子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 181 | MASKLESS LITHOGRAPHY FOR WEB BASED PROCESSING | US15026810 | 2014-09-25 | US20160238941A1 | 2016-08-18 | Christopher Dennis BENCHER |
| The present disclosure generally relates to a method and apparatus for processing a web-based substrate. As the substrate travels between rollers, the substrate may be stretched and thus distorted. Once the substrate reaches the roller, the substrate distortion is fixed. By adjusting the processing parameters, the distorted substrate is processed without correcting the distortion. | ||||||
| 182 | Alignment correction method for substrate to be exposed, and exposure apparatus | US14168212 | 2014-01-30 | US09360776B2 | 2016-06-07 | Yoshiaki Nomura; Toshinari Arai |
| An alignment correction method includes: the step of detecting coordinates of a first observation point 14 and a second observation point 15 set in advance on a substrate to be exposed 1 that is being scanned in a scanning direction A, in order to observe an alignment deviation of the substrate to be exposed 1; the step of computing a correction amount based on a deviation between the detected coordinates and a reference line set in advance according to the first observation point 14 and the second observation point 15; and the step of correcting alignment of a subsequent substrate to be exposed 1 based on the computed correction amount. | ||||||
| 183 | System for forming aligned patterns on a substrate | US14230140 | 2014-03-31 | US09291588B2 | 2016-03-22 | Todd Mathew Spath; Gary Alan Kneezel |
| A system for forming a second pattern in registration with a first pattern on a substrate is disclosed. The system comprises the substrate having a first magnitude of an associated electrical characteristic and at least one alignment structure. The alignment structure has a second magnitude of the electrical characteristic different from that of the substrate. An advancing mechanism is used for moving the substrate. A probe is used for measuring an electrical characteristic at a plurality of positions proximate the moving substrate. A controller is used for interpreting the measured electrical characteristic as a function of position for identifying a location of the alignment structure. A first patterning station is used for forming the second pattern on a surface of the substrate in registration with the first pattern based on the identified location of the alignment structure. | ||||||
| 184 | Apparatuses and methods for compensation of carrier distortions from measurement machines | US13233621 | 2011-09-15 | US09210814B2 | 2015-12-08 | Mikael Wahlsten |
| In a method for generating a pattern on a workpiece having at least one die placed thereon, positions of the at least one die and at least two global alignment marks on the workpiece are measured, pattern adjustment data is generated, pattern image data associated with the pattern to be written is adjusted based on the generated pattern adjustment data, and the pattern is generated on the workpiece based on the modified pattern adjustment data. | ||||||
| 185 | Space imaging overlay inspection method and array substrate | US13704678 | 2012-11-08 | US09127934B2 | 2015-09-08 | Xiaohui Jiang; Jian Guo |
| Embodiments of the invention discloses a space imaging overlay inspection method and an array substrate; the method comprises: forming a thin film having a space imaging overlay mark by photolithography; when the thin film is a transparent thin film, performing a color developing treatment on the space imaging overlay mark on the transparent thin film, so as to make the space imaging overlay mark appear in a non-transparent color; and conducting a space imaging overlay inspection between the transparent thin film and an adjacent thin film by using the space imaging overlay mark appear appearing in the non-transparent color. In the method, by conducting the color developing treatment to the space imaging overlay mark on the transparent thin film and then conducting positioning, the space imaging overlay mark can be positioned quickly and accurately, thus alignment condition between two photolithography procedures can be detected swiftly and effectively. | ||||||
| 186 | Imprint lithography apparatus | US12821806 | 2010-06-23 | US09116423B2 | 2015-08-25 | Andre Bernardus Jeunink; Vadim Yevgenyevich Banine; Hans Butler; Engelbertus Antonius Fransiscus Van Der Pasch; Johannes Petrus Martinus Bernardus Vermeulen; Yvonne Wendela Kruijt-Stegeman |
| An imprint lithography apparatus is disclosed that includes a structure located away from a substrate holder and extending across the substrate holder, and such that an imprint template arrangement is, in use, located between the structure and the substrate holder, wherein the structure has one or more arrays of lines or one or more encoders, and the substrate or substrate holder and the imprint template have a corresponding one or more encoders that face towards one or more of the one or more arrays of lines or one or more arrays of lines that face towards one or more of the one or more encoders, and the configuration determination arrangement is configured to determine a relative configuration between the substrate or substrate holder and the structure, and/or a relative configuration between the imprint template arrangement and the structure, and/or a relative configuration between the imprint template arrangement and the substrate or substrate holder. | ||||||
| 187 | LITHOGRAPHY SYSTEM AND METHOD FOR PROCESSING A TARGET, SUCH AS A WAFER | US14383570 | 2013-03-08 | US20150109598A1 | 2015-04-23 | Niels Vergeer |
| A method for operating a target processing system for processing a target (23) on a chuck (13), the method comprising providing at least a first chuck position mark (27) and a second chuck position mark (28) on the chuck (13); providing an alignment sensing system (17) arranged for detecting the first and second chuck position marks (27, 28), the alignment sensing system (17) comprising at least a first alignment sensor (61) and a second alignment sensor (62); moving the chuck (13) to a first position based on at least one measurement of the alignment sensing system (17); and measuring at least one value related to the first position of the chuck. | ||||||
| 188 | Method and System for Overlay Control | US14017793 | 2013-09-04 | US20150067617A1 | 2015-03-05 | Yang-Hung Chang; Kai-Hsiung Chen; Chih-Ming Ke |
| A method for overlay monitoring and control is introduced in the present disclosure. The method comprises forming resist patterns on one or more wafers in a lot by an exposing tool; selecting a group of patterned wafers in the lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot. | ||||||
| 189 | Imprinting apparatus and article manufacturing method | US12546442 | 2009-08-24 | US08951031B2 | 2015-02-10 | Kazuyuki Kasumi |
| The imprint apparatus presses resin disposed on a substrate and a mold to each other to form a resin pattern on the substrate. The apparatus includes a driving device configured to move the mold and the substrate relatively to apply a pressing force between the mold and the resin, a measuring device configured to measure a position of at least one of the mold and the substrate, a detector configured to detect the pressing force, and a controller configured to control the driving device. The controller is configured to control the driving device using the position as a controlled variable in a first period, and to control the driving device using the pressing force as a controlled variable in a second period after the first period. | ||||||
| 190 | Method and apparatus for performing alignment using reference board | US12929977 | 2011-02-28 | US08934081B2 | 2015-01-13 | Mikael Wahlsten; Raoul Zerne |
| An alignment method for the of patterning a work piece in a direct write machine, wherein a reference board provided with board reference features is used to coordinate calibration of a measurement station and a writing station against a common reference. An adjusted pattern is for writing on the work piece is calculated relative to the position of the reference board. | ||||||
| 191 | Metrology method and apparatus, and device manufacturing method | US13235902 | 2011-09-19 | US08867020B2 | 2014-10-21 | Hendrik Jan Hidde Smilde; Patrick Warnaar |
| Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating or other structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The position of an image of the component structure varies between measurements, and a first type of correction is applied to reduce the influence on the measured intensities, caused by differences in the optical path to and from different positions. A plurality of structures may be imaged simultaneously within the field of view of the optical system, and each corrected for its respective position. The measurements may comprise first and second images of the same target under different modes of illumination and/or imaging, for example in a dark field metrology application. A second type of correction may be applied to reduce the influence of asymmetry between the first and second modes of illumination or imaging, for example to permit a more accurate overly measurement in a semiconductor device manufacturing process. | ||||||
| 192 | Imprint lithography apparatus | US12781225 | 2010-05-17 | US08845320B2 | 2014-09-30 | Catharinus De Schiffart; Andre Bernardus Jeunink; Johannes Petrus Martinus Bernardus Vermeulen; Sander Frederik Wuister; Yvonne Wendela Kruijt-Stegeman; Norbert Erwin Therenzo Jansen |
| An arrangement suitable for use in an imprint lithography apparatus is disclosed. The arrangement includes a support structure arranged to support an imprint template arrangement, a first actuator configured to apply a force to the imprint template arrangement, and a second actuator attached to the support structure, and arranged in use to extend between the support structure and the imprint template arrangement, the second actuator configured to apply a force to the imprint template arrangement, a range of movement of the second actuator being greater than a range of movement of the first actuator. | ||||||
| 193 | SEMICONDUCTOR DEVICE, RETICLE METHOD FOR CHECKING POSITION MISALIGNMENT AND METHOD FOR MANUFACTURING POSITION MISALIGNMENT CHECKING MARK | US13955141 | 2013-07-31 | US20140240705A1 | 2014-08-28 | Michiya TAKIMOTO |
| According to one embodiment, there is provided a semiconductor device including a circuit area in which an integrated circuit is formed, a position misalignment checking mark of which a contrasting density is detected under polarized illumination and is not detectable under non-polarized illumination, and a peripheral pattern that is disposed on a periphery of the position misalignment checking mark and has a contrasting density that is not detectable under the polarized illumination. | ||||||
| 194 | Processing system | US13332467 | 2011-12-21 | US08811665B2 | 2014-08-19 | Hans Opower; Klaus Juenger |
| A processing system for plate-like objects is provided, with an exposure device and an object carrier with an object carrier surface for receiving the object. The exposure device and the carrier are movable relative to one another, such that the exact position of the object relative to the carrier is determinable. An edge detection device is provided which comprises at least one edge illumination unit having an illumination area, within which an object edge located in the respective object edge area has light directed onto it from the side of the carrier. At least one edge image detection unit is provided on a side of the object located opposite the carrier, the edge image detection unit imaging an edge section of the object edges located in the illumination area as an edge image, such that the respective edge image is detectable in its exact position relative to the carrier. | ||||||
| 195 | Metrology Method and Apparatus, and Device Manufacturing Method | US14224532 | 2014-03-25 | US20140204397A1 | 2014-07-24 | Hendrik Jan Hidde SMILDE; Patrick WARNAAR |
| Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating or other structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The position of an image of the component structure varies between measurements, and a first type of correction is applied to reduce the influence on the measured intensities, caused by differences in the optical path to and from different positions. A plurality of structures may be imaged simultaneously within the field of view of the optical system, and each corrected for its respective position. The measurements may comprise first and second images of the same target under different modes of illumination and/or imaging, for example in a dark field metrology application. A second type of correction may be applied to reduce the influence of asymmetry between the first and second modes of illumination or imaging, for example to permit a more accurate overly measurement in a semiconductor device manufacturing process. | ||||||
| 196 | ALIGNMENT DEVICE FOR EXPOSURE DEVICE, AND ALIGNMENT MARK | US14237987 | 2012-08-07 | US20140168648A1 | 2014-06-19 | Kazushige Hashimoto |
| This alignment device is furnished with an alignment light source for emitting alignment light, and is housed with a camera for example. The alignment light source emits alignment light, doing so, for example, coaxially with respect to the optical axis of light detected by the camera. The alignment light illuminates a substrate and mask, and reflected light is detected by the camera. A microlens array for exposure use is present between a mask alignment mark and a substrate alignment mark, whereby an erect unmagnified image reflected from the substrate alignment mark is formed on the mask. A control device then uses the mask alignment mark and the substrate alignment mark detected by the camera to perform alignment of the substrate and the mask. Alignment of the substrate and the mask can be performed with high accuracy thereby. | ||||||
| 197 | REGISTRATION SYSTEM FOR PHOTOTOOLS | US13839911 | 2013-03-15 | US20140099480A1 | 2014-04-10 | Charles Jonathan Kennett; John Cunningham |
| There is herein described a method and apparatus for positioning a phototool. More particularly, there is described a method and apparatus for accurately positioning a phototool capable of photoimaging a substrate (e.g. a web) covered with a wet curable photopolymer wherein the phototool creates an imaged substrate which is used to form images suitable for forming electrical circuits such as for printed circuit boards (PCBs), flat panel displays and flexible circuits. | ||||||
| 198 | SPACE IMAGING OVERLAY INSPECTION METHOD AND ARRAY SUBSTRATE | US13704678 | 2012-11-08 | US20140055795A1 | 2014-02-27 | Xiaohui Jiang; Jian Guo |
| Embodiments of the invention discloses a space imaging overlay inspection method and an array substrate; the method comprises: forming a thin film having a space imaging overlay mark by photolithography; when the thin film is a transparent thin film, performing a color developing treatment on the space imaging overlay mark on the transparent thin film, so as to make the space imaging overlay mark appear in a non-transparent color; and conducting a space imaging overlay inspection between the transparent thin film and an adjacent thin film by using the space imaging overlay mark appear appearing in the non-transparent color. In the method, by conducting the color developing treatment to the space imaging overlay mark on the transparent thin film and then conducting positioning, the space imaging overlay mark can be positioned quickly and accurately, thus alignment condition between two photolithography procedures can be detected swiftly and effectively. | ||||||
| 199 | Mask, exposure apparatus and device manufacturing method | US12399483 | 2009-03-06 | US08609301B2 | 2013-12-17 | Yuichi Shibazaki |
| A circular cylinder-shaped mask is used to form an image of a pattern on a substrate via a projection optical system. The mask has a pattern formation surface on which the pattern is formed and that is placed around a predetermined axis, and the mask is able to rotate, with the predetermined axis taken as an axis of rotation, in synchronization with a movement of the substrate in at least a predetermined one-dimensional direction. When a diameter of the mask on the pattern formation surface is taken as D, and a maximum length of the substrate in the one-dimensional direction is taken as L, and a projection ratio of the projection optical system is taken as β, and circumference ratio is taken as π, then the conditions for D≧(β×L)/π are satisfied. | ||||||
| 200 | Infrared direct illumination machine vision technique for semiconductor processing equipment | US12977229 | 2010-12-23 | US08570516B2 | 2013-10-29 | Gang Liu; Lei Wang |
| A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs infrared light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition. | ||||||
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