Positioning method in microprocessing process of bulk silicon |
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| 申请号 | US15315640 | 申请日 | 2015-08-19 | 公开(公告)号 | US09902613B2 | 公开(公告)日 | 2018-02-27 |
| 申请人 | CSMC TECHNOLOGIES FAB1 CO., LTD.; | 发明人 | Errong Jing; | ||||
| 摘要 | A positioning method in a microprocessing process of bulk silicon comprises the steps of: fabricating, on a first surface of a first substrate (10), a first pattern (100), a stepper photo-etching machine alignment mark (200) for positioning the first pattern, and a double-sided photo-etching machine first alignment mark (300) for positioning the stepper photo-etching machine alignment mark; fabricating, on a second surface, opposite to the first surface, of the first substrate, a double-sided photo-etching machine second alignment mark (400) corresponding to the double-sided photo-etching machine first alignment mark; bonding a second substrate (20) on the first surface of the first substrate; performing thinning on a first surface of the second substrate; fabricating, on the first surface of the second substrate, a double-sided photo-etching machine third alignment mark (500) corresponding to the double-sided photo-etching machine second alignment mark; and finding, on the first surface of the second substrate by using the double-sided photo-etching machine third alignment mark, a corresponding position of the stepper photo-etching machine alignment mark. | ||||||
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