| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 41 | Mems switch and method of fabricating the same | US11806143 | 2007-05-30 | US20070227863A1 | 2007-10-04 | Che-heung Kim; Hyung-jae Shin; Soon-cheol Kweon; Kyu-sik Kim; Sang-hun Lee |
| A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines. | ||||||
| 42 | MEMS switch and method of fabricating the same | US11258196 | 2005-10-26 | US07251069B2 | 2007-07-31 | Che-heung Kim; Hyung-jae Shin; Soon-cheol Kweon; Kyu-sik Kim; Sang-hun Lee |
| A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines. | ||||||
| 43 | Micro-electromechanical switch performance enhancement | US10229586 | 2002-08-28 | US07106066B2 | 2006-09-12 | Dan A. Ivanciw; Claude Hilbert |
| In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control element of a closed switch. In another embodiment, a voltage profile applied to the control element of the switch can be tailored to improve the actuation speed or reliability of the switch. In another method embodiment, the performance of a switch may be evaluated by measuring a performance parameter, and corrective action initiated if the switch performance is determined to need improvement. An embodiment of a circuit for maintaining performance of a micro-electromechanical switch includes first and second signal line nodes, sensing circuitry coupled to the signal line nodes and adapted to sense a performance parameter value of the switch, and control circuitry operably coupled to at least one terminal of the switch. | ||||||
| 44 | Method for designing a micro electromechanical device with reduced self-actuation | US11317370 | 2005-12-23 | US20060168788A1 | 2006-08-03 | Hendrikus Tilmans; Xavier Rottenberg |
| A method is described for designing a micro electromechanical device in which the risk of self-actuation of the device in use is reduced. The method includes locating a first conductor in a plane and locating a second conductor with its collapsible portion at a predetermined distance above the plane. The method also includes laterally offsetting the first conductor by a predetermined distance from a region of maximum actuation liability. The region of maximum actuation liability is where an attraction force to be applied to activate the device is at a minimum. | ||||||
| 45 | MEMS switch and method of fabricating the same | US11258196 | 2005-10-26 | US20060132891A1 | 2006-06-22 | Che-heung Kim; Hyung-jae Shin; Soon-cheol Kweon; Kyu-sik Kim; Sang-hun Lee |
| A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines. | ||||||
| 46 | Electrostatic relay | US11237843 | 2005-09-29 | US20060087390A1 | 2006-04-27 | Takashi Yuba; Hideki Iwata |
| An electrostatic micro relay, in which the contact gap between moving and fixed contacts may be increased and the reliability and high-performance regarding contacting and separating the moving contact with and from the fixed contact may be improved. In the micro relay according to the invention, as a comb-shaped moving electrode is supported at an obliquely upper position relative to a fixed comb-shaped electrode, the contact gap may be lengthened. When a predetermined voltage is applied between the contacts, the moving electrode is moved obliquely downward toward the fixed electrode such that the contact surface of the moving electrode slidably contacts the contact surface of the fixed electrode. This slidably contact may cause a wiping effect, whereby each contact surface may be kept clean. | ||||||
| 47 | Method and arrangement for controlling micromechanical element | US09834198 | 2001-04-12 | US07027282B2 | 2006-04-11 | Tapani Ryhänen; Vladimir Ermalov |
| The invention relates to a controlling of micromechanical elements. Especially the invention relates to the controlling of the micromechanical switches. According to a method for controlling at least one micromechanical element a first control signal and a second control signal are fed to the micromechanical element. The second control signal is arranged to set the micromechanical element to an active state and the first control signal is arranged to hold the micromechanical element in the active state. An arrangement for controlling at least one micromechanical element (402) contains at least means for generating at least a first control signal and a second control signal, means for raising a voltage level of at least the second control signal and means for feeding the first control signal and the second control signal with raised voltage level to the micromechanical element. By means of the invention lower voltage levels can be used in micromechanical applications. | ||||||
| 48 | Micro-electromechanical switch performance enhancement | US10983539 | 2004-11-08 | US20050096878A1 | 2005-05-05 | Dan Ivanciw; Claude Hilbert |
| In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control element of a closed switch. In another embodiment, a voltage profile applied to the control element of the switch can be tailored to improve the actuation speed or reliability of the switch. In another method embodiment, the performance of a switch may be evaluated by measuring a performance parameter, and corrective action initiated if the switch performance is determined to need improvement. An embodiment of a circuit for maintaining performance of a micro-electromechanical switch includes first and second signal line nodes, sensing circuitry coupled to the signal line nodes and adapted to sense a performance parameter value of the switch, and control circuitry operably coupled to at least one terminal of the switch. | ||||||
| 49 | MEMS device having flexures with non-linear restoring force | US10075224 | 2002-02-15 | US06806545B2 | 2004-10-19 | Dong-ha Shim |
| A MEMS device having flexure elements with non-linear restoring force. The MEMS device has a substrate, support elements formed on the substrate, a moveable element positioned over the substrate by the support elements to move relative substrate, flexure elements for elastically suspending the moveable element on the support elements, a driving element for moving the moveable element, and repulsive elements for increasing the repulsive force of the flexure elements when the flexure elements supporting the moveable element are resiliently deformed during movement of the moveable element. In a MEMS device, the range of controlling the position of a moveable element is extended if flexure elements having non-linear repulsive force control the position of the moveable element. A restoring force is obtained by flexure elements having non-linear repulsive force and the moveable element is prevented from sticking. The MEMS device has much higher reliability than a general MEMS device. | ||||||
| 50 | Resonant operation of MEMS switch | US10054409 | 2001-11-13 | US20030090346A1 | 2003-05-15 | Vladimir Nikitin |
| A switch arrangement includes a MEMS switch connected to a voltage supply system. The MEMS switch has a mechanical resonant frequency. The voltage supply system has a capability for supplying a voltage with a frequency corresponding to the mechanical resonant frequency of the switch. A method includes providing a MEMS switch including a movable part which has a mechanical resonant frequency, and then supplying an AC voltage to the movable part. The AC voltage has a frequency corresponding to the mechanical resonant frequency of the movable part. | ||||||
| 51 | High-speed MEMS switch with high-resonance-frequency beam | US09943451 | 2001-08-30 | US06531668B1 | 2003-03-11 | Qing Ma |
| A microelectromechanical system (MEMS) switch having a high-resonance-frequency beam is disclosed. The MEMS switch includes first and second spaced apart electrical contacts, and an actuating electrode. The beam is adapted to establish contact between the electrodes via electrostatic deflection of the beam as induced by the actuating electrode. The beam may have a cantilever or bridge structure, and may be hollow or otherwise shaped to have a high resonant frequency. Methods of forming the high-speed MEMS switch are also disclosed. | ||||||
| 52 | MICROELECTROMECHANICAL (MEMS) SWITCH USING STEPPED ACTUATION ELECTRODES | US09900614 | 2001-07-06 | US20030006858A1 | 2003-01-09 | Qing Ma |
| A microelectromechanical (MEMS) switch is described. The switch comprises a cantilever beam having a proximal end and a distal end. The cantilever beam is supported by its proximal end above a substrate by a raised anchor. An intermediate actuation electrode is placed beneath the cantilever beam and is separated from the bottom of the cantilever beam by a narrow gap. Finally, a contact pad or transmission line is placed beneath the cantilever beam and separated from the bottom of the cantilever beam by a larger gap. | ||||||
| 53 | Microswitch and method of fabricating the microswitch | US09934844 | 2001-08-23 | US20020027487A1 | 2002-03-07 | Kenichiro Suzuki |
| A microswitch is realized that can be driven by low voltage, and at the same time, that has increased impedance between switch terminals when the switch is OFF. The relation between upper electrode (4), lower electrode (6), contact electrode (7), and signal lines (8) is arranged such that the minimum distance between contact electrode 7 and signal lines 8 is greater than the minimum distance between upper electrode 4 and lower electrode 6 when the microswitch is in the OFF state. | ||||||
| 54 | MEMS device members having portions that contact a substrate and associated methods of operating | US09822128 | 2001-03-30 | US20020018334A1 | 2002-02-14 | Edward A. Hill; Ramaswamy Mahadevan |
| MEMS devices include a substrate, an anchor attached to the substrate, and a multilayer member attached to the anchor and spaced apart from the substrate. The multilayer member can have a first portion that is remote from the anchor and that curls away from the substrate and a second portion that is adjacent the anchor that contacts the substrate. Related methods are also disclosed. | ||||||
| 55 | Bi-stable memory element | US549697 | 1995-11-06 | US5677823A | 1997-10-14 | Charles Gordon Smith |
| A bi-stable memory element (1) comprises a base contact (3), and a bridging contact (8), both made from an electrically conductive material. The bridging contact (8) is dimensioned so as to have two stable positions, in one of which the bridging contact (8) is in contact with the base contact (3), and in the other of which the bridging contact (8) is spaced apart from the base contact (3). Deflection means (4, 5) deflects the bridging contact (8) from one stable position to the other. | ||||||
| 56 | STICTION REDUCTION FOR MEMS DEVICES | US13706913 | 2012-12-06 | US20140159779A1 | 2014-06-12 | Adrian Napoles; Vijay L. Asrani; Gregory R. Black |
| A capacitive micro-electromechanical switch (MEMS) integrated circuit (IC) comprises a plurality of capacitors, each having a voltage terminal for applying an actuation voltage to the individual capacitor, wherein each capacitor is capable of being individually cycled. The MEMS IC further includes: a high voltage driver having a voltage distribution mechanism that couples to the voltage terminal of each of the plurality of capacitors to enable the high voltage driver to selectively provide a pre-determined voltage input required to actuate and charge a selected one or more of the plurality of capacitors; and control logic communicatively coupled to the high voltage driver and which deterministically applies power cycle times (less than a stiction limit) for an actuation and de-actuation of at least a first capacitor of the plurality of capacitors to substantially reduce an occurrence of stiction within at least the first capacitor during operation of the MEMS device. | ||||||
| 57 | MOVING A FREE-STANDING STRUCTURE BETWEEN HIGH AND LOW ADHESION STATES | US12405758 | 2009-03-17 | US20100237738A1 | 2010-09-23 | CHARLES GORDON SMITH; RICHARD L. KNIPE |
| Embodiments disclosed herein generally solve a stiction problem in switching devices by using a series of pulses of force which take the switch from being strongly adhered to a landing electrode to the point where it is only weakly adhered. Once in the low adhesion state, the switch can then be pulled away from contact with a lower force provided by either the spring constant of the switch and/or the electrostatic forces resulting from low voltages applied to nearby electrodes. | ||||||
| 58 | Method for designing a micro electromechanical device with reduced self-actuation | US11317370 | 2005-12-23 | US07439117B2 | 2008-10-21 | Hendrikus Tilmans; Xavier Rottenberg |
| A method is described for designing a micro electromechanical device in which the risk of self-actuation of the device in use is reduced. The method includes locating a first conductor in a plane and locating a second conductor with its collapsible portion at a predetermined distance above the plane. The method also includes laterally offsetting the first conductor by a predetermined distance from a region of maximum actuation liability. The region of maximum actuation liability is where an attraction force to be applied to activate the device is at a minimum. | ||||||
| 59 | MICRO-ELECTRO MECHANICAL TUNNELING SWITCH | US11943146 | 2007-11-20 | US20080135386A1 | 2008-06-12 | Carl O. Bozler; Craig L. Keast; Jeremy Muldavin |
| A micro-electromechanical system switch includes a substrate and a plurality of actuating electrodes formed the substrate wherein each actuating electrode is activatable. A cantilever beam has a first end and a second end and a plurality of stops formed thereon. The plurality of stops engages the substrate between the plurality of actuating electrode. A contact area is formed in the substrate and located to engage the second end of the cantilever beam. A voltage source applies a voltage to each actuating electrode independently in a sequence from an actuating electrode located adjacent to the first end of the cantilever beam to an actuating electrode located adjacent to the second end of the cantilever beam so that the plurality of stops sequentially engage the substrate between the plurality of actuating electrodes. | ||||||
| 60 | Spring Structure For Mems Device | US11718130 | 2005-10-24 | US20080135385A1 | 2008-06-12 | Peter G. Steeneken; Jozef Thomas Martinus Van Beek; Theo Rijks |
| A MEM device has a movable element (30), a pair of electrodes (e1, e2) to move the movable element, one electrode having an independently movable section (e3), resiliently coupled to the rest of the respective electrode to provide additional resistance to a pull in of the electrodes. This can enable a higher release voltage Vrel, and thus reduced risk of stiction. Also, a ratio of Vpi to Vrel can be reduced, and so a greater range of voltage is available for movement of the movable element. This enables faster switching. The area of the independently movable section is smaller than the rest of the electrode, and the spring constant of the resilient coupling is greater than that of the flexible support. Alternatively, the movable element can have a movable stamp section resiliently coupled and protruding towards the substrate to provide an additional resistance to pull in when it contacts the substrate. | ||||||
QQ群二维码
意见反馈
意见反馈