序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
81 Method for bonding of a ceramic body and a metallic body US318550 1994-10-05 US5534103A 1996-07-09 Tetsuo Yano; Toshihiko Ooie; Masafumi Yoneda; Akihiro Utsumi; Munehide Katsumura; Jun Matsuda
Proposed is a method for bonding of a ceramic body and a metallic body at a relatively low temperature not to cause substantial deformation or material degradation of the ceramic and metallic materials. The surface of the ceramic body is first irradiated with laser beams in vacuum so that the inorganic non-volatile constituent of the ceramic material, e.g. silicon when the ceramic is silicon nitride, is isolated on the surface of the ceramic body forming a layer. Thereafter, the metallic body is brought into contact with and pressed in vacuum against the thus laser beam-irradiated area of the ceramic body under an adequate pressing force and at an elevated but relatively low temperature which is, for example, not higher than 0.5Tm .degree.C., Tm .degree.C. being the melting point of the metallic material, so that the ceramic and metallic bodies are firmly bonded together. It is preferable that the surface of the metallic body is subjected beforehand to an activation or cleaning treatment, for example, by the bombardment with ion beams of an inert gas, e.g., argon.
82 Bonding of bodies of refractory hard materials to carbonaceous supports US28359 1993-03-09 US5320717A 1994-06-14 Jainagesh A. Sekhar
Bodies (3) such as tiles, plates, slabs or bricks of Refractory Hard Material (RHM) or other refractory composites are bonded to the cathodes or to other components, in particular to a carbon cell bottom (1), of a cell for the production of aluminium by electrolysis of a cryolite-based molten electrolyte, made of carbonaceous or other electrically conductive refractory material, by a non-reactive colloidal slurry (4) comprising particulate preformed RHM in a colloidal carrier selected from colloidal alumina, colloidal yttria and colloidal ceria. The slurry usually comprises preformed particulate TiB.sub.2 in colloidal alumina. The bodies (3) are usually TiB.sub.2 --Al.sub.2 O.sub.3 composites. The bonding is achieved simply by applying the slurry and allowing it to dry.
83 Method for joining parts of ceramic high-temperature superconductor material US966589 1992-10-26 US5244876A 1993-09-14 Eberhard Preisler; Joachim Bock; Johannes Holzem; Werner Horst
Method for joining parts of ceramic high-temperature superconductor material of the composition Bi.sub.(2+a-b) (Sr.sub.1-c) Ca.sub.c) .sub.(3-a) Pb.sub.b Cu.sub.(2+d) O.sub.x, where a is 0 to 0.3, b is 0 to 0.5, c is 0.1 to 0.9 and d is 0 to 2 and x has a value depending on the state of oxidation of the metals present, the end faces of the parts located at a gap spacing apart from one another are heated by means of a fuel gas/oxygen flame to temperatures from 750.degree. to 875.degree. C. Simultaneously, a rod of the same material above the spacing gap is heated until the melt thereof drips off into the gap between the end faces of the two parts, completely filling the gap. At least the joint region between the two parts is then heat-treated for 7 to 100 hours at temperatures between 780.degree. and 850.degree. C.
84 Method for surface bonding of ceramic bodies US920030 1992-07-27 US5240171A 1993-08-31 Marc S. Newkirk; Robert C. Kantner; Eugene S. Park
Two or more ceramic bodies are bonded together by oxidizing with a vapor-phase oxidant molten metal obtained from a body of precursor metal to form an oxidation reaction product bond. The oxidation reaction product is formed between adjacent facing, substantially congruent surfaces of the ceramic bodies and bridges the surfaces, thus bonding the ceramic bodies to each other. Promoters may optionally be used to facilitate formation of the oxidation reaction product.
85 Bonding composition for ceramics comprising metal oxide melt and method for bonding ceramics US207620 1988-06-16 US4952454A 1990-08-28 Nobuya Iwamoto; Norimasa Umesaki
A bonding composition comprising a metal oxide melt comprising (a) CaO, (b) SiO.sub.2 and/or Al.sub.2 O.sub.3, and (c) a metal oxide selected from TiO.sub.2, ZrO.sub.2, Cr.sub.2 O.sub.3, HfO.sub.2, Nb.sub.2 O.sub.3 and Ta.sub.2 O.sub.5 is melt-bonded on the surface of a ceramic material, and the ceramic material is bonded to an adherend, if necessary through at least one layer selected from a plating layer, a solder layer, and a buffer layer. In this manner, a strong bonding can be very easily obtained.
86 Ceramic-to-metal seal US3589751D 1968-06-21 US3589751A 1971-06-29 ESNAUD SERGE
A method for reinforcing seals between a ceramic part and a metal part consisting in forming a hoop built up by one or more layers of particles deposited on one of the parts to be sealed to each other.
87 Ceramic discharge lamp having a flexible metal electrode connector US3497756D 1967-08-18 US3497756A 1970-02-24 KNOCHEL WILLIAM J; SKWIRUT HENRY
88 Sealed discharge device US3480823D 1966-08-12 US3480823A 1969-11-25 CHEN CHENG-LIN
89 Ceramic arc tube and closure member construction US3422300D 1966-06-30 US3422300A 1969-01-14 KNOCHEL WILLIAM J; LIN FRANCIS C M; FRASER HUGH D
90 Titanium activated nickel seal and method of forming it US55969566 1966-06-22 US3395993A 1968-08-06 BRISTOW ROBERT H
91 Ceramic-metallizing tape US12061761 1961-06-29 US3293072A 1966-12-20 DANIEL DOOLITTLE HOWARD; ETTRE KITTY S
92 Ceramic-to-metal seals US39245064 1964-08-27 US3284118A 1966-11-08 KESSLER JR SEBASTIAN W
93 Metallizing sintered alumina ceramic bodies US21061562 1962-07-16 US3241995A 1966-03-22 PULFRICH HANS; STOPORA HANS
94 Method for sealing ceramics US12020361 1961-06-28 US3239323A 1966-03-08 FOLWEILER ROBERT C
An integral ceramic body is formed by abutting two or more shapes of identical composition composed of one or more of alumina, magnesia and Berrylia with a continuous layer of powder of the same composition interposed between the mating surfaces of each pair of shapes, pressing and firing under pressure the whole assembly until an integral joint, preferably also vacuum-tight, is obtained. Firing can be in hydrogen.
95 Method for forming enclosures for semiconductor devices US7604660 1960-12-15 US3220095A 1965-11-30 SMITH WILLIAM C
96 Container for an electrical component US28814463 1963-06-17 US3187083A 1965-06-01 JACOB GRIMES MILTON
97 Karl-birger persson US3125698D US3125698A 1964-03-17
98 Metal-to-ceramic joint and method of forming US65049757 1957-04-03 US3055465A 1962-09-25 HANS PULFRICH
99 Composite article and method US56276356 1956-02-01 US2889952A 1959-06-09 CLAYPOOLE STEWART A
100 Method of making metal-to-ceramic seals US43360854 1954-06-01 US2838390A 1958-06-10 HARRY BENDER
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