子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 101 | METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED | US16040621 | 2018-07-20 | US20180348259A1 | 2018-12-06 | Bing Dang; John Knickerbocker; Yang Liu; Maurice Mason; Lubomyr T. Romankiw |
| A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure. | ||||||
| 102 | Method for low temperature bonding of wafers | US15321701 | 2015-07-09 | US10134607B2 | 2018-11-20 | Vivek Chidambaram; Sunil Wickramanayaka; Jinghui Xu; Zhipeng Ding; Li Yan Siow |
| A method for bonding wafers is provided. The method comprises the steps of providing a first wafer having an exposed first layer, the first layer comprising a first metal; and providing a second wafer having an exposed second layer, the second layer comprising a second metal, the first metal and the second metal capable of forming a eutectic mixture having a eutectic melting temperature. The method further comprises the steps of contacting the first layer with the second layer; and applying a predetermined pressure at a predetermined temperature to form a solid-state diffusion bond between the first layer and the second layer, wherein the predetermined temperature is below the eutectic melting temperature. | ||||||
| 103 | Braze alloy layered product | US14388552 | 2013-03-27 | US10112249B2 | 2018-10-30 | Per Sjödin; Kristian Walter |
| The present invention relates to a method for providing a braze alloy layered product comprising the following steps: —applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; —heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product. | ||||||
| 104 | HIGH TEMPERATURE DEVICES AND APPLICATIONS EMPLOYING PURE ALUMINUM BRAZE FOR JOINING COMPONENTS OF SAID DEVICES | US15885870 | 2018-02-01 | US20180214992A1 | 2018-08-02 | Jainagesh Sekhar |
| The present applicant presents a structure intended for high temperature use above 30° C. comprising multiple components having metal-to-metal or metal-to-ceramic contacting surfaces wherein the surfaces are joined by a braze composed of pure aluminum. Anticipated devices include but are not limited to igniters as well as electronic applications in the automotive and aerospace industries. | ||||||
| 105 | EXTRUSION MATERIAL | US15573642 | 2016-05-13 | US20180185968A1 | 2018-07-05 | Øystein Grong; Ulf Roar Aakenes; Tor Gunnar Austigard; Torbjørn Bjering |
| An aluminium extrusion material for use in a hybrid metal extrusion and bonding process is provided. The composition of the extrusion material comprises: 0 to 0.25 wt % iron; at least 0.05 wt % dispersoid-forming elements, wherein the dispersoid-forming elements comprise 0 to 1.2 wt % manganese, 0 to 0.25 wt % chromium, 0 to 0.25 wt % zirconium and 0 to 0.25 wt % scandium; and, except when the aluminium alloy of the aluminium extrusion material is in the 2xxx series, 0 to 0.05 wt % copper. The microstructure of the extrusion material is a deformed microstructure; and the nanostructure of the extrusion material comprises an aluminium matrix with dislocations and dispersoids, and wherein the majority of the alloying elements are in solid solution in the aluminium matrix. An aluminium rod for manufacturing the extrusion material, a joint comprising a extrudate made from the extrusion material a method of manufacturing the extrusion material and the aluminium rod and a method of joining two aluminium components using the extrusion material are also provided. | ||||||
| 106 | Systems and methods for welding electrodes | US13743178 | 2013-01-16 | US09999944B2 | 2018-06-19 | Steven Barhorst; Mario Amata; Kevin Pagano |
| The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). In one embodiment, a tubular welding wire includes a sheath and a core, and the core includes an organic stabilizer component. Further, the organic stabilizer component includes an organic sub-component configured to release hydrogen near a surface of a workpiece during welding, and includes a Group I metal, Group II metal, or a combination thereof. | ||||||
| 107 | Oxygen source-containing composite nanometal paste and joining method | US14379719 | 2013-02-20 | US09956610B2 | 2018-05-01 | Teruo Komatsu |
| An oxygen source-containing composite nanometal paste including at least composite nanometal particles, in which an organic coating layer is formed around a submicron or smaller silver core, and an oxygen source, which feeds oxygen contributing to pyrolysis at a pyrolysis temperature range in which the organic coating layer is pyrolyzed. The oxygen source comprises an oxygen-containing metal compound, and the oxygen content of the oxygen source is within a range of 0.01 mass % to 2 mass % per 100 mass % of the composite nanometal particles. | ||||||
| 108 | Engineered Polymer-Based Electronic Materials | US15562195 | 2016-03-31 | US20180056455A1 | 2018-03-01 | Ramakrishna Hosur Venkatagiriyappa; Morgana De Avila Ribas; Barun Das; Harish Hanchina Siddappa; Sutapa Mukherjee; Siuli Sarkar; Bawa Singh; Rahul Raut; Ranjit Pandher |
| A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition. | ||||||
| 109 | MATERIAL JOINING | US15209550 | 2016-07-13 | US20180016671A1 | 2018-01-18 | Neal Magdefrau; Paul Sheedy; Sonia Tulyani |
| A method of joining includes bringing a bulk metallic glass (BMG) material to a temperature lower than the crystallization temperature of the BMG material and depositing the BMG material onto a first substrate with interlock surface features such that the BMG material interlocks with the interlock surface features of the substrate. The method includes joining a second substrate to the BMG material, wherein the second substrate includes interlock surface features such that the BMG material interlocks with the interlock surface features of both the first and second substrates, joining the first and second substrates together to produce a fully amorphous joint between the first and second substrates. | ||||||
| 110 | Brazing concept | US14387061 | 2013-03-27 | US09849534B2 | 2017-12-26 | Per Sjödin; Kristian Walter |
| The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 μm. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses. | ||||||
| 111 | Heat Exchanger, Use of an Aluminium Alloy and of an Aluminium Strip as well as a Method for the Production of an Aluminium Strip | US15603714 | 2017-05-24 | US20170260612A1 | 2017-09-14 | Hartmut Janssen; Gerhard Bermig; Volker Saß; Stefan Schlüter |
| Provided is a heat exchanger, in particular for motor vehicles, with at least one exchanger tube of an aluminium alloy and with at least one component connected fluidically to the exchanger tube, wherein the exchanger tube and the component (14, 16) are connected to one another by way of a common soldered connection and wherein the component connected to the exchanger tube has a core layer of an aluminium alloy with the following composition: Si: max. 0.7% by weight, Fe: max. 0.70% by weight, Cu: max. 0.10% by weight, Mn: 0.9-1.5% by weight, Mg: max. 0.3% by weight, Cr: max. 0.25% by weight, Zn: max. 0.50% by weight, Ti: max. 0.25% by weight, Zr: max. 0.25% by weight, unavoidable impurities individually max. 0.05% by weight, altogether max. 0.15% by weight, the remainder aluminium. | ||||||
| 112 | Low Temperature High Reliability Alloy for Solder Hierarchy | US15326180 | 2015-07-15 | US20170197281A1 | 2017-07-13 | Pritha Choudhury; Morgana De Avila Ribas; Sutapa Mukherjee; Siuli Sarkar; Ranjit Pandher; Ravindra Bhatkal; Bawa Singh |
| A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities. | ||||||
| 113 | BRAZE JOINTS WITH A DISPERSED PARTICULATE MICROSTRUCTURE | US15105218 | 2015-06-25 | US20170191315A1 | 2017-07-06 | Gagan Saini; William Brian Atkins |
| The microstructure of braze joints in polycrystalline diamond compact (PDC) cutters may be tailored to increase the shear strength of the braze joint, for example, by increasing the amount of a dispersed particulate microstructure therein. A method for forming a dispersed particulate microstructure may include brazing a polycrystalline diamond table to a hard composite substrate with a braze alloy at a braze temperature between 5° C. above a solidus temperature of the braze alloy and 200° C. above a liquidus temperature of the braze alloy; and forming a braze joint between the polycrystalline diamond table and the hard composite substrate that comprises at least 40% by volume of the dispersed particulate microstructure composed of a particulate inter-metallic phase having a diameter of 0.5 μm to 2.0 μm and an aspect ratio of 1 to 5 dispersed in a ductile matrix. | ||||||
| 114 | Plate heat exchanger | US14382668 | 2013-03-28 | US09694435B2 | 2017-07-04 | Per Sjödin; Kristian Walter |
| Disclosed is a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1100° C., provided beside each other and forming a plate package with first plate interspaces for a first medium and second plate interspaces for a second medium, wherein the first and second plate interspaces are provided in an alternating order in the plate package. Each heat exchanger plate comprises a heat transfer area and an edge area which extend around the heat transfer area. The heat transfer area comprises a corrugation of elevations and depressions, wherein said corrugation of the plates are provided by pressing the plates. Also disclosed is a plate heat exchanger produced by the method. | ||||||
| 115 | Plate heat exchanger | US14382639 | 2013-03-27 | US09694434B2 | 2017-07-04 | Per Sjödin; Kristian Walter |
| Disclosed is a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1100° C., provided beside each other and forming a plate package with first plate interspaces for a first medium and second plate interspaces for a second medium, wherein the first and second plate interspaces are provided in an alternating order in the plate package, wherein each heat exchanger plate comprises a heat transfer area and an edge area comprising bent edges which extend around the heat transfer area, wherein a first surface of the plates forms a convex shape and a second surface of the plates forms a concave shape, wherein the heat transfer area comprises a corrugation of elevations and depressions, wherein said corrugation of the plates and the bent edges are provided by pressing the plates. Also disclosed is a plate heat exchanger produced by the method. | ||||||
| 116 | Clamp with ceramic electrode | US14723608 | 2015-05-28 | US09673737B2 | 2017-06-06 | Oliver Baldus |
| A holding apparatus (100) for electrostatically holding a component (1), in particular a silicon wafer, includes at least one base body (10, 10A, 10B) which is composed of a first plate (11A) and a second plate (12), the first plate (11A) being arranged on an upper side (10A) of the base body (10, 10A, 10B) and the second plate are made of an electrically insulating material, a plurality of projecting, upper burls (13A) which are arranged on the upper side (10A) of the base body (10, 10A, 10B) and form a support surface for the component (1), and a first electrode which is arranged to receive a clamping voltage, wherein the first plate (11A) is made of an electrically conductive, silicon-including ceramic and forms the first electrode. A method for producing the holding apparatus (100) is also described. | ||||||
| 117 | ALUMINUM ALLOY BRAZING SHEET AND METHOD FOR PRODUCING THE SAME | US15428775 | 2017-02-09 | US20170151638A1 | 2017-06-01 | Yasunaga ITOH; Tomoki YAMAYOSHI |
| An aluminum alloy brazing sheet achieves a stable brazability equal to by brazing using a flux, even if an etching treatment is not performed on the brazing site. The aluminum alloy brazing sheet is used to braze aluminum in an inert gas atmosphere without using a flux and includes a core material and a filler metal, one side or each side of the core material being clad with the filler metal, the core material being formed of an aluminum alloy that includes 0.2 to 1.3 mass % of Mg, the filler metal including 6 to 13 mass % of Si and 0.004 to 0.1 mass % of Li, with the balance being aluminum and unavoidable impurities, a surface oxide film having been removed from the brazing sheet, and an oil solution that decomposes when heated at 380° C. or less in an inert gas having been applied to the brazing sheet. | ||||||
| 118 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | US15341379 | 2016-11-02 | US20170141068A1 | 2017-05-18 | Takuya KADOGUCHI; Naoya TAKE |
| A method of manufacturing a semiconductor device which includes a first member and a second member joined to the first member includes: a) producing (Cu,Ni)6Sn5 on a Ni film formed on the first member by melting a first Sn—Cu solder containing 0.9 wt % or higher of Cu on the Ni film of the first member; b) producing (Cu,Ni)6Sn5 on a Ni film formed on the second member by melting a second Sn—Cu solder containing 0.9 wt % or higher of Cu on the Ni film of the second member; and c) joining the first member and the second member to each other by melting the first Sn—Cu solder having undergone step a) and the second Sn—Cu solder having undergone step b) so that the first Sn—Cu solder and the second Sn—Cu solder become integrated. | ||||||
| 119 | IMPARTING HIGH-TEMPERATURE WEAR RESISTANCE TO TURBINE BLADE Z-NOTCHES | US14628912 | 2015-02-23 | US20160245099A1 | 2016-08-25 | Joel T. Dawson; Danie DeWet; Qingjun Zheng |
| A method of imparting wear-resistance to a contact face of a turbine blade Z-notch comprising applying a flexible cladding sheet comprising a Co-based cladding alloy and an organic binder to the contact face of the Z-notch, heating the turbine blade Z-notch with flexible cladding sheet thereon to volatilize the organic binder and remove it from the cladding sheet, and further heating the turbine blade Z-notch with flexible cladding sheet thereon to sinter the cladding sheet by liquid phase sintering, thereby cladding the cladding sheet to the contact face to produce a wear-resistant layer thereon. | ||||||
| 120 | Solder joint material and method of manufacturing the same | US14495977 | 2014-09-25 | US09421645B2 | 2016-08-23 | Yuichi Oda; Hideyuki Sagawa; Kazuma Kuroki; Hiromitsu Kuroda; Kotaro Tanaka; Hiroaki Numata |
| A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. | ||||||
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