序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
221 Alternating current driven latching relay and method of operation EP85106899.9 1985-06-04 EP0164683A2 1985-12-18 Germano, Carmen Peter; Davenport, John Martin

An alternating current latching relay is provided which employs a latching-type, mechanically operated snap-action switch mechanism with a set of electric contacts that are selectively latched either in the open or closed condition in a snap-action manner upon successive actuations of the snap-action mechanism by suitable push rod means for initiating its operation. At least one alternating current excited bender-type piezoelectric drive member has one end secured to a common base member with the latching-type snap-action switch mechanism and the remaining free end engaging the push rod means. An alternative current electric excitation signal is directly applied to the piezoelectric plate elements of the bender- type drive member for mechanically vibrating the bender-type drive member in a manner such that its amplitude of vibration quickly builds up to a value where it repeatedly strikes the push rod means with sufficient force to selectively actuate the snap-action switch mechanism to the opposite one of its two operating conditions from that in which it originally was set. A tuning mass in the form of a slug element is secured to the end of the bender-type drive member to reduce the natural resonant frequency of vibration of the bender-type drive member to substantially the frequency of the alternating current excitation signal to thereby increase the amplitude of its vibrations to a maximum. Additionally, the tuning mass increases the impulse delivered by the bender-type drive member to the push rod for actuating the snap-action mechanism.

222 Piezoelectric driven direct current latching relay EP85106898.1 1985-06-04 EP0164682A2 1985-12-18 Germano, Carmen Peter

A direct current latching relay comprised of bender-type piezoelectric drive members each of which is a three terminal member formed of two piezoelectric plate elements separated by a conductive plane. Each piezoelectric plate element is separately electrically charged with an input pulsed d.c. switching signal of the same polarity as the pre-poling field previously induced in the piezoelectric plate element. By electrically charging one of the piezoelectric plate elements with a switching signal electric field of the same polarity as the pre-poling field, the bender-type drive members are member made to bend in one direction. Alternatively, by charging the opposite plate of the drive member again with a direct current electric charging field of the same polarity as the pre-poling field previously induced in the plate, the bender-type drive member can be caused to bend in the opposite direction. The bender-type peizoelectric drive member whe bent engages and drives a push rod which actuates a snap-action switching contact mechanism from either an open circuit state or to a closed circuit state or vice versa. Pulsed direct current charging fields are applied to the piezoelectric plate element of the bender-type drive member and a high resistance discharge resistor is connected across each of the piezoelectric plate members so asto automatically dischargethe plate members shortly after their excitation. As a result, no long term depolarization of the piezoelectric plate members occurs and because of the pulsed short term nature of the charging fields, no long term deformation (creep) develops in the plate elements over extended periods of usage of the relay.

223 Switch assembly EP82100243 1982-01-14 EP0056624A3 1983-04-06 Sato, Ryuichi; Taniguchi, Tsutomu; Koga, Hirofumi

A switch assembly includes first and second contact members which are operatively provided to take one of two positions, a break-position in which the first and second contact members are separated from each other, and a make-position in which the first and second contact members are electrically connected with each other. Magnetic members are provided operatively in association with the first and second contact members to define a closed magnetic loop with a current path extending through the loop, when the first and second contact members are turned to the make-position. The magnetic members attract each other by the magnetic flux through the closed loop to maintain the first and second contacts in the make-position when the current flowing through the current path is not zero. Thus, the first and second contact members are permitted to return to the break-position at a zero crossing point of a.c. current flowing through the contacts.

224 反転させたマイクロストリップ伝送線路を有するRF微小電子機械システムおよび作製方法 JP2018510069 2016-07-18 JP2018527205A 2018-09-20 リー,ヨンジェ; イアノッティ,ジョセフ・アルフレッド; キーメル,クリストファー・フレッド; カプスタ,クリストファー・ジェームズ
RF MEMSパッケージは、第1の実装基板(42)の頂面に形成された信号線(46)であって、信号線の第1の部分を信号線の第2の部分に選択的に電気的に結合するMEMSデバイス(48)を備える信号線と、信号線のそれぞれの部分に隣接して第1の実装基板の頂面に形成された2対の接地パッド(52、54、56、58)と、を有するMEMSダイ組立体を含む。接地パッドの対は、MEMSデバイスのそれぞれの側に隣接して位置する。接地組立体(43)は、接地パッドの対に電気的に結合され、第2の実装基板、および第2の実装基板の表面に形成された接地領域(62)を含む。接地領域は、第1の実装基板の頂面に面し、接地パッドの対に電気的に結合される。キャビティは、接地領域と信号線との間に形成される。
【選択図】図3
225 電子デバイスおよび電子デバイスの接続部の生成方法 JP2017138300 2017-07-14 JP2017201714A 2017-11-09 オットリンガー, マリオン; クルムファルス, ロベルト; シュタニ, アンドレアス
【課題】圧電アクチュエータ等の電子デバイスのメタライジング部の接続部とその生成方法を提供する。
【解決手段】第1のメタライジング部8と、その上に配設される第2のメタライジング部9とを備えた外部接続部7を有する電子デバイスであって、第1および第2のメタライジング部は焼成され、第2のメタライジング部9は欠損部12を備える。当該欠損部12の下側に第1のメタライジング部8が存在するように、第1のメタライジング部8を部分的に覆う。第2のメタライジング部9に接続部材がはんだ材料によって固定される。接続部材には、欠損部12および第2のメタライジング部9双方の領域で、はんだ材料が設けられ、第1および第2のメタライジング部の異なる濡れ性により、接続部材は、第2のメタライジング部9に良好に付着し、第1のメタライジング部8にはあまり良好に付着しないかまたは付着しない。
【選択図】図1
226 積層された2種の異なる圧電材料を備えるBAW部品、当該BAW部品用の積層体、及び当該BAW部品の製造方法 JP2015548232 2012-12-21 JP6212132B2 2017-10-11 モーラード, ジレ
227 圧電アクチュエータデバイスとその製造方法 JP2013556260 2013-01-29 JP6051412B2 2016-12-27 平岡 聡一郎; 小牧 一樹; 中園 晋輔; 黒塚 章; 堀江 寿彰
228 電子デバイスおよび電子デバイスの接続部の生成方法 JP2015533517 2013-09-09 JP2015531548A 2015-11-02 マリオン オットリンガー,; ロベルト クルムファルス,; アンドレアス シュタニ,
第1のメタライジング部(8)および第2のメタライジング部(9)を備える少なくとも1つの外部接続部(7)を有する電子デバイスが提供され、これらのメタライジング部(8,9)は焼成されており、第2のメタライジング部(9)は、第1のメタライジング部(8)を部分的にのみ覆っている。さらに少なくとも1つの枠形状のメタライジング部(8,9)を有する電子デバイス(1)が提供される。さらに第1および第2のメタライジング部(8,9)を有する電子デバイス(1)が提供され、これらのメタライジング部ははんだ材料との異なる濡れ性を備える。さらに、電子デバイスの接続部の生成方法が提供される。【選択図】図3
229 操作入装置 JP2011286486 2011-12-27 JP5754596B2 2015-07-29 高 陽一郎; 小山 亮二; 足立 和英
230 MEMSスイッチ JP2013537277 2011-10-06 JPWO2013051064A1 2015-03-30 豊田 治; 治 豊田; 島内 岳明; 岳明 島内
【課題】製造が容易で、スティッキングを有効に抑制できるMEMSスイッチを提供する。【解決手段】MEMSスイッチは、固定支持部と、固定支持部に少なくとも1端が固定支持され、延在する可動表面を有する板状可撓梁と、可撓梁の可動表面に配置された可動電気接点と、固定支持部に対する位置が固定され、可動電気接点に対向する固定電気接点と、固定支持部から可動電気接点に向かって、可撓梁の可動表面上方に延在し、電圧駆動することにより可動電気接点を固定電気接点に向かって変位させることのできる第1圧電駆動素子と、少なくとも可撓梁の可動表面に配置され、電圧駆動することにより可動電気接点が固定電気接点から離れる向きに、可撓梁の可動部を駆動する第2圧電駆動素子と、を有する。
231 Reed switch JP2010020372 2010-02-01 JP5598653B2 2014-10-01 朗 秋葉; 浩一 池田
232 Manufacturing methods and mems device of Mems device JP2010048008 2010-03-04 JP5463961B2 2014-04-09 隆史 勝木; 岳明 島内; 雅彦 今井; 治 豊田; 知史 上田
233 Method of manufacturing the actuator, the switch device, the transmission path switching equipment, and test equipment JP2011163277 2011-07-26 JP5394451B2 2014-01-22 久夫 堀; 祥和 阿部; 嘉洋 佐藤
234 Piezoelectric actuator and method of manufacturing the same JP2011264202 2011-12-02 JP2013118234A 2013-06-13 FUJII NORIYOSHI; TAKANO TAKAYUKI
PROBLEM TO BE SOLVED: To provide a piezoelectric actuator capable of stably maintaining in-plane stress of a piezoelectric element, and a method of manufacturing the same.SOLUTION: The piezoelectric actuator includes a base substrate 10 having a cantilever 111, 112, and a piezoelectric element D1 formed on the cantilever. The piezoelectric element D1 has a lower electrode layer L1, a piezoelectric layer L3 formed on the lower electrode layer L1, and an upper electrode layer L2 including a conductive oxide layer L21 formed on the piezoelectric layer L3.The conductive oxide layer L21 has a sharing bond and an ionic bond and thereby has small plastic deformation, so stress relief is not easily caused. Consequently, internal stress (film stress) after film formation can be maintained stably for a long period against repetitive movement of the piezoelectric actuator.
235 MEMSスイッチ JP2011543187 2010-11-02 JPWO2011065192A1 2013-04-11 中村 健太郎; 中村  健太郎; 知徳 藤井
【課題】使用時に生じ得る特性インピーダンスの乱れを相殺するように該特性インピーダンスを調整できるMEMSスイッチを提供する。【解決手段】MEMSスイッチSD10は、第1信号線路SL11に対応して設けられた第1チューナブルキャパシタCA11と、第2信号線路SL12に対応して設けられた第2チューナブルキャパシタCA12と、第1信号線路SL11及び第1チューナブルキャパシタCA11の一方の電極層25側を通じて該第1チューナブルキャパシタCA11の誘電体層24にバイアス電圧を印加するためのバイアス電圧入端子Ti11bと、第2信号線路SL12及び第2チューナブルキャパシタCA12の一方の電極層28側を通じて該第2チューナブルキャパシタCA12の誘電体層27にバイアス電圧を印加するためのバイアス電圧入力端子Ti12bと、を備える。【選択図】図1
236 Switching device and testing device JP2011105610 2011-05-10 JP2012238669A 2012-12-06 HORI HISAO; ABE SACHIKAZU; SATO YOSHIHIRO
PROBLEM TO BE SOLVED: To provide a switching device which makes deviation of a piezoelectric film larger and operates the piezoelectric film.SOLUTION: A switching device 100 comprises: a contact part 120 provided with a first contact 122; an actuator which has a second contact 134 and moves the second contact 134 to touch or separate the first contact 122; and a control unit 200 which controls a first driving voltage. The actuator comprises: a first piezoelectric film 136 which expands or contracts according to the first driving voltage; and a support layer 150 provided on the first piezoelectric film 136. The control unit 200 contracts the first piezoelectric film 136 by changing voltages from a voltage which applies an electric field less than or equal to a first coercive electric field to the first piezoelectric film 136 to a voltage which applies an electric field greater than or equal to the first coercive electric field to the first piezoelectric film 136, and expands the first piezoelectric film 136 by outputting a voltage which applies an electric field less than a second coercive electric field to the first piezoelectric film 136.
237 Switch device and test equipment JP2010269964 2010-12-03 JP4874419B1 2012-02-15 嘉洋 佐藤; 久夫 堀; 祥和 阿部
【課題】圧電式アクチュエータのそり量を抑制するスイッチ装置を提供する。
【解決手段】スイッチ装置100は、第1接点122a,122bが設けられた接点部120と、第2接点134を移動させて第1接点122a,122bと接触または離間させるアクチュエータ130と、を備え、アクチュエータ130は、駆動電圧に応じて伸縮してアクチュエータ130のそり量を変化させる第1圧電膜136と、第1圧電膜136と並行して設けられ、第1圧電膜136に駆動電圧を印加しない状態におけるアクチュエータ130のそりを抑える第2圧電膜138と、を有する。
【選択図】図1
238 Planar voltage protection assembly JP2011084187 2011-04-06 JP2011222998A 2011-11-04 WILLIAM LEE HARRISON; SIDHARTH DALMIA; JAYDIP DAS
PROBLEM TO BE SOLVED: To provide an assembly that protects electronic components from excessive voltage and energy and filters data signals communicated to the components, while keeping the size of the assembly relatively small.SOLUTION: A voltage protection assembly 100 includes at least one conductive trace 104. A conductive input terminal 106 disposed on a substrate is conductively coupled with at least one of the conductive traces. A capacitive element 118 is electrically coupled with the input terminal with at least one conductive trace. An inductive element 120 is conductively coupled with the capacitive element with at least one of the conductive traces. A conductive output terminal 108 is disposed on the substrate and is conductively coupled with the inductive element with at least one of the conductive traces. The output terminal, the inductive element, the capacitive element, and the input terminal are connected in series to form a voltage protection circuit 110 and 112 that filter a frequency of a data signal transmitted through the voltage protection circuit.
239 Piezoelectric driving type mems element JP2009082270 2009-03-30 JP2010238737A 2010-10-21 NISHIGAKI MICHIHIKO; NAGANO TOSHIHIKO; ONO HIROSHI; KAWAKUBO TAKASHI
<P>PROBLEM TO BE SOLVED: To reduce an increase in Q value of a varicap, or transmission loss of a switch in a piezoelectric driving type MEMS (Micro-electro-mechanical System) element. <P>SOLUTION: The piezoelectric driving type MEMS element includes: a substrate; a fixed portion fixing one end of a beam onto the substrate to hold at least a portion of the beam with a gap above the substrate; the beam having a lower electrode film, a lower piezoelectric film formed on the lower electrode film, a middle electrode film formed on the lower piezoelectric film, an upper piezoelectric film formed on the middle electrode film, and an upper electrode film formed on the upper piezoelectric film; a power source portion applying a voltage among the lower electrode film, upper electrode film, and middle electrode film of the beam; and fixed electrode arranged at the end of the beam on the opposite side from the fixed portion and on the substrate constituting an electric circuit. Any one or two electrode films of the lower electrode film, the middle electrode film and the upper electrode film are thicker than the other electrode thereof. <P>COPYRIGHT: (C)2011,JPO&INPIT
240 How wet etching, micro movable element production method, and a micro movable element JP2005079116 2005-03-18 JP4504237B2 2010-07-14 トエン アン グエン; 知史 上田; 忠司 中谷; 雅彦 今井; 岳明 島内
QQ群二维码
意见反馈