| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 101 | MAGAZINE TRANSFER UNIT GRIPPER | US16018171 | 2018-06-26 | US20190176339A1 | 2019-06-13 | JONG SEONG KO; Kwang-Jun KIM; Jung Jun PARK; Hee Yun CHOI |
| A gripper includes a body frame mounted on a magazine transfer robot. A first guide assembly is mounted on the body frame. A first gripping unit is movable along the first guide assembly. A second gripping unit is movable along the first guide assembly. A driver is configured to move the first gripping unit in a first direction. The driver is configured to move the second gripping unit in a second direction opposite to the first direction. The first gripping unit includes a first finger unit and a second finger unit independently moveable with respect to the first finger unit. The second gripping unit is spaced apart from the first gripping unit. The second gripping unit includes a third finger unit and a fourth finger unit independently moveable with respect to the third finger unit. | ||||||
| 102 | Semiconductor module with gripping sockets, methods for gripping, for moving and for electrically testing a semiconductor module | US14830333 | 2015-08-19 | US10143099B2 | 2018-11-27 | Rene Cordes; Christoph Koch; Michael Larisch; Sven Schennetten |
| One aspect of the invention relates to a semiconductor module with an outer housing having four side walls, and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip is arranged on the upper side and in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls. | ||||||
| 103 | System and method for automatically correcting for rotational misalignment of wafers on film frames | US14424427 | 2013-09-02 | US10128140B2 | 2018-11-13 | Jing Lin |
| Automatically correcting for rotational misalignment of a wafer improperly mounted on a film frame includes capturing an image of portions of the wafer using an image capture device, prior to initiation of a wafer inspection procedure by an inspection system; digitally determining a rotational misalignment angle and a rotational misalignment direction of the wafer relative to the film frame and/or a set of reference axes of a field of view of the image capture device; and correcting for the rotational misalignment of the wafer by way of a film frame handling apparatus separate from the inspection system, which is configured for rotating the film frame across the rotational misalignment angle in a direction opposite to the rotational misalignment direction. Such film frame rotation can occur prior to placement of the film frame on the wafer table, without decreasing film frame handling throughput or inspection process throughput. | ||||||
| 104 | METHOD AND APPARATUS FOR SUBSTRATE TRANSPORT APPARATUS POSITION COMPENSATION | US15880387 | 2018-01-25 | US20180286728A1 | 2018-10-04 | Jairo T. MOURA; Robert T. CAVENEY; Bing ` YIN; Nathan SPIKER; Vincent W. TSANG |
| A substrate transport empiric arm droop mapping apparatus for a substrate transport system of a processing tool, the mapping apparatus including a frame, an interface disposed on the frame forming datum features representative of a substrate transport space in the processing tool defined by the substrate transport system, a substrate transport arm, that is articulated and has a substrate holder, mounted to the frame in a predetermined relation to at least one of the datum features, and a registration system disposed with respect to the substrate transport arm and at least one datum feature so that the registration system registers, in an arm droop distance register, empiric arm droop distance, due to arm droop changes, between a first arm position and a second arm position different than the first arm position and in which the substrate holder is moved in the transport space along at least one axis of motion. | ||||||
| 105 | SUBSTRATE TRANSPORTING APPARATUS, CONTROL APPARATUS FOR SUBSTRATE TRANSPORTING APPARATUS, DISPLACEMENT COMPENSATION METHOD FOR SUBSTRATE TRANSPORTING APPARATUS, PROGRAM FOR IMPLEMENTING METHOD AND RECORDING MEDIUM THAT RECORDS PROGRAM | US15933280 | 2018-03-22 | US20180282893A1 | 2018-10-04 | Gaku YAMASAKI; Hirotaka OHASHI |
| In assembly of a conventional plating apparatus, a position of a processing tank is adjusted so that the processing tank is disposed at an ideal position. This adjustment takes time and effort to assemble a plating apparatus, and assembly of the plating apparatus requires a high cost. The invention provides a substrate transporting apparatus provided with a substrate holder for holding a substrate, a holder griping mechanism that grips the substrate holder, a substrate transporting section that transports the substrate holder, a rotation mechanism that rotationally moves the holder griping mechanism around a vertical direction as an axis, and a linear motion mechanism that linearly moves the holder griping mechanism in a direction perpendicular to a plane defined by a transporting direction of the substrate holder by the substrate transporting section and a vertical direction. | ||||||
| 106 | Robot subassemblies, end effector assemblies, and methods with reduced cracking | US15225394 | 2016-08-01 | US10090188B2 | 2018-10-02 | Raj kumar Thanu; Damon K. Cox |
| A robot subassembly including roll, pitch, and/or vertical orientation adjustability capability of a ceramic or glass end effector. The robot subassembly includes a robot component, a mounting plate coupled to the robot component, wherein the mounting plate includes adjustable orientation relative to the robot component, and a brittle ceramic or glass end effector coupled to the mounting plate. Methods of adjusting orientation between a robot component and the end effector, as well as numerous other aspects are disclosed. | ||||||
| 107 | Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device | US15637069 | 2017-06-29 | US10081108B2 | 2018-09-25 | Hideaki Hara |
| A carrier system is provided with a wafer stage which holds a mounted wafer and is also movable along an XY plane, a chuck unit which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins, which can support from below the wafer held by the chuck unit on the wafer stage when the wafer stage is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer is measured by a Z position detection system, and based on the measurement results, the chuck unit and the vertical movement pins that hold (support) the wafer are independently driven. | ||||||
| 108 | Material-Handling Robot Trajectory Control | US15897525 | 2018-02-15 | US20180229361A1 | 2018-08-16 | Martin Hosek; Scott Wilkas; Jacob Lipcon |
| A method including, based upon a desired path of a reference point from a start position to an end position, where the reference point is on an end effector on a robot arm, determine an included angle that corresponds to the start position and the end position, calculating a trajectory in radial coordinates of the reference point on the end effector at least partially based upon the included angles; calculating corresponding angular coordinates of the reference point on the end effector, based on the calculated radial coordinates, so that the reference point follows the desired path; using a modified formulation of inverse kinematics, converting the radial and angular coordinates supplemented with the included angles of the trajectory and corresponding angular velocity and acceleration of the end effector to form motion setpoints for the robot arm; and controlling the motors of the robot drive. | ||||||
| 109 | Robot teaching position correcting method and system | US15281115 | 2016-09-30 | US10046460B2 | 2018-08-14 | Dong Xu |
| A robot teaching position correcting method and system is provided. The robot is driven to move along wafer pick-and-place operation paths defined by a sequence of waypoints. Distances between the waypoint and a wafer supporter of the wafer carrier above the waypoint are detected by upper sensors provided on a top surface of the robot when the robot is positioned at the waypoint. Then, the position parameter of the waypoint is corrected accordingly, so as to ensure safe wafer handling. | ||||||
| 110 | High capacity overhead transport (OHT) rail system with multiple levels | US14940467 | 2015-11-13 | US10043699B2 | 2018-08-07 | Fu-Hsien Li; Chi-Feng Tung; Hsiang Yin Shen |
| An overhead transport (OHT) system with multiple levels of rails for the transport of semiconductor workpieces is provided. A first vehicle is configured to travel on, and move a semiconductor workpiece along, a first rail. A second vehicle is configured to travel on, and move the semiconductor workpiece along, a second rail overlying the first rail. A controller is configured to control the first and second vehicles to transfer the semiconductor workpiece along the first and second rails, between process or inspection tools. A method for transferring semiconductor workpieces across multiple levels of rails is also provided. | ||||||
| 111 | Substrate transporter | US14633636 | 2015-02-27 | US10022865B2 | 2018-07-17 | Yoram Hanfling |
| Aspects of the present disclosure describe a robot which has a controller, actuators, encoders, and mechanical components. The robot may produce motion about an X, Z, RU, RL, and Theta axes. Movements of the robot are controlled by the controller. The repeatability of the robot is improved by designing the robot such that a control cycle frequency of the controller is 50 times or more greater than a vibrational frequency of one or more of the mechanical components. In order to reduce the release of particulates, a baffled enclosure may be used. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. This abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | ||||||
| 112 | APPARATUS, SYSTEM AND METHOD FOR PROVIDING AN END EFFECTOR | US15889410 | 2018-02-06 | US20180161989A1 | 2018-06-14 | Jeroen Bosboom; Babak Naderi; Richard Munro; Tatiana Pankova Major |
| The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer. | ||||||
| 113 | Wafer-handling end effectors with wafer-contacting surfaces and sealing structures | US14631131 | 2015-02-25 | US09991152B2 | 2018-06-05 | Robbie Ingram-Goble; Michael E. Simmons; Philip Wolf; Ryan Garrison; Christopher Storm |
| Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces. | ||||||
| 114 | SILICON WAFER TRANSPORTATION SYSTEM | US15576070 | 2016-05-20 | US20180143541A1 | 2018-05-24 | Kai LIU; Songli HU; Jie JIANG |
| A wafer transfer system for use in a photolithography system including a wafer storage apparatus, a pre-alignment apparatus, a buffer stage and a wafer stage is disclosed, which includes: a dual-arm robot, configured to take a wafer to be exposed from the wafer storage apparatus and transfer it onto the pre-alignment apparatus and further configured to remove an exposed wafer from the buffer stage and place it back into the wafer storage apparatus; a wafer-loading linear robot, configured to transfer a pre-aligned wafer onto the wafer stage; and a wafer-unloading linear robot, configured to transfer the exposed wafer onto the buffer stage. The dual-arm robot, the wafer-loading linear robot and the wafer-unloading linear robot can operate in parallel so as to achieve time savings in the wafer transfers. | ||||||
| 115 | INDUSTRIAL ROBOT | US15521733 | 2016-07-25 | US20180141208A1 | 2018-05-24 | Takahiro SHIRAKI; Yasuyuki KITAHARA; Tamotsu KURIBAYASHI; Takao NAKAE; Shigeyuki KAINO |
| An industrial robot may include a plurality of hands structured to mount the transfer objects; an arm comprising a front end side and a base end side, the hands being rotatably joined with the front end side of the arm; and a main body portion to which the base end side of the arm is rotatably joined. The main body portion may include an elevating unit to which the base end side of the arm is rotatably joined on a top surface side thereof, a housing which holds the elevating unit to be raised/lowered and in which at least part of a bottom end of the elevating unit is housed, and an elevating mechanism structured to raise and lower the elevating unit. The elevating mechanism may be accommodated in the housing so as to align with the elevating unit when viewed from a top-bottom direction. | ||||||
| 116 | WAFER SWAPPER | US15860102 | 2018-01-02 | US20180117771A1 | 2018-05-03 | Dale R. DU BOIS; Juan Carlos ROCHA-ALVAREZ; Karthik JANAKIRAMAN; Hari K. PONNEKANTI; Sanjeev BALUJA; Prajeeth WILTON |
| The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More specifically, embodiments described herein are related to systems and methods used to transfer, or swap, semiconductor substrates between process chambers using a transport device that employs at least two blades for the concurrent transfer of substrates between processing chambers. | ||||||
| 117 | Sealed robot drive | US14540072 | 2014-11-13 | US09948155B2 | 2018-04-17 | Jairo T. Moura; Ulysses Gilchrist; Robert T. Caveney |
| A transport apparatus including a housing, a drive mounted to the housing, and at least one transport arm connected to the drive where the drive includes at least one rotor having at least one salient pole of magnetic permeable material and disposed in an isolated environment, at least one stator having at least one salient pole with corresponding coil units and disposed outside the isolated environment, where the at least one salient pole of the at least one stator and the at least one salient pole of the rotor form a closed magnetic flux circuit between the at least one rotor and the at least one stator, and at least one seal configured to isolate the isolated environment where the at least one seal is integral to the at least one stator. | ||||||
| 118 | Apparatus, system and method for providing an end effector | US15370125 | 2016-12-06 | US09919430B1 | 2018-03-20 | Jeroen Bosboom; Babak Naderi; Richard Munro; Tatiana Pankova Major |
| The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer. | ||||||
| 119 | Wafer swapper | US14972366 | 2015-12-17 | US09889567B2 | 2018-02-13 | Dale R. Du Bois; Juan Carlos Rocha-Alvarez; Karthik Janakiraman; Hari K. Ponnekanti; Sanjeev Baluja; Prajeeth Wilton |
| The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More specifically, embodiments described herein are related to systems and methods used to transfer, or swap, semiconductor substrates between process chambers using a transport device that employs at least two blades for the concurrent transfer of substrates between processing chambers. | ||||||
| 120 | SUBSTRATE CONVEYING ROBOT AND OPERATION METHOD THEREFOR | US15550832 | 2015-02-13 | US20180029237A1 | 2018-02-01 | Junichi SUGAWARA; Masaya YOSHIDA |
| A substrate conveying robot has a robot arm including an end effector having a substrate holding unit holding a substrate, arm drive unit for driving the robot arm, an elevating drive unit for elevatingly driving the end effector, a robot control unit controlling the arm drive unit, the elevating drive unit, and the substrate holding unit, and a substrate detection unit having a substrate detection unit which detects a vertical position of the substrate and elevates coordinately with an elevating operation of the end effector. By this configuration, a vertical position of a substrate to be conveyed is detected with high accuracy so that a robot operation can be controlled based on the detection result. | ||||||
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