| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | Production of microlens array | JP34147589 | 1989-12-27 | JPH03198003A | 1991-08-29 | SUMI TAKESHI |
| PURPOSE: To obtain microlenses with good reproducibility by changing the thickness of a photoresist, the shape of a photomask, exposure, and baking conditions. CONSTITUTION: The fairly thick photoresist 5 taking the radius of curvature of the microlenses into consideration is applied on a glass substrate 4 as a substrate. The photomask 7 is brought into tight contact with the photoresist and the resist is exposed. The photoresist 5 is developed after the exposing, by which the circular columnar photoresist 5 lining up in the form of an array is formed. The surface of this photoresist 5 is then baked. Further, the glass substrate 4 is peeled and the photoresist 5 is removed to produce an Ni stamper 10. A photosensitive resin monomer 11 is dropped onto the surface of the Ni stamper 10 and is subjected to exposing with UV rays to polymerize the photosensitive resin monomer 11. Finally, a transparent plate 11 is peeled from the Ni stamper 10. The microlenses are obtd. with the good reproducibility in this way. COPYRIGHT: (C)1991,JPO&Japio | ||||||
| 162 | JPS5224506B2 - | JP9043673 | 1973-08-10 | JPS5224506B2 | 1977-07-01 | |
| 163 | NANOIMPRINTING MOLD | PCT/JP2012056779 | 2012-03-09 | WO2012121416A4 | 2013-01-10 | SATOU NAOTOSHI; OMATSU TADASHI; WAKAMATSU SATOSHI |
| [Objective] To suppress the collapse of the end portions of protrusions of a pattern on curable resin when a mold is pressed against the curable resin on a substrate then separated therefrom, in nanoimprinting that employs a mold having a predetermined fine pattern of protrusions and recesses on the surface thereof. [Constitution] A nanoimprinting mold has a fine pattern (13) of protrusions and recesses constituted by a plurality of linear protrusions (14) and a plurality of recesses (15) on the surface thereof. The pattern (13) of protrusions and recesses includes at least one recess (15) having an end portion (15a) of a predetermined shape. The predetermined shape is that which has a cross section with a smaller aspect ratio than an aspect ratio of a cross section of a connecting portion (15b), which is a portion of the recess (15) having the end portion (15a) other than the end portion (15a) and continuous therewith. | ||||||
| 164 | PHOTOCURABLE RESIN COMPOSITION FOR IMPRINT LITHOGRAPHY AND METHOD FOR MANUFACTURING AN IMPRINT MOLD USING SAME | PCT/KR2010005035 | 2010-07-30 | WO2011016651A3 | 2011-06-09 | KIM BYUNG-UK; YOO JAE-WON; KIM UN-YONG; KWAK EUN-JIN |
| The present invention relates to a photocurable resin composition for imprint lithography for forming patterns of various sizes on a substrate, and to a method for manufacturing an imprint mold using same. The photocurable resin composition has superior adhesive properties, and thus can be applied to a variety of materials such as plastic, metal, glass, etc. The photocurable resin composition not only has excellent contamination resistance, but also controls the surface energy of a mold to exhibit superior releasing properties for enabling the mold to be easily released from the substrate. The photocurable resin composition of the present invention has excellent crosslinkability, and thus exhibits non-swelling properties when exposed to an organic solvent. The photocurable resin composition of the present invention has superior mechanical properties, and high restoring force and permeability, and thus can be effectively used in manufacturing a mold for imprint lithography. | ||||||
| 165 | DRY ADHESIVES AND METHODS FOR MAKING DRY ADHESIVES | PCT/US2007025683 | 2007-12-14 | WO2008076390A3 | 2008-10-09 | SITTI METIN; MURPHY MICHAEL; AKSAK BURAK |
| Dry adhesives and methods for forming dry adhesives. A method of forming a dry adhesive structure (30) on a substrate (10), comprises: forming a template backing layer (12) of energy sensitive material on the substrate (10); forming a template layer (14) of energy sensitive material on the template backing layer (12); exposing the template layer (14) to a predetermined pattern of energy; removing a portion of the template layer (14) related to the predetermined pattern of energy, and leaving a template structure (20) formed from energy sensitive material and connected to the substrate (10) via the template backing layer (12). | ||||||
| 166 | NANOIMPRINT RESIST | PCT/EP0303666 | 2003-04-09 | WO03087935A2 | 2003-10-23 | SPIESS WALTER; KITA FUMIO; MEIER MICHAEL; GIER ANDREAS; MENNIG MARTIN; OLIVEIRA PETER W; SCHMIDT HELMUT |
| The invention relates to a method for microstructuring electronic components, which yields high resolutions (<=200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF3/O2 plasma; v) the bottom coat is plasma etched, preferably with O2 plasma; vi) the semiconductor material is etched or the semiconductor material is doped in the etched areas. | ||||||
| 167 | MICROMOLDS FABRICATED USING MEMS TECHNOLOGY AND METHODS OF USE THEREFOR | PCT/US0041781 | 2000-10-31 | WO0144875A3 | 2002-06-27 | EVANS JOHN; HAVENS JOHN R; HARVEY NOEL; SMOLKO DAN |
| A method of making microreaction molds for grafting and molding very thin films onto surfaces of materials such as microchips is provided. The methods utilize MEMS technology to achieve the manufacture of molds that have a high degree of consistency and uniformity in the thicknesses of the films applied to the surfaces. Use of MEMS technology allows such molds to be made with an accuracy of less than 1 mu m in mold depth. The method provides for the manufacture of molds from a single transparent material that is able to be etched in a consistent manner. The method of this invention is particularly applicable to mass generation of microchip surfaces having uniform thin polymeric films bound thereto. | ||||||
| 168 | VERFAHREN ZUR HERSTELLUNG EINES DRUCK- ODER PRÄGEZYLINDERS ODER EINER DRUCK- ODER PRÄGEHÜLSE | EP13198764.6 | 2013-12-20 | EP2886366B1 | 2018-10-31 | Theis, Uwe; Höhnen, Roland |
| 169 | Procédé de fabrication d'un moule pour la lithographie par nano-impression | EP10155088.7 | 2010-03-01 | EP2226678B1 | 2018-01-03 | Landis, Stéfan |
| 170 | Procédé de fabrication d'un moule pour la lithographie par nano-impression | EP10155089.5 | 2010-03-01 | EP2226679B1 | 2017-10-11 | Landis, Stéfan; Morand, Yves |
| 171 | Vorrichtung zum Herstellen von Stempel-Klischees | EP12450019.0 | 2012-04-12 | EP2523044B1 | 2016-02-10 | Faber, Ernst |
| 172 | Verfahren zur Herstellung eines Druck- oder Prägeklischees | EP13198769.5 | 2013-12-20 | EP2886367A1 | 2015-06-24 | Theis, Uwe; Höhnen, Roland |
Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung eines Druck- oder Prägeklischees umfassend eine strukturiert ausgebildete Klischeeaußenfläche zur Erzeugung einer Druck- oder Prägestruktur auf einem Material oder einer Materialbahn, wobei zumindest die Klischeeaußenfläche mittels eines generativen Fertigungsverfahrens hergestellt wird. |
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| 173 | STRUKTURSTEMPEL, VORRICHTUNG UND VERFAHREN ZUM PRÄGEN | EP12756711.3 | 2012-09-06 | EP2870510A1 | 2015-05-13 | FISCHER, Peter; KREINDL, Gerald; HARMING, Jakob; THANNER, Christine; SCHÖN, Christian |
| The invention relates to a structure stamp (5) with a microstructured or nanostructured stamp face (2) for embossing an embossed structure corresponding to the stamp face (2) onto a flexible stamp (1) having an embossing surface (6o), and with a frame (3) for clamping the stamp (1). In addition, the invention relates to a device for embossing an embossing pattern on an embossing surface () with the following features: a stamp holder for holding and moving a structure stamp (5) in accordance with one of the preceding claims; an embossing material holder for holding and arranging a material to be embossed (6) opposite the structure stamp (5); an embossing element drive for moving an embossing element (8), particularly one designed in accordance with one of the claims 3, 4, 7 or 8, along the structure stamp (5). The invention further relates to a corresponding method. | ||||||
| 174 | PROCEDE DE FABRICATION DE PIECES MICROMECANIQUES DIFFICILEMENT REPRODUCTIBLES, ET PIECES MICROMECANIQUES FABRIQUEES SELON CE PROCEDE | EP13727596.2 | 2013-06-05 | EP2855737A1 | 2015-04-08 | LORENZ, Hubert; GENOLET, Grégoire; GLASSEY, Marc-André; WINKLER, Pascal |
| The invention relates to a method for the production of a part, comprising the following steps: a) deposition of a diffractive layer on a substrate; b) deposition of a first photosensitive resin layer on the diffractive layer; c) illumination of the first photosensitive resin layer through a first photomask, such as to selectively remove portions of the photosensitive resin; d) etching of the diffractive layer in the areas not covered by the photosensitive resin; e) removal of the first photosensitive resin layer; f) deposition of a conductive layer on top of the substrate, on top of the remaining diffractive layer portions; g) deposition of a second photosensitive resin layer; h) illumination of the photosensitive resin layer through a second photomask, such as to selectively remove portions of the second photosensitive resin layer; i) electroforming-based deposition on top of the conductive layer between the remaining portions of the second photosensitive resin; j) release of the part by removal of at least the photosensitive resin. | ||||||
| 175 | METHOD FOR PRODUCING THREE-DIMENSIONAL MONOLITHIC MICROFLUIDIC DEVICES | EP12731717.0 | 2012-05-31 | EP2715450A1 | 2014-04-09 | LENARDI, Cristina; TOCCHIO, Alessandro; MARTELLO, Federico |
| A method is described for producing a microfluidic device (19), which comprises the phases of producing a three-dimensional template (15) of geometry equal to the channelings that is desired to obtain in the device; inserting the template in the desired position into a mold (16), keeping it suspended by at least one of its end; coating said template by immersion in (or deposition of) a material in the liquid phase (or dissolved or dispersed in a solvent) capable of solidifying by means of a chemical reaction or physical transformation, forming a material constituting the body of the final device; and selectively removing the three-dimensional template. In a variant of the method, useful for the production of scaffolds to be inserted into the human body, a porogenic material is added to the liquid precursor or to the precursor solution, such that the material of the solid matrix is characterized by a continuous structure of pores into which it is possible to insert live cells. | ||||||
| 176 | METHOD FOR MANUFACTURING STAMPER FOR INJECTION MOLDING | EP10815592 | 2010-09-06 | EP2476025A4 | 2014-03-05 | KIM YOUNG KYU; JEONG SEOK JAE |
| 177 | CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME | EP10792234 | 2010-06-23 | EP2399168A4 | 2013-06-05 | FUJIMORI TORU; SHIRAKAWA KOJI; USA TOSHIHIRO; SUGIYAMA KENJI; ITO TAKAYUKI; TSUBAKI HIDEAKI; NISHIMAKI KATSUHIRO; HIRANO SHUJI; TAKAHASHI HIDENORI |
| 178 | METHOD FOR PRODUCING A STAMP FOR HOT EMBOSSING | EP10738180 | 2010-02-03 | EP2393751A4 | 2013-05-29 | GREENER JESSE; LI WEI; KUMACHEVA EUGENIA |
| 179 | METHOD OF PRODUCING A RELIEF IMAGE FROM A LIQUID PHOTOPOLYMER RESIN | EP11790137.1 | 2011-04-06 | EP2577400A1 | 2013-04-10 | VEST, Ryan; JOHNSON, Deborah |
| A method of producing a relief image from a liquid photopolymerizable resin, said method comprising the steps of; a) placing a coverfilm onto an exposure glass; b) casting a liquid photopolymerizable resin layer onto the coverfilm; c) laminating a substrate to a backside of the liquid photopolymerizable resin layer as the liquid photopolymerizable resin layer is being cast onto the coverfilm; d) placing an image or film negative on top of the substrate; and e) exposing the liquid photopolymerizable resin layer through the image or film negative from the backside of the liquid photopolymerizable resin layer to selectively crosslink and cure the photopolymerizable resin layer and form a cured relief image, wherein said depth of the cured relief image is less than the height of the cast liquid photopolymerizable resin. | ||||||
| 180 | PROCEDE DE MICRO-LITHOGRAPHIE UTILISANT UN MASQUE A SURFACE COURBE, ET UN MASQUE CORRESPONDANT | EP04816132.7 | 2004-09-15 | EP1664926B1 | 2013-04-10 | GUIBERT, Jean-Charles |
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