| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 81 | Method for manufacturing master mold, and method for manufacturing mold structure | JP2010061903 | 2010-03-18 | JP2011194629A | 2011-10-06 | NISHIMAKI KATSUHIRO |
| PROBLEM TO BE SOLVED: To manufacture a master mold high in the uniformity of a recess of an uneven pattern containing a wide recess and a narrow recess in manufacturing the master mold using a reactive ion etching method.SOLUTION: The method for manufacturing the master mold 10 having the uneven pattern containing the wide recess R1 and the narrow recess R2 on the surface using the reactive ion etching method comprises: a main etching process of etching a layer 3 to be worked using an underlayer 2 of a base plate 1 including the layer 3 to be worked and the underlayer 2 as an etching stop layer; and an additional etching process of etching the base plate 1 low in the uniformity of the recess (R1 and R2) after the main etching process at a bias electric power of ≤15 W using etching gas containing a first gas capable of generating a deposit and etching the underlayer 2 to improve the uniformity of the recess (R1 and R2). | ||||||
| 82 | The method of manufacturing an optical variable image bearing shim | JP2010533536 | 2008-11-05 | JP2011507006A | 2011-03-03 | ステュデ カティア; ウィントン スティーヴン; ヴィルヌーブ セバスティアン; アール ボスウェル デイヴィッド; スポーニー ブルノ; ロバート ディッカー マーク |
| 本発明は、複製シムの製造方法およびこの方法によって得られる複製シムに関する。 複製（ＵＶ硬化）シムは、運搬装置（シリンダーまたはベルトなど）と関係なく、従来のニッケルシムと同様の方法で転写ローラーの表面に直接適用することができる（そして表面ＯＶＤ構造をクリア・ラッカーに付与することができる）。 | ||||||
| 83 | Imprint lithography | JP2007075810 | 2007-03-23 | JP4625042B2 | 2011-02-02 | フレデリック ウイスター，サンダー; ウェンデラ クルイト−ステージマン，イボンヌ; シュラム，アイヴァー; フレデリック ディクスマン，ヨハン |
| 84 | Method to fabricate mould for lithography by nano-imprinting | JP2010046387 | 2010-03-03 | JP2010219523A | 2010-09-30 | LANDIS STEFAN |
| <P>PROBLEM TO BE SOLVED: To provide a lithography technique used to fabricate a positive-type imprint. <P>SOLUTION: The invention concerns a device where imprint molds are formed in three dimensions and includes: at least a substrate which is provided with at least one alternate layers each having at least one portion perpendicular to its top surface, the alternate layers each consisting of a first-type material or a second-type material allowed to be selectively etched with respect to each other; and a surface topology which has (a) at least the first patterns whose top lies at the first level relative to the top surface of the substrate located at either side of the topology, and these first patterns are made of the first-type material and (b) at least the second patterns which have at least the second level relative to the top surface of the substrate and are different from and lower than the first level, and these second patterns are made of the second-type material. <P>COPYRIGHT: (C)2010,JPO&INPIT | ||||||
| 85 | Soft mold and a manufacturing method and patterning method using the same that | JP2006158161 | 2006-06-07 | JP4473233B2 | 2010-06-02 | ギスン チェ |
| 86 | Method for producing original master used to produce mold structure, original master, and method for producing mold structure | JP2008173470 | 2008-07-02 | JP2010015629A | 2010-01-21 | NISHIMAKI KATSUHIRO |
| <P>PROBLEM TO BE SOLVED: To provide a method for producing an original master used to produce a mold structure, wherein variance between convex patterns is suppressed. <P>SOLUTION: The method for producing an original master used to produce a mold structure includes: forming a resist layer on a surface of an original master substrate, and exposing and developing the resist layer so as to form on the surface of the substrate an original master resist pattern substantially in the shape of concentric arcs utilized to form an original master concavo-convex pattern; selectively etching the resist pattern under one of a condition that the resist pattern on an inner circumferential side is etched to a greater extent than the resist pattern on an outer circumferential side and a condition that the resist pattern on the outer circumferential side is etched to a greater extent than the resist pattern on the inner circumferential side; and etching the substrate with the selectively etched resist pattern serving as a mask so as to form the original master concavo-convex pattern. <P>COPYRIGHT: (C)2010,JPO&INPIT | ||||||
| 87 | Organic mold and its production method | JP2009158830 | 2009-07-03 | JP2009292150A | 2009-12-17 | KIM TAE WAN; YOO PIL JIN |
| PROBLEM TO BE SOLVED: To materialize an organic mold with multilayer structure which can be easily and repeatedly lifted off from a substrate without irreversible adhesion or generation of defects, has a modulus high enough for forming submicro-patterns on other resin layers and has excellent chemical and dimensional stabilities. SOLUTION: The organic mold with a multilayer structure for forming micropatterns on other resin layers comprises a sheet-like support layer and an organic mold layer which is formed on the support layer, comprises an active energy-curable resin composition, and has micropatterns. COPYRIGHT: (C)2010,JPO&INPIT | ||||||
| 88 | Nanoimprint resist | JP2003584817 | 2003-04-09 | JP4381825B2 | 2009-12-09 | オリベイラ，ペーター・ベエー; ギアー，アンドレアス; シユミツト，ヘルムート; スピエス，バルター; マイアー，ミヒヤエル; メンニヒ，マルテイン; 文雄 北 |
| The invention relates to a method for microstructuring electronic components, which yields high resolutions (<=200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF<SUB>3</SUB>/O<SUB>2 </SUB>plasma; vii) the bottom coat is plasma etched, preferably with O<SUB>2 </SUB>plasma; viii) the semiconductor material is etched or the semiconductor material is doped in the etched areas. | ||||||
| 89 | Manufacturing method and the method of manufacturing a stamper of the stamper master | JP2003585081 | 2003-04-15 | JP4366193B2 | 2009-11-18 | 公二 三宅; 一彦 佐野; 修 小川; 祥次郎 山中; 定文 越野 |
| 90 | A substrate having a nano pattern forming method and a pattern formed by this | JP2009502671 | 2007-03-27 | JP2009531734A | 2009-09-03 | オー、スン−テ; キム、ドク−ジュ; ハン、サン−チョル; ヘニク、マシアス |
| 【課題】
【解決手段】本発明は、ナノパターンを形成する方法、特に、大面積に連続してナノパターンを形成する方法と、ロール状の基板にナノパターンを形成する方法、およびこれによって形成されたパターンを有する基板に関するものである。 本発明は、大面積試片と干渉光の光源を互いに相対的に移動させる方法と、ロール状の基板を回転させながら、干渉光の光源と前記ロール状基板との基板の軸方向への相対運動によって露光する方法を利用することにより、ナノパターンを形成するときに求められる広い設備空間、レーザ出力の制限性、およびパターン自由度の制限性などの従来問題を解決したものである。 【選択図】図１ |
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| 91 | Lithographic template | JP2009099200 | 2009-04-15 | JP2009200510A | 2009-09-03 | RESNICK DOUG J; NORDQUIST KEVIN J |
| PROBLEM TO BE SOLVED: To provide a method of forming a lithographic template. SOLUTION: A pattern in a semiconductor device 44 deforms by positioning a template 42 extremely adjacent to the semiconductor device 44 which has an optical irradiation reaction material 50 on it, and applying pressure 52 to make the optical irradiation reaction material 50 flow into a relief image 48 existing on the template 42. Next, optical irradiation 53 is performed through the template 42, a part of the optical irradiation reaction material 50 is further cured, and the optical irradiation reaction material 50 is further made to demarcate the pattern. Next, the template 42 is removed and manufacturing of the semiconductor device 44 is completed. COPYRIGHT: (C)2009,JPO&INPIT | ||||||
| 92 | Method for reproducing fine mold and fine mold | JP2006258571 | 2006-09-25 | JP4281773B2 | 2009-06-17 | 敦夫 服部 |
| 93 | Pattern forming method, pattern forming device, method for manufacturing recording medium, and method for manufacturing member | JP2006245281 | 2006-09-11 | JP2008065223A | 2008-03-21 | MATSUSHITA NAOHISA |
| <P>PROBLEM TO BE SOLVED: To achieve a method of forming a pattern by which a reactive portion of a photosensitive resin is finely controlled upon forming a fine pattern on a substrate and the thickness of the photosensitive resin layer is easily controlled. <P>SOLUTION: The fine pattern is formed by condensing a particularly ultrashort pulse laser beam to focus on an interface between a substrate and a photosensitive resin layer so as to react the photosensitive resin layer. In this process, the ultrashort pulse laser beam is made to irradiate the layer through the substrate side. <P>COPYRIGHT: (C)2008,JPO&INPIT | ||||||
| 94 | Manufacturing method of large area stamper | JP2007219965 | 2007-08-27 | JP2008055907A | 2008-03-13 | RA SEUNG HYUN; LEE CHOON-KEUN; KEE SANG MOON; CHO JAE-CHOON |
| PROBLEM TO BE SOLVED: To provide a manufacturing method of a large area stamper capable of manufacturing the large area stamper over many stages by a simple process. SOLUTION: The manufacturing method of the large area stamper 20 includes a stage (a) for laminating a first mask 23a having a first pattern 26a formed thereto on a positive photoresist layer 21, a stage (b) for exposing the upper surface of the first mask 23a, a stage (c) for developing the positive photoresist layer 21 to form recessed parts 27, a stage (d) for performing molding so as to form the protruded parts 28 corresponding to the recessed parts 27, and a stage (e) for removing the positive photoresist layer 21. COPYRIGHT: (C)2008,JPO&INPIT | ||||||
| 95 | Metal mold is modified to use the imprint method | JP2007513944 | 2005-05-27 | JP2008500914A | 2008-01-17 | ゲラン、フレネッソン; ババク、ハイダリ; マチアス、カイル; マルク、ベック |
| 本発明は、接着防止特性を有する新規な金属製の成形型に関し、該型は、ベース金属製成形型および接着防止層を含んでなり、該接着防止層は、リン原子およびアルキル鎖を包含する、フッ素化されたアルキルリン酸誘導体またはフッ素化されたアルキルポリ−リン酸誘導体を含んでなる。 接着防止層は、ベース金属製成形型の表面に直接結合する。 ベース成形型は、例えばニッケルでよく、フッ素化されたアルキルリン酸誘導体または該フッ素化されたアルキルポリ−リン酸誘導体は、リン原子がアルキル鎖に直接結合するように、ホスホン酸、ホスフィン酸、ホスホネートおよびホスホネート塩、ホスフィネートおよびホスフィネート塩、またはそれらのそれぞれのオリゴマーからなる群から選択することができる。 | ||||||
| 96 | Stamp having a non-adhesive layer, forming method and repair process of the stamp | JP2003511035 | 2002-07-04 | JP3920850B2 | 2007-05-30 | ヘイダリ，ババック; リング，トルビョールン |
| 97 | Mold, imprint method, and method of manufacturing chip | JP2006194905 | 2006-07-14 | JP2007103915A | 2007-04-19 | TERASAKI ATSUNORI; SEKI JUNICHI; SUEHIRA NOBUHITO; INE HIDEKI; OKUJIMA SHINGO |
| PROBLEM TO BE SOLVED: To provide a mold enabling precise alignment between the mold and a work piece even if interposing a photo-curing resin between the mold and the work piece. SOLUTION: The mold has a substrate 2010 containing a first material, and an alignment mark 2102 that is formed on the substrate and contains a second material different from the first one. The first and second materials are transparent to light having at least a partial wavelength region in ultraviolet rays, and the refractive index of the second material is set to at least 1.7. COPYRIGHT: (C)2007,JPO&INPIT | ||||||
| 98 | Soft mold, manufacturing method therefor, and patterning method using the manufacturing method | JP2006158161 | 2006-06-07 | JP2006344972A | 2006-12-21 | CHAE GEE SUNG |
| PROBLEM TO BE SOLVED: To provide a soft mold and a manufacturing method therefor which prevent that resin becomes hydrophobic since area is reduced in surfaces of a PDMS (polydimethylsiloxane) mold where organic substances are transferred, and to provide a patterning method using the manufacturing method. SOLUTION: The manufacturing method comprises a step for forming a synthetic resin layer 50a on a substrate 60, a step for preparing a mold 1 with a predetermined pattern, which has metal particles 20 on its surfaces, a step for contacting the mold with the predetermined pattern to the synthetic resin layer, a step for imprinting the synthetic resin layer with the pattern of the mold, and a step for forming an organic layer on the synthetic resin layer which is imprinted with the pattern of the mold. COPYRIGHT: (C)2007,JPO&INPIT | ||||||
| 99 | The method of forming the structure by the transfer pattern | JP2002224327 | 2002-08-01 | JP3821069B2 | 2006-09-13 | 昭浩 宮内; 満 長谷川 |
| 100 | Method for manufacturing stamper for optical wave guide plate manufacture | JP2005001694 | 2005-01-06 | JP2006159883A | 2006-06-22 | CHOI TAE-HYUN |
| PROBLEM TO BE SOLVED: To provide a method for manufacturing a stamper for optical wave guide plate manufacturing capable of holding high brightness. SOLUTION: The method comprises the manufacturing steps of (1) cleaning glass evaporated with a conductive film, (2) plating on the conductive film by a conductive material, (3) spin-coating a plated layer with a photoresist, (4) mounting a desired pattern mask then to expose and subsequently develop, (5) etching the plated layer in which the photoresist is partially removed by a wet etching method, (6) removing a remaining photoresist, (7) manufacturing a master to a completed pattern face through nickel plating and (8) manufacturing the stamper by mold-releasing the master and repeatedly plating. COPYRIGHT: (C)2006,JPO&NCIPI | ||||||
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