-08-19 | US09902613B2 | 2018-02-27 | Errong Jing |
| A positioning method in a microprocessing process of bulk silicon comprises the steps of: fabricating, on a first surface of a first substrate (10), a first pattern (100), a stepper photo-etching machine alignment mark (200) for positioning the first pattern, and a double-sided photo-etching machine first alignment mark (300) for positioning the stepper photo-etching machine alignment mark; fabricating, on a second surface, opposite to the first surface, of the first substrate, a double-sided photo-etching machine second alignment mark (400) corresponding to the double-sided photo-etching machine first alignment mark; bonding a second substrate (20) on the first surface of the first substrate; performing thinning on a first surface of the second substrate; fabricating, on the first surface of the second substrate, a double-sided photo-etching machine third alignment mark (500) corresponding to the double-sided photo-etching machine second alignment mark; and finding, on the first surface of the second substrate by using the double-sided photo-etching machine third alignment mark, a corresponding position of the stepper photo-etching machine alignment mark. | ||||||
| 173 | Roll to roll light exposure system | US14933896 | 2015-11-05 | US09835951B2 | 2017-12-05 | Jae Hyuk Chang; Sang Hyun Yun; Ki Beom Lee; Hi Kuk Lee |
| Embodiments of the present invention provide a roll-to-roll exposure system having a reference mark array and alignment scope units for precisely measuring the position and orientation of an object on a flexible multilayered circuit film. A roll-to-roll exposure system according to an exemplary embodiment of the present invention includes: a plurality of rolls configured to move a flexible multilayered circuit film having an object positioned thereon; alignment scope units positioned so as to be spaced apart from each other and proximate to the rolls; and at least one exposure unit positioned so as to be spaced proximate to the rolls and spaced apart from sides of the alignment scope units, in which one of the rolls has a reference mark array on its surface. | ||||||
| 174 | Lithography system and method for processing a target, such as a wafer | US14383570 | 2013-03-08 | US09760028B2 | 2017-09-12 | Niels Vergeer |
| A method for operating a target processing system for processing a target (23) on a chuck (13), the method comprising providing at least a first chuck position mark (27) and a second chuck position mark (28) on the chuck (13); providing an alignment sensing system (17) arranged for detecting the first and second chuck position marks (27, 28), the alignment sensing system (17) comprising at least a first alignment sensor (61) and a second alignment sensor (62); moving the chuck (13) to a first position based on at least one measurement of the alignment sensing system (17); and measuring at least one value related to the first position of the chuck. | ||||||
| 175 | Apparatus for processing a substrate on a support body | US15341862 | 2016-11-02 | US09701104B2 | 2017-07-11 | Aart Nijkamp |
| An apparatus is provided for processing a substrate on a support body. The apparatus comprises the support body, at least one registration member, a carriage unit and a controller. The support body is arranged for supporting the substrate. The at least one registration member is adapted for registering the substrate on the support body by engaging the substrate in contact to the at least one registration member, when the at least one registration member is arranged into a registering state. The carriage unit is movably arranged relative to the support body for processing the substrate. The control unit is arranged for executing the steps of: a) selecting a position of the substrate on the support body; b) selecting a first registering position on the support body of a first registration member for registering the substrate at the selected position on the support body in the registering state, when engaging the substrate in contact with the first registration member being arranged in the first registering position; and c) moving the carriage unit relative to the support body to a processing position for processing the substrate, when the substrate is registered at the selected position on the support body by engaging the substrate in contact with the first registration member, which is arranged in the registering state in the first registering position. | ||||||
| 176 | Imprint lithography | US13513807 | 2010-10-01 | US09625811B2 | 2017-04-18 | Sander Frederik Wuister; Arie Jeffrey Den Boef; Yvonne Wendela Kruijt-Stegeman |
| An object provided with a particular alignment arrangement for use in aligning the object and a further object with respect to each other is disclosed. The alignment arrangement includes a first fine alignment mark in the form of a substantially regular grating, and a second coarse alignment mark located in the same area as the first alignment mark. | ||||||
| 177 | Mask, exposure apparatus and device manufacturing method | US13967688 | 2013-08-15 | US09563116B2 | 2017-02-07 | Yuichi Shibazaki |
| A circular cylinder-shaped mask is used to form an image of a pattern on a substrate via a projection optical system. The mask has a pattern formation surface on which the pattern is formed and that is placed around a predetermined axis, and the mask is able to rotate, with the predetermined axis taken as an axis of rotation, in synchronization with a movement of the substrate in at least a predetermined one-dimensional direction. When a diameter of the mask on the pattern formation surface is taken as D, and a maximum length of the substrate in the one-dimensional direction is taken as L, and a projection ratio of the projection optical system is taken as β, and circumference ratio is taken as π, then the conditions for D≧(β×L)/π are satisfied. | ||||||
| 178 | METHOD FOR MANUFACTURING TRANSISTOR | US15244398 | 2016-08-23 | US20160359114A1 | 2016-12-08 | Seigo NAKAMURA |
| In the manufacturing of transistors, a film substrate on which three or more alignment marks are formed is used, the alignment marks are detected, and a treatment for controlling the expansion and shrinkage of the substrate is carried out once or more by means of at least one of a temperature control of the substrate and a humidity control of the substrate depending on detection results thereof. Therefore, in the manufacturing of transistors in which films are used as substrates, it is possible to form constituent members of transistors such as source electrodes or drain electrodes without pattern deviation regardless of the expansion and shrinkage of substrates attributed to environmental changes. | ||||||
| 179 | Measuring system | US14100742 | 2013-12-09 | US09482968B2 | 2016-11-01 | Markus Goeppert; Helmut Haidner; Rolf Freimann; Christoph Striebel |
| An objective for a projection exposure apparatus includes a metrology stage arranged on the frame of the objective. The objective includes at least one optical component, an objective mount for mounting the optical component, and a positioning device for holding at least one measuring device. The positioning device is connected to the objective mount and has at least one degree of freedom of displacement for displacing the measuring device. | ||||||
| 180 | ALIGNMENT SYSTEM | US14387379 | 2013-11-19 | US20160252753A1 | 2016-09-01 | Chaoyang DENG; Zijin LIN; Haisheng ZHAO |
| An alignment system includes: a light emitting device located on one side of an object to be aligned for emitting light towards the object to be aligned; a light receiving device located on the other side of the object to be aligned and at a standard position corresponding to an alignment mark disposed on the object to be aligned, the light receiving device being provided with a plurality of light sensors for sensing light emitting from the light emitting device on an end surface facing the object to be aligned; a processor configured to receive sensing signals transmitted from each of the light sensors and determine whether the object to be aligned is aligned accurately according to whether each of the light sensors sense the light emitted from the light emitting device. This alignment system shortens the processing time and enhances the processing efficiency. | ||||||
QQ群二维码
意见反馈
意见反馈