子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 101 | Housing for containing a fragile element such as a logic circuit | US284428 | 1988-12-14 | US5107073A | 1992-04-21 | Francis Steffen |
| A housing designed to contain a logic circuit (15) comprising two shells (11a, 11b) each including a welding area (17a, 17b) having an appropriate geometry permitting ultrasonic welding, such that when both shells are assembled before a welding phase, they are shifted along a vertical axis (20). The supporting plate (13) comprises a mounting ear (23) while the shells comprise a receptacle (33a, 33b). During the welding phase, there is no concomitant contact between any of the upper face (26) and lower face (27) of the ear (23) and the corresponding bearing faces (34a, 34b) of the receptacles, owing to a shift (21). The shift is reduced and the concomitant contact takes place between the bearing faces (34a, 34b) of the receptacles and each of the upper and lower faces (26, 27) of the ear (23) only when the welding phase is completed. | ||||||
| 102 | Method and apparatus for recycling thermoplastic scrap | US456282 | 1983-01-06 | US4511091A | 1985-04-16 | Augusto Vasco |
| A method and mechanical device for recycling thermoplastic scrap that collects the hot excess waste material that is trimmed off the edges of phonograph records immediately after they are pressed in a hydraulic record press. There is provided a tapered vertical shaft, widening at the bottom, which is secured to the base of a grinder. After a phonograph record is pressed flat, the hot excess thermoplastic scrap which extrudes from the edges is trimmed and allowed to drop into the upper opening of the shaft in the form of thirty inch strips. A motor or other means for blowing cold air is attached to an opening in the side of the shaft. The falling hot thermoplastic scrap is allowed to fall onto a horizontal platform surface located approximately twenty inches below the top of the shaft, where it is held and cooled by the blower for approximately twenty-six seconds, corresponding with the time it takes to press a record flat and trim the flash. The platform is then horizontally pushed out of the shaft by air pressure provided by front and rear conduits that are coupled to valves located on the hydraulic record press. The air pressure urges the platform in and out using the same energy supplied to the hydraulic record press. The cooled scrap falls into the grinder, where it is pulverized and mixed with similar vinyl plastic material and again used to form new phonograph records. | ||||||
| 103 | Method and apparatus for selective lamination of thermoplastic layers | US253019 | 1981-04-10 | US4356052A | 1982-10-26 | Roland Moraw; Renate Schadlich |
| Disclosed is a method and apparatus to facilitate the method of discontinuously laminating at least two thermoplastic layers together. The layers are heated and pressed together over all but a selected window portion of the layers to facilitate lamination between the layers at all points except the selected window portions. Relief grid images can be embossed in the selected window portion or holograms or other difficult to forge inserts can be provided in these window areas prior to lamination. During lamination, the reduced or absence of heating in these window portions permits lamination of the card without destruction of the selected window portion insert. | ||||||
| 104 | 証券用紙基材へのレンズの領域を有する透明高分子窓の形成 | JP2016533975 | 2014-08-08 | JP2016536169A | 2016-11-24 | シューデ，ヨハネス，ゲオルグ |
| 証券用紙基材(1)に、レンズ(L)の領域を有する透明高分子窓(W)を形成する方法が説明され、当該方法は、(i)証券用紙基材(1)を提供するステップと、(ii)証券用紙基材(1)内に開口(10)を形成するステップと、(iii)一端で開口(10)を閉じるように証券用紙基材(1)の第1側面(I)上に透明フィルム(5;5*)を積層するステップと、(iv)透明高分子材料(2)で開口(10)を充填するステップと、を含む。一実施形態では、透明フィルム(5)は、レンズ(L)の領域を備え、及び、証券用紙基材(1)の第1側面(I)上に開口(10)に位置合わせしてレンズ(L)を形成するように証券用紙基材(1)の第1側面(I)上に積層される。別の実施形態では、レンズ(L)の領域は、証券用紙基材(1)の第1側面(I)とは反対の第2側面(II)上に開口(10)に位置合わせしてレンズ(L)を形成するように、開口(10)内に塗布された透明高分子材料(2)内に複製される。証券用紙基材(1)内に形成された開口(10)を透明高分子材料(2)で充填するように設計された装置、及び、前記装置を備える加工機械がさらに説明される。【選択図】図1D及び図2D | ||||||
| 105 | レーザー彫刻用樹脂組成物、レーザー彫刻用フレキソ印刷版原版の製造方法、フレキソ印刷版原版、フレキソ印刷版の製版方法及びフレキソ印刷版 | JP2013159251 | 2013-07-31 | JP5752752B2 | 2015-07-22 | 倉本 守 |
| 106 | Method and apparatus for producing plastic sheet | JP31815698 | 1998-11-09 | JP4519211B2 | 2010-08-04 | ジェームズ・ラルフ・ガリオン; スティーブン・デービッド・フィールズ |
| 107 | Method and apparatus for manufacturing plastic sheet | JP2010054151 | 2010-03-11 | JP2010162899A | 2010-07-29 | FIELDS STEVEN DAVID; GALIONE JAMES RALPH |
| <P>PROBLEM TO BE SOLVED: To provide a high-quality plastic sheet comparatively low in cost and usable as a substrate for optical and electronic display applications. <P>SOLUTION: This method for manufacturing the high-quality plastic sheet includes steps for (a) providing molten plastic resin, (b) guiding the molten plastic resin to an overflow die having an inlet and an outlet, (c) shaping the molten plastic resin into a molten web using the overflow die, (d) guiding the molten web away from the overflow die, and (e) cooling the molten web to form a solid sheet. <P>COPYRIGHT: (C)2010,JPO&INPIT | ||||||
| 108 | Optical storage media | JP31274199 | 1999-11-02 | JP4498504B2 | 2010-07-07 | アラン・ダニエル・スタイン; ガロ・カーナリアン; ジェフリー・ローレンス・ディーチャー; スティーブン・デービッド・フィールズ |
| 109 | Method for bonding resin by light irradiation, process for producing resin article, resin article produced using the same, method for producing microchip, and microchip produced using the same | JP2008325346 | 2008-12-22 | JP2009173894A | 2009-08-06 | SUGIMURA HIROYUKI; TANIGUCHI YOSHINAO; TAGUCHI YOSHIHIRO |
| <P>PROBLEM TO BE SOLVED: To provide a method for bonding resins to each other with high productivity at a temperature below a temperature necessary for bonding by heat sealing. <P>SOLUTION: The method for bonding resins to each other is a method for bonding a first resin 1 and a second resin 2 to each other. The method includes a step (I) of irradiating a space 10 containing oxygen molecules in contact with surfaces 3a, 3b of the first and second resins with vacuum ultraviolet light having a wavelength of not more than 175 nm, and a step (II) of raising the temperature in such a state that the surfaces 3a, 3b after the irradiation are in contact with each other, to bond the first resin 1 and the second resin 2 to each other using the surfaces 3a, 3b as bonding surfaces. In the step (I), the surfaces 3a, 3b of the first and second resins may be further irradiated with vacuum ultraviolet light. In this case, the light intensity of the vacuum ultraviolet light which reaches the surfaces 3a, 3b is preferably, for example, 0.1 to 10 J/cm2. <P>COPYRIGHT: (C)2009,JPO&INPIT | ||||||
| 110 | Method of processing plastic material web | JP30314396 | 1996-11-14 | JP3992769B2 | 2007-10-17 | ライネル、メルツエル; ローラント、メルツエル |
| 111 | Pre-formatted line-shaped optical data storage medium | JP2006551283 | 2005-01-21 | JP2007519163A | 2007-07-12 | カイム，ミルフォード; スレイファー，ダブリュー・デニス; フレイ，ティモシー・ジェイ; ホワイト，マシュー・ビー |
| その少なくとも片面上に、光学的可読エンボスの少なくとも１つのパターンを有する細長い線状ポリマー層と、細長い線状ポリマー層の光学的可読エンボスのパターンを覆う光学的記録層とを備え、集束させたエネルギー源を記録層内に向けることにより、記録マークを記録層内に作成することができるように光学的記録層が適合される、事前フォーマット済み光データ記憶テープ。 | ||||||
| 112 | For hot pressing plate and the card manufacturing equipment | JP2002247578 | 2002-08-27 | JP3931330B2 | 2007-06-13 | 公孝 西村; 賢一 鹿野 |
| Collation and welding of card component sheets can be performed in a simple facility. Plastic cards such as IC cards having substantially no distortion and twisting are provided. A round hole (17) and an ellipse hole (18) are formed at the corresponding positions in layered component sheets (19a to 19d), and positioning pins (21) are inserted and passed through respective holes. Since at this occasion, the ellipse hole (18) has play relative to the positioning pin (21), the distortion and twisting of each card component sheet can be adsorbed, and the appearance can be improved by avoiding printing dislocation and the like. It is also able to prevent mechanical strength from lowering due to residual stress. |
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| 113 | How to melt molding the optical disk substrate | JP2006517156 | 2004-05-27 | JP2006527677A | 2006-12-07 | ジョージ ガットマン、; バリー クラーク、; デイビッド ストランド、; マイケル ヘンセイ、 |
| 本発明は、光学記憶装置又は光学記憶装置基板、及び／又は光ディスクの連続的製造法を提供し、二つの対をなす圧盤の間にポリマー材料のウェブを供給する工程、実質的に平坦なスタンパーを用いて、ウェブに光学装置用の情報トラック構造など少なくとも一つの微細形状彫像を溶融成形する工程、ポリマー材料のウェブの溶融成形された断面の大部分をポリマー材料の溶融流動温度（Ｔ ｆ ）まで加熱する工程を含む。 本発明は、情報構造物を溶融成形し、且つ情報構造物へ幾つかの層を蒸着して光学記憶装置を生成する工程の幾つかの実施形態を開示している。 | ||||||
| 114 | Metallo carboxymethyl phthalocyanine compound | JP2004532257 | 2003-07-30 | JP2005537319A | 2005-12-08 | カー，キャスリン; キャンベル，ジェームズ・スタンリー; グリフィス，ラッセル・ジョン |
| A phthalocyanine compound of Formula (I) wherein M is an oxymetal group, methods and uses involving these compounds | ||||||
| 115 | Ultrasonic welding method for electronic circuit unit | JP2003017217 | 2003-01-27 | JP2004223982A | 2004-08-12 | SHIBATA HIRONORI |
| PROBLEM TO BE SOLVED: To provide an ultrasonic welding method for an electronic circuit unit restraining vibration of a cover during ultrasonic welding, and with no breakage of electronic parts and peeling of solder. SOLUTION: The ultrasonic welding method for the electronic circuit unit is provided with the electronic circuit in which a circuit board 4 mounted with the electronic parts 5 is accommodated within two covers of a first and a second covers 1 and 2 formed of plastic , a support base 6 supporting the first cover 1, and a horn portion 7 abutting on the second cover 2 and applying ultrasonic vibration. When the first and the second covers 1 and 2 are welded, vibration-proof members 8 and 9 are brought into contact with the covers 1 and 2, and the vibration of the covers 1 and 2 are restrained so that the vibration of the covers 1 and 2 are restrained during the ultrasonic welding, and no breakage of the electronic parts 5 and no solder peeling are obtained. COPYRIGHT: (C)2004,JPO&NCIPI | ||||||
| 116 | Optical pickup device and its manufacturing method | JP2002330956 | 2002-11-14 | JP2004164768A | 2004-06-10 | MIYASHIGE HIROAKI |
| PROBLEM TO BE SOLVED: To provide an optical pickup device having high reliability in which a device is strengthened more and the weight is lightened more, foreign matters do not enter an optical path in the dust guard structure, the initial high pickup performance can be kept. SOLUTION: This device is provided with a housing 10 having a concave part 11 for housing the optical parts of upward opening, a plurality of optical parts attached respectively to the prescribed position of the concave part 11 of this housing 10. Transparent resin is injected into the concave part 11 of the housing 10, and each optical parts are arranged, the transparent resin is hardened, each optical part is covered integrally so that a laser beam can be transmitted and they are positioned to the prescribed housing position. COPYRIGHT: (C)2004,JPO | ||||||
| 117 | Method of manufacturing an optical data band | JP2002502775 | 2001-05-22 | JP2003536192A | 2003-12-02 | シュテファン シュタッドラー，; ベルンハルト ミュスィッヒ，; ヨルン ライバー， |
| (57)【要約】 本発明は、光学データ記録媒体を含むデータメモリを製造する方法に関する。 上記データ記録媒体は、いくつかのスタックされた一連の層を含み、一連の層は、情報を格納するために配置され、ポリマー膜（３５）および中間層（３８）を有する。 本発明の方法によると、少なくとも１つの層シーケンス（３９）のいくつかの層（３５、３６、３７、３８）は、同時押し出し成形される。 上記データ記録媒体は、同時押し出し成形された上記割り当てられる層（３５、３６、３７、３８）から螺旋状に巻かれていることを特徴とする。 また、複数の層シーケンスに割り当てられる層は、一緒に同時押し出し成形され、データ記録媒体が上記層から巻かれていることを特徴とする。 | ||||||
| 118 | Substrate recovery unit of the optical disc | JP9229999 | 1999-03-31 | JP3148199B2 | 2001-03-19 | 智章 伊藤 |
| 119 | Production method of Ic card | JP28268089 | 1989-10-30 | JP2810727B2 | 1998-10-15 | 孝一 村越; 和穂 板垣; 淳一 金沢 |
| PURPOSE:To prevent peeling between a card substrate and an over-sheet, and to reduce the manufacturing cost of an IC card by superposing the over-sheet onto the surface of the card substrate, irradiating the specified position of the over-sheet with laser beams and welding the over-sheet and the card substrate. CONSTITUTION:Both surfaces of a card substrate 11 are coated with adhesives 14, and over-sheets 15 as thermoplastic films formed of transparent polyethylene terephthalate, etc. are superposed onto both surfaces of the card substrate 11. When an IC card 20 is irradiated with laser beams 18 from the upper section of a glass plate 16 by controlling a computer, etc., laser beams are transmitted through the glass plate 16 and the over-sheet 15, and absorbed by the card substrate 11, and sections absorbing laser beams 18 are heated. The heat of a melting section 19a is conducted through the over-sheet 15, and a melting section 19b as a second melting section is shaped to the over-sheet 15. Accordingly, the adhesive strength of the over-sheets and the card substrate is increased while the over-sheets can be cladded to the card substrate without demaging the performance of an IC chip buried into the card substrate. | ||||||
| 120 | The method of forming the document and a hologram image with a hologram image | JP52567595 | 1995-02-23 | JPH09508722A | 1997-09-02 | ボスウェル，デーヴィッド・アール |
| (57)【要約】 本発明は、ホログラム像を有する複合シート（１０）またはホログラム像の形成方法であって、最終製品のドキュメント（２０）を作製する団体（パーティー）が、最終製品のドキュメント（２０）を作製するにあたり、ホログラム像を直接最終製品のドキュメント（２０）の上にプリントしたり、あるいは、ホログラム像または回折格子像が設けられるエンボス用ダイ（３１）またはエンボス用シム（３３）であって、ドキュメント（２０）の上にホログラム像または回折格子像をエンボスするために使用される当該エンボス用シムを保有したり、保持したりして制御することを可能とするものである。 ホログラム像を直接ドキュメント（２０）の上にスタンプすることができるフィルムには、剥離層（Ｂ）、厚さ２０〜１００ミリミクロンの金属層（Ｃ）、厚さ０．５〜３ミクロンのラッカー層（Ｄ）、熱活性接着剤層（Ｆ）および、ラッカー層（Ｄ）と熱活性接着剤層（Ｆ）の接着力を増加させるための結合層（Ｅ）を含んでいる。 剥離層（Ｂ）、金属層（Ｃ）、ラッカー層（Ｄ）、結合層（Ｅ）、熱活性接着剤層（Ｆ）は、これらの剥離層（Ｂ）、金属層（Ｃ）、ラッカー層（Ｄ）、結合層（Ｅ）、熱活性接着剤層（Ｆ）を、最初は使用されているプラスチックキャリアフィルム（Ａ）からはがすための操作により、最終製品のドキュメントを形成する基材（２０）に接合される。 | ||||||
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