Engineered Polymer-Based Electronic Materials |
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| 申请号 | US15562195 | 申请日 | 2016-03-31 | 公开(公告)号 | US20180056455A1 | 公开(公告)日 | 2018-03-01 |
| 申请人 | Alpha Assembly Solutions Inc.; | 发明人 | Ramakrishna Hosur Venkatagiriyappa; Morgana De Avila Ribas; Barun Das; Harish Hanchina Siddappa; Sutapa Mukherjee; Siuli Sarkar; Bawa Singh; Rahul Raut; Ranjit Pandher; | ||||
| 摘要 | A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition. | ||||||
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