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Multilevel conductor structure and method

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专利汇可以提供Multilevel conductor structure and method专利检索,专利查询,专利分析的服务。并且The present invention relates to a multilevel conductor structure and to a method of insulating an upper level of conductors from a lower level of conductors on a silicon substrate of an integrated circuit. An undoped silicon oxide insulator layer and a doped silicon oxide insulator layer are successively placed on the lower level of conductors and the structure is heated to a temperature which is sufficient to cause the doped oxide insulator layer to soften and to flow above the lower conductors to produce tapered steps over the edges of the lower level of conductors. An upper level of conductor is then formed on the tapered doped silicon oxide insulator layer. The undoped silicon oxide insulator layer formed between the doped silicon oxide insulator layer and the lower level of conductors prevents doping atoms of the doped silicon oxide insulator layer from penetrating into source or drain regions of the silicon substrate which are usually in the vicinity of the lower level of conductors to change their conductivity.,下面是Multilevel conductor structure and method专利的具体信息内容。

1. A METHOD OF FORMING A FIRST CONDUCTOR OOVER AND INSULATED FROM A SECOND CONDUCTOR ON A SUBSTRATE HAVING DIFFUSED REGIONS THEREIN COMPRISING THE STEPS OF: A. DEPOSITING AN UNDOPED INSULATOR LAYER ON THE FIRST CONDUCTOR, B. DEPOSITING A DOPED INSULATOR LAYER HAVING A GIVEN FLOW TEMPERATURE, ON THE UNDOPED INSULATOR LAYER TO FORM A MATRIX; C. HEATING THE MATRIX TO THE FLOW TEMPERATURE OF THE DOPED INSULATOR LAYER TO CAUSE THE EXPOSED SURFACE OF THE DOPED INSULATOR LAYER TO FLOW AND BECOME TAPERED AT AREAES ADJACENT THE EDGES OF THE FIRST CONDUTOR, AND D. DEPOSITING THE SECOND CONDUCTOR ON THE TAPERED SURFACE OF THE DOPED INSULATOR LAYER.
2. The method of claim 1 wherein the flow temperature is maintained below the destruction temperature of the diffused regions.
3. THE METHOD OF CLAIM 1 WHEREIN THE FLOW TEMPERATURE IS MAINTAINED BELOW 1,200*C.
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