子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANCAL COMPONENT HAVING A THIN-LAYER CAP | US14332751 | 2014-07-16 | US20140327154A1 | 2014-11-06 | Volker SCHMITZ; Axel GROSSE |
| A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided. | ||||||
| 2 | Micromechanical component and method for producing a micromechanical component having a thin-layer cap | US12451327 | 2008-05-19 | US08809095B2 | 2014-08-19 | Volker Schmitz; Axel Grosse |
| A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided. | ||||||
| 3 | Micromechanical component and method for producing a micromechanical component having a thin-layer cap | US14332751 | 2014-07-16 | US09114975B2 | 2015-08-25 | Volker Schmitz; Axel Grosse |
| A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided. | ||||||
| 4 | MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANCAL COMPONENT HAVING A THIN-LAWYER CAP | US12451327 | 2008-05-19 | US20110006444A1 | 2011-01-13 | Volker Schmitz; Axel Grosse |
| A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided. | ||||||
| 5 | Micro-mechanical element, and method of manufacturing a micromechanical device having a thin film cap | JP2010509785 | 2008-05-19 | JP5145412B2 | 2013-02-20 | シュミッツ フォルカー; グローセ アクセル |
| 6 | Micro-mechanical element, and method of manufacturing a micromechanical device having a thin film cap | JP2010509785 | 2008-05-19 | JP2010529594A | 2010-08-26 | グローセ アクセル; シュミッツ フォルカー |
| 基板と、該基板上に設けられたマイクロメカニカル機能層と、該マイクロメカニカル機能層上に設けられたキャッピング層とを備えたマイクロメカニカル素子と、該マイクロメカニカル素子の製造方法とを提供する。 本発明では、キャッピング層は少なくとも１つのトレンチを有し、該トレンチに少なくとも１つの電気絶縁性の接続ウェブが架設される。 | ||||||
| 7 | MIKROMECHANISCHES BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES MIKROMECHANISCHEN BAUELEMENTS MIT EINER DÜNNSCHICHTKAPPE | EP08759742.3 | 2008-05-19 | EP2164800B1 | 2017-05-03 | SCHMITZ, Volker; GROSSE, Axel |
| 8 | MIKROMECHANISCHES BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES MIKROMECHANISCHEN BAUELEMENTS MIT EINER DÜNNSCHICHTKAPPE | EP08759742.3 | 2008-05-19 | EP2164800A2 | 2010-03-24 | SCHMITZ, Volker; GROSSE, Axel |
| The invention relates to a micromechanical component having a substrate, a micromechanical functional layer located over the substrate, and a capping layer located over the functional layer, and to a method for producing the micromechanical component, the capping layer comprising at least one trench, the trench being bridged by at least one electrically insulating connecting bridge. | ||||||
| 9 | 박층 캡을 구비한 마이크로메카닉 부품의 제조방법 | KR1020097024933 | 2008-05-19 | KR101479363B1 | 2015-01-12 | 슈밋츠폴커; 그로쎄악셀 |
| 본 발명은 기판(3)과, 기판(3) 위에 놓이는 마이크로메카닉 기능성 층(1)과, 기능성 층(1) 위에 놓이는 캡층(50)을 포함하는 마이크로메카닉 부품 및 마이크로메카닉 부품의 제조 방법에 관한 것이며, 캡층(50)은 적어도 하나의 홈(52)을 포함하고, 홈(52)은 적어도 하나의 전기적으로 절연된 연결 브릿지(54)를 통해 가교 연결된다. 기판, 마이크로메카닉 부품, 기능성 층, 캡층, 연결 브릿지. | ||||||
| 10 | 박층 캡을 구비한 마이크로메카닉 부품의 제조방법 | KR1020097024933 | 2008-05-19 | KR1020100028541A | 2010-03-12 | 슈밋츠폴커; 그로쎄악셀 |
| The invention relates to a micromechanical component having a substrate, a micromechanical functional layer located over the substrate, and a capping layer located over the functional layer, and to a method for producing the micromechanical component, the capping layer comprising at least one trench, the trench being bridged by at least one electrically insulating connecting bridge. | ||||||
| 11 | MICROMECHANICAL COMPONENT HAVING A THIN LAYER CAP | PCT/EP2008056117 | 2008-05-19 | WO2008145553A3 | 2009-02-12 | SCHMITZ VOLKER; GROSSE AXEL |
| The invention relates to a micromechanical component having a substrate, a micromechanical functional layer located over the substrate, and a capping layer located over the functional layer, and to a method for producing the micromechanical component, the capping layer comprising at least one trench, the trench being bridged by at least one electrically insulating connecting bridge. | ||||||
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