序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
101 半導体プロセス用キャリア JP2013076752 2013-04-02 JP2014203878A 2014-10-27 ITAYA TARO; ISHII HIROYUKI; AMANO YOSHIYUKI; HAYASHI TSUNEYUKI
【課題】小径の半導体基板(小基板)のプロセスを、大口径シリコン基板に対応する半導体製造装置を用いて行う時に、寸法の違いを解消するアダプタープレート上に小基板を吸着固定することにより、垂直方向や反転方向になっても小基板が落ちないアダプタを提供する。【解決手段】小基板を大口径シリコン基板に対応した半導体製造装置に適用するため、大口径シリコン基板からなる搬送ベース部1に開口部10を穴加工により施し、その裏面にポリイミドフィルム2を接着して張り付けて、小基板に対する真空チャックと静電チャックを可能とし、さらに、開口部10を部分的に覆って小基板を挿入し、収容する基板挿入部7b及び基板収容部7cからなる構造体7を備える構造にすることで、搬送とプロセスを可能とする。【選択図】図4
102 Robot with end effector and operation method thereof JP2014053755 2014-03-17 JP2014132684A 2014-07-17 HASHIMOTO YASUHIKO; YOSHIDA TETSUYA
PROBLEM TO BE SOLVED: To enhance throughput of a substrate transfer and to provide an end effector having high flexibility in an operation method of the substrate transfer.SOLUTION: In relation to end effectors 6 and 7 constituted so as to be attached to arms 4 and 5 of a robot 1, the robot has a plurality of blade members constituted so that each of them can hold a substrate W and can change blade intervals between the blade members, a blade support section which supports the plurality of blade members which are driven integrally with the plurality of blade members by the robot 1, and blade driving means which moves at least one of the plurality of blade members with regard to other blade members to change the blade intervals.
103 Robot and how its operation with an end effector JP2011503747 2010-01-29 JP5506108B2 2014-05-28 本 康 彦 橋; 田 哲 也 吉
104 Clamp device and workpiece conveyer robot JP2012232378 2012-10-19 JP2014086472A 2014-05-12 URABE YUJI; MIENO YASUMICHI
PROBLEM TO BE SOLVED: To provide a clamp device which is capable of holding a workpiece and canceling the hold with high positional precision and immune to vibration.SOLUTION: A clamp device 101 capable of holding a workpiece W and canceling the hold comprises: distal end side fixed blocks 41, 42 provided at the side of a distal end 31b on a workpiece holding base 31; proximal end side fixed blocks 51, 52 provided at the side of a proximal end 31a; and a movable block 61. In the fixed blocks 41, 42, 51, 52, upward movable slopes 41a, 42a, 51a, 52a are formed, and in the movable block 61, a downward movable slope 61a is formed. When holding the workpiece W, while placing the workpiece W over the upward movable slopes 41a, 42a, 51a, 52a, the movable block 61 is moved forward in such a manner that the downward movable slope 61a is abutted to a side face of the workpiece W. When canceling the hold of the workpiece W in the workpiece holding base 41, the movable block 61 is retracted oppositely to the workpiece W.
105 Robot system and robot hand JP2012166572 2012-07-27 JP2014024159A 2014-02-06 TAKADA HIROSHI
PROBLEM TO BE SOLVED: To provide a robot system that can prevent complicated control in transportation of a soft object.SOLUTION: A robot system 100 includes a robot 1 including a hand part 11 that receives a soft object 6 transported along a conveyor 4, on the lower side of the conveyor 4, and processes and transports the soft object 6, and a robot controller 3 that controls the processing and transportation of the soft object 6 by the robot 1.
106 Robot hand and robot JP2011275360 2011-12-16 JP2013123785A 2013-06-24 SHIOMI MASAHIRO
PROBLEM TO BE SOLVED: To provide a robot hand capable of gripping an object to be gripped even when soft objects to be gripped are lined up with narrow spaces.SOLUTION: The robot hand 4 for gripping the object 2 to be gripped includes: a bar-shaped placing section 12 and placing section 14 for placing the object 2 to be gripped; a holding section 13 and holding section 15 for holding lateral sides 2a of the object 2 to be gripped; and a space adjusting section 9 for adjusting the space between the placing sections 12 and 14 by moving the placing sections 12, 14 and the holding sections 13, 15.
107 PACKAGING AND GRIPPING GROUP FOR FLAT ARTICLES, AS WELL AS RESPECTIVE METHOD EP15747546.8 2015-06-30 EP3204300B1 2018-10-31 MURAROTTO, Emilio
A packaging and gripping group for obtaining a packaging through the folding of a blank (B) around an article (A), comprises a support frame (2), at least one pair of second beams (11) aligned parallel to each other along a first direction (X), each operatively slidably connected to a pair of first guides (8) of the support frame (2), in which the guides (8) are aligned along a second direction (Y), transverse to the first direction (X), folding elements (16) of the blank (B) slidably engaged along the second beams (11), first elements (21) for moving the pair of second beams (11) along the second direction (Y), and second elements (28) for moving the folding elements (16) along the first direction (X).
108 ROBOTER ZUR HANDHABUNG VON TRANSPORTGÜTERN UND REINIGUNGSEINRICHTUNG HIERFÜR SOWIE BETRIEBSVERFAHREN ZUM BETRIEB EINES ROBOTERS EP15730721.6 2015-06-10 EP3154750B1 2018-10-10 DOLL, Theo
109 GRIPPING DEVICE, TRANSFER DEVICE WITH SAME, AND METHOD FOR CONTROLLING GRIPPING DEVICE EP11857070.4 2011-12-29 EP2669065B1 2018-09-19 MATSUOKA, Hirofumi
A gripping device comprises: a gripping unit for gripping a work; a controller for controlling the gripping operation of the gripping unit; and contact sections attached to the gripping unit contacting the work, the contact sections being adapted to deform following the shape of the work, and to maintain the deformation. The gripping operation of the gripping unit presses the contact sections against the work to cause the contact sections to follow the outside of the work, and grips the work with the shape of the contact sections maintained. After predetermined number of times of gripping operation, the controller changes the positions of the contact points of the contact sections with the work when the work is gripped. As a result, different works having different shapes can be stably gripped and the lifetime of the contact sections can be extended to be longer than that of conventional products. The change, by the controller, in the positions of the points on the work with which the contact sections are in contact when the work is gripped is performed by shifting the contact sections in a plane vertical to the gripping direction.
110 APPARATUS, SYSTEM AND METHOD FOR PROVIDING AN END EFFECTOR EP17205725.9 2017-12-06 EP3333886A1 2018-06-13 BOSBOOM, Jeroen; NADERI, Babak; MUNRO, Richard; MAJOR, Tatiana Pankova

The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

111 METHOD AND ROBOT CELL FOR HANDLING STACKS OF FLEXIBLE SUBSTRATES EP15768677 2015-03-19 EP3122671A4 2017-11-22 CHRISTIANSEN HENRIK
The invention concerns a method of handling stacks of flexible substrates (14) by means of a gripper (8) as well as a robot cell (1) for carrying out the method. The gripper (8) is arranged on an arm (6) of a robot (2) and has a lower finger and a corresponding upper finger. The method comprises the steps of inserting said lower finger below a bottom substrate (14) of a stack resting on a base and said upper finger above a top substrate (14) of the stack, and gripping the stack by clamping it between said lower and upper finger. Then by means of the gripper (8) starting at a stack front the entire stack is lifted into a pendent state and moved to a support (16). There the stack is lowered such that a stack rear, which is opposite to said stack front, comes into contact with the support (16). Finally the entire stack is laid out on the support (16) with said bottom substrate (14) up by further lowering and while horizontally displacing the gripper (8) in a bottom-to-top substrate direction before letting the gripper (8) release the stack.
112 ANORDNUNG UND VERFAHREN FÜR DIE AUTOMATISIERTE ERFASSUNG UND ENTNAHME VON WERKSTÜCKEN AUS UNGEORDNETER ANSAMMLUNG EP17020022.4 2017-01-21 EP3195992A1 2017-07-26 KRUCK, Stefan Andreas

Anordnung für die automatisierte Erfassung und Entnahme von Werkstücken (2) aus ungeordneter Ansammlung, bestehend aus

-wenigstens einem Behälter (1),

-wenigstens einem Auffangbereich (7)

-einer Objekterkennungseinrichtung (6) zum Erfassen von Werkstücken (2)

-und einer Entnahmeanordnung mit wenigstens einem Genaugreifer (5) und wenigstens einem Ungenaugreifer (4), sowie wenigstens einem Entnahmegerät (3)

dadurch gekennzeichnet, dass der Ungenaugreifer (4) die Werkstücke (2) aus dem

Behälter (1) unter Verwendung von Sensorik entnimmt und im Auffangbereich (7) ablegt und die Objekterkennungseinrichtung (6) den Werkstückabgriff mit dem Genaugreifer (5) vom Auffangbereich (7) aus steuert. Sowie Verfahren für die Erfassung und Entnahme von Werkstücken mit solch einer Anordnung.

113 PROCÉDÉ ET DISPOSITIF DE CONDITIONNEMENT ET DE COUPE EN CONTINU DE BANANES EP11817359.0 2011-12-16 EP2651252B1 2017-02-08 HENRY, Hervé
114 A depalletizing device for unloading charges from a palette and a method for unloading charges from a palette EP14152723.4 2014-01-27 EP2899149B1 2016-11-02 Evans, Philip Anthony
115 Gripper device for picking up and releasing a group of food slices EP14198477.3 2014-12-17 EP3034250A1 2016-06-22 Findlay, Ben James Wilson

This invention relates to a gripper device for picking up and releasing a group of food slices, the group of slices being arranged with a slice at one end lying on a support surface and each subsequent slice through to the slice at the other end lying against the preceding slice and being displaced relative to the preceding slice. A counter hold (102) is provided opposite a first structure (101) which comprises a first blade portion. A displacement mechanism is provided for moving at least one of the first structure and the counter hold away from and towards the other. A tilting mechanism is able to rotate the blade portion. To pick up a group of food slices, at least one of the first structure and the counter hold moves towards the other. The tilting mechanism rotates the first blade portion such that it tilts towards the counter hold causing the group of food slices to be arranged in a stack between the first blade portion and the counter hold.

116 TRANSFER APPARATUS AND ARTICLE TAKING-OUT METHOD EP15194313.1 2015-11-12 EP3020515A1 2016-05-18 TANAKA, Junya; WATABE, Kazuo; OGAWA, Akihito; NAKAMOTO, Hideichi; SONOURA, Takafumi; ETO, Haruna

According to an embodiment, a transfer apparatus includes a gripper, a first driving mechanism, an elastic passive joint part, a conveyor, a second driving mechanism, and base. The gripper grips an article. The first driving mechanism linearly moves the gripper in at least two directions including a first direction and a second direction intersecting with the first direction. The elastic passive joint part is interposed between the gripper and the first driving mechanism, and operates in accordance with an operation of the gripper. The conveyor conveys the article. The second driving mechanism linearly moves the conveyor in the at least two directions, and is connected to the conveyor. The base supports the first driving mechanism and the second driving mechanism.

117 CARRIER FOR SEMICONDUCTOR PROCESS EP13880950.4 2013-10-24 EP2983199A1 2016-02-10 ITATANI, Taro; ISHII, Hiroyuki; AMANO, Yoshiyuki; HAYASHI, Tsuneyuki

An adapter is provided which is used when a process for a small-diameter semiconductor substrate (small substrate) is performed by using a semiconductor manufacturing apparatus for large-diameter silicon substrates. The small substrate is attached to an adapter plate that compensates for differences in size, so that the small substrate is prevented from falling even when the small substrate is in a vertical or inverted direction.

To process the small substrate with the semiconductor manufacturing apparatus for large-diameter silicon substrates, an opening 10 is formed in a transferring base portion 1, which is formed of a large-diameter silicon substrate, and a polyimide film 2 is attached to the rear surface of the transferring base portion 1, so that the small substrate can be retained by a vacuum chuck or an electrostatic chuck. A structure 7 including a substrate-receiving portion 7b and a substrate-accommodating portion 7c may be provided, the structure 7 receiving partially covering the opening 10 and receiving the small substrate. Thus, transferring and processing can both be achieved.

118 A depalletizing device for unloading charges from a palette and a method for unloading charges from a palette EP14152723.4 2014-01-27 EP2899149A1 2015-07-29 Evans, Philip Anthony

The invention relates to a depalletizing device (30) for unloading charges (14) from a palette (20). The depalletizing device (30) comprises a gripper (40) by means of which a single charge (14) is clampable and a positioning device by means of which the gripper (40) is pivotable and positionable relative to the palette (20). The gripper (40) comprises an at least partially flexible plate (50) by means of which the single charge (14) is removable from the palette (20) wherein the flexible plate (50) is elastically deformable upon application of a pressure force (90) which is exertable between the flexible plate (50) and the palette (20) or an interleave sheet (22) between the charges (14) by means of the positioning device. Furthermore, the invention relates to a method for unloading charges (14) from a pallet (20) by means of a depalletizing device (30).

119 Procédé pour la manutention de produits, en particulier de tranches de denrées alimentaires EP12305923.0 2012-07-27 EP2551222B1 2015-04-01 FAVRE, CHRISTOPHE
120 ROBOT PROVIDED WITH END EFFECTOR, AND METHOD FOR OPERATING THE ROBOT EP10750632 2010-01-29 EP2408004A4 2014-08-06 HASHIMOTO YASUHIKO; YOSHIDA TETSUYA
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