序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
161 HIGH VELOCITY METALLIC POWDER SPRAY FASTENING US11621456 2007-01-09 US20070194085A1 2007-08-23 Donald Spinella; Sherri McCleary
The present invention provides a low temperature joining method that is compatible with multiple materials and results in a bond between joined structures without reducing the mechanical properties of the joined structures base materials. The method of the present invention includes the steps of contacting a first structure to a second structure; and directing particles of a metallic bonding material towards an interface between the first structure and second structure at a velocity to cause the particles of the metallic bonding material form a molecular fusion between the first structure and second structure.
162 Ceramic matrix composite turbine vane US10158966 2002-05-31 US06648597B1 2003-11-18 Scott M. Widrig; Jay Morrison; Harry A. Albrecht; Yevgeniy Shteyman; Steven C. Butner
A ceramic matrix composite material (CMC) vane for a gas turbine engine wherein the airfoil member (12) and the platform member (14) are formed separately and are then bonded together to form an integral vane component (10). Airfoil member and the platform member may be bonded together by an adhesive (20) after being fully cured. Alternatively, respective joint surfaces (16, 18) of the green body state airfoil member and platform member may be co-fired together to form a sinter bond (30). A mechanical fastener (38) and/or a CMC doubler (42) may be utilized to reinforce the bonded joint (40). A matrix infiltration process (50) may be used to create or to further strengthen the bond.
163 Metal-ceramic composite and vacuum switch unit using the same US09995578 2001-11-29 US06566621B2 2003-05-20 Yusuke Makino
A metal-ceramic composite (a vacuum switch unit 50) having a metal member 13 having a tubular portion 13b, and a cylindrical ceramic member 55. The metal-ceramic composite (the vacuum switch unit 50) has a structure in which an end face of the tubular portion 13b of the metal member 13 is butt joined via a joint metal layer 15 to an end face 55a of the cylindrical ceramic member 55 in an edge sealed manner. In order to provide a metal-ceramic composite having a high joint strength which is less likely to cause defects such as cuts or cracks at the joint, the joint metal layer 15 and the ceramic member 55 contact each other at an annular region of W (mm) in average width which extends circumferentially about the end face 55a of the ceramic member 55. Furthermore, W and D have respective values which satisfy D≧30 {circle around (1)}; and (1/60)×D≦W≦(D/30)+3.1 {circle around (2)} where D (mm) is an outer diameter of the ceramic member.
164 Wafer holder for semiconductor manufacturing apparatus, and method of manufacturing the wafer holder US10309402 2002-12-03 US20030079684A1 2003-05-01 Akira Kuibira; Hirohiko Nakata; Kenjiro Higaki; Masuhiro Natsuhara; Takashi Ishii; Yasuyuki Matsui
A wafer holder for a semiconductor manufacturing apparatus has a high heat conductivity. The wafer holder includes a sintered ceramic piece, a conductive layer such as a heater circuit pattern which can be formed with high precision on at least one surface of the sintered ceramic piece, and a protective layer formed over the conductive layer on the sintered ceramic piece so as to cover a surface of the conductive layer. The protective layer may contain a glass, a non-oxide ceramic such as aluminum nitride or silicon nitride, an oxide of ytterbium, neodymium and calcium, or an oxide of yttrium and aluminum. In a method of manufacturing the wafer holder, a paste containing metal particles is applied on a surface of the sintered ceramic piece and is fired to form a heater circuit pattern as the conductive layer. Then the protective layer is formed on the sintered ceramic piece to cover the surface of the conductive layer.
165 Joint body of ceramic member and metal member and method of producing the same US09491586 2000-01-25 US06436545B1 2002-08-20 Nobuyuki Tanahashi; Tomoyuki Fujii; Tsuneaki Ohashi
A joint body according to the invention is strong for a heat cycle and generates no local cracks. The joint body has the following features. An end portion of the metal member and the ceramic member are connected via a metal connection portion. The metal connection portion has a metallized layer formed on the ceramic member and a brazing connection portion interposing at least between the metallized layer and an end portion of the metal member. A melt point of a brazing member constructing the brazing connection portion is lower than that of a brazing member constructing the metallized layer.
166 Method for sealing and/or joining an end of a ceramic filter US09803440 2001-03-09 US20010044999A1 2001-11-29 Marcus A. Ritland; Dennis W. Readey; Richard N. Kleiner; Jack D. Sibold; Kyle Knudson; Steven Landin; Paul Thoen
A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal. Methods for joining infiltrated ends are also provided.
167 Method for sealing and/or joining an end of a ceramic filter US08996680 1997-12-23 US06247221B1 2001-06-19 Marcus A. Ritland; Dennis W. Readey; Richard N. Kleiner; Jack D. Sibold; Kyle Knudson; Steven Landin; Paul Thoen
A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal. Methods for joining infiltrated ends are also provided.
168 Method of manufacturing a ceramic component with a cermet body US382188 1999-08-23 US06146581A 2000-11-14 Guenther Bitz; Helmut Mayer; Hans-Joachim Graf
A method of manufacturing a ceramic component including at least one cermet body, especially a cermet electrode, in which the costs are reduced and the ceramic component can be produced in accordance with requirements with an integrated cermet body in a reproducible manner. The cermet body initially is produced as a green compact; the cermet body then is inserted into the ceramic composition; the ceramic composition subsequently is consolidated together with the green compact cermet body, e.g. by pressing, and the resulting assembly is finally sintered.
169 Composite structure, and method of making same US796230 1997-02-06 US5985464A 1999-11-16 Theodore Nicolas Schmitt; Helmut Nechansky
A composite structure includes a first nonmetallic component and a second mponent of metal or nonmetal, with the first and second components being joined together by a bonding material which is so introduced by way of a casting process as to permeate to an area between the first and second components.
170 Ceramics joined body and method of joining ceramics US679286 1996-07-12 US5794838A 1998-08-18 Ryusuke Ushikoshi; Hideyoshi Tsuruta; Tomoyuki Fujii
Novel method of joining ceramics containing aluminum nitride and another member made of a metal or a ceramic is provided having an improved joining strength and a corrosion-resistant property by joining a first member made of a ceramics consisting of an aluminum compound. The second member is made of a ceramics or a metal, forming a metal film directly on a surface to be joined of the first member interposing a metallic joining material which is made of a different material from the metal film. The metallic joining material is between the metal film and the second member, and by heating at least the metallic joining material and the metal film in such an interposed state to form a joining layer made of the metallic joining material and an intermetallic compound between the first and second members, so as to join the two members.
171 Process for producing sandwich structures from fiber-reinforced ceramics US386657 1995-02-10 US5632834A 1997-05-27 Rolf Ostertag; Tilman Haug; Richard Renz; Wolfgang Zankl
A process for the production of sandwich structures made of fiber-reinforced ceramics, the base substance of the ceramic matrix consisting of a Si-organic polymer and a ceramic or metallic powder. A cross-linking of the Si-organic polymer takes place under increased pressure and at an increased temperature. After the joining of the facings and the honeycomb core, the sandwich structure is pyrolysed to form a ceramic material.
172 Process for production of joined ceramic body US341074 1994-11-17 US5529651A 1996-06-25 Toshihiro Yoshida; Keiichiro Watanabe
A process for producing a joined ceramic component having a plurality of parallel ceramic tubes and two perforated ceramic plates joined to the both ends of said ceramic tubes, which process comprises: arranging two unsintered ceramic plates each having a plurality of holes, in parallel to each other and also to the floor surface with a given distance provided between the upper plate and the lower plate; inserting a plurality of sintered ceramic tubes into the holes of the upper and lower plates so that the tubes are arranged vertically to the floor surface and in parallel to each other; and sintering the resulting material to join the tubes and the plates into one piece by utilizing the difference in sintering shrinkage factor between them, in which process the sintering is conducted in a state that each tube is hanged from the upper plate and that the lower end of each tube is in one hole of the lower plate placed on or above a setter, with a certain distance provided between the lower end of each tube and the setter so that they do not come in contact with each other during the sintering.
173 Zirconia diaphragm structure and piezoelectric/electrostrictive element incorporating same US321912 1994-10-12 US5517076A 1996-05-14 Yukihisa Takeuchi; Hideo Masumori; Katsuyuki Takeuchi; Tsutomu Nanataki
A zirconia diaphragm structure, and a method of producing such structure. The zirconia diaphragm structure includes a zirconia substrate having at least one window, and a zirconia diaphragm plate formed integrally with the zirconia substrate so as to close each window, the zirconia substrate comprising a zirconia material as a major component, and containing 0.1-5.0% by weight of one of combinations consisting of (i) alumina and calcia, (ii) alumina, calcia and magnesia, (iii) alumina, calcia and silica, and (iv) alumina, calcia, magnesia and silica.
174 Bonding of bodies of refractory hard materials to carbonaceous supports US65581 1993-05-21 US5342491A 1994-08-30 Jainagesh A. Sekhar
Bodies (3) such as tiles, plates, slabs or bricks of Refractory Hard Material (RHM) or other refractory composites are bonded to the cathodes or to other components, in particular to a carbon cell bottom (1), of a cell for the production of aluminium by electrolysis of a cryolite-based molten electrolyte, made of carbonaceous or other electrically conductive refractory material, by a non-reactive colloidal slurry (4) comprising particulate preformed RHM in a colloidal carrier selected from colloidal alumina, colloidal yttria and colloidal ceria. The slurry usually comprises preformed particulate TiB.sub.2 in colloidal alumina. The bodies (3) are usually TiB.sub.2 --Al.sub.2 O.sub.3 composites. The bonding is achieved simply by applying the slurry and allowing it to dry.
175 Glass joint body and method of manufacturing the same US699735 1991-05-14 US5194337A 1993-03-16 Akihiko Yoshida; Tomonori Takahashi; Makoto Murai
In order to improve the reliability of a glass joint body, a first ceramic member and a second ceramic member are connected by using (a) glass consisting of 10.about.65 wt % of SiO.sub.2, 30 wt % or less of Na.sub.2 O, and the balance of B.sub.2 O.sub.3 and Al.sub.2 O.sub.3, (b) glass including less than 10 wt % of SiO.sub.2, and 30.about.80 wt % of B.sub.2 O.sub.3, (c) glass including substantially none of SiO.sub.2, and 30.about.80 wt % of B.sub.2 O.sub.3, or (d) glass consisting of 10.about.65 wt % of SiO.sub.2, 20 wt % or less of Na.sub.2 O, 30 wt % or less of Al.sub.2 O.sub.3, 20 wt % or less of MgO, and the balance of B.sub.2 O.sub.3.
176 Method of manufacturing a semiconductor device US419029 1989-10-10 US5056702A 1991-10-15 Masako Nakahashi; Makoto Shirokane; Hiromitsu Takeda; Tatsuo Yamazaki; Tsutomu Okutomi; Shozi Niwa; Mikio Okawa; Mitsutaka Homma; Seiichi Suenaga; Shigeru Miyakawa
A method of manufacturing a semiconductor device comprising a ceramics cylinder, a metal seal member closing an open end of the cylinder, a semiconductor element located within the cylinder and having electrodes, and leads or electrodes connected to the electrodes of the semiconductor element and extending from the cylinder. The method comprises the steps of coating powder of active metal consisting of Ti and/or Zr on the end face of the ceramics cylinder without heating the ceramics cylinder, in an amount of 0.1 mg/cm.sup.2 to 10 mg/cm.sup.2, mounting a layer of brazing filler metal on the end face of the ceramics cylinder, which have been coated with the powder of the active metal, placing the metal seal member on the layer of brazing filler metal, and heating the ceramics cylinder, the metal seal member, and the layer of brazing filler metal, thereby melting the layer of brazing filler metal and, thus, brazing the metal seal member to the open end of the ceramics cylinder.
177 Brazing paste for bonding metal and ceramic US489532 1990-03-07 US5019187A 1991-05-28 Kiyoshi Iyogi; Masako Nakahashi; Hiromitsu Takeda; Makoto Shirokane
According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element selected from the Group IVa elements and a metal having a melting point higher than that of the metal brazing powder, the metal brazing material bonding said board and said pins. According to the present invention, metal, such as input/output terminal pins can very firmly be bonded to ceramic, such as a circuit board, within an atmosphere of, for example, N.sub.2 gas without the scattering of any brazing material in which case, unlike the prior art method, any vacuum furnace is not employed.
178 Bonding composition for ceramics comprising metal oxide melt and method for bonding ceramics US57522 1987-07-29 US4976806A 1990-12-11 Nobuya Iwamoto; Norimasa Umesaki; Hiroaki Hidaka; Yukio Haibara
A bonding composition comprising a metal oxide melt comprising (a) CaO, (b) SiO.sub.2 and/or Al.sub.2 O.sub.3, and (c) a metal oxide selected from TiO.sub.2, ZrO.sub.2, Cr.sub.2 O.sub.3, HfO.sub.2, Nb.sub.2 O.sub.3 and Ta.sub.2 O.sub.5 is melt-bonded on the surface of a ceramic material, and the ceramic material is bonded to an adherent, if necessary through at least one layer selected from a plating layer, a solder layer, and a buffer layer. In this manner, a strong bonding can be very easily obtained.
179 Method for surface bonding of ceramic bodies US53215 1987-05-21 US4884737A 1989-12-05 Marc S. Newkirk; Robert C. Kantner; Eugene S. Park
Two or more ceramic bodies are bonded together by oxidizing with a vapor-phase oxidant molten metal obtained from a body of precursor metal to form an oxidation reaction product bond. The oxidation reaction product is formed between adjacent facing, substantially congruent surfaces of the ceramic bodies and bridges the surfaces, thus bonding the ceramic bodies to each other. Promoters may optionally be used to facilitate formation of the oxidation reaction product.
180 Sealed structure and production method thereof US940490 1986-12-10 US4872606A 1989-10-10 Motohiro Satoh; Toshihiro Yamada; Akiomi Kohono; Akihiko Yamamoto; Keiji Taguchi; Takahiro Daikoku; Fumiuki Kobayashi
In a sealed structure consisting of ceramic members opposing each other and a frame coupled to the ceramic members and defining an He-tight chamber with the ceramic members, the melting point of a joint member for bonding one of the ceramic members to the frame is lower than the melting point of another joint member for bonding the other of the ceramic members to the frame so that rebonding can be made.
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