| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 101 | Method and apparatus for the production of lead 212 for medical use | US14402325 | 2013-05-23 | US10020086B2 | 2018-07-10 | Julien Torgue; Patrick Maquaire; John Young; Gilbert Andreoletti; Patrick Bourdet |
| The invention relates to a method for preparing lead (212) for medical use. This method comprises the production of lead (212) by the decay of radium (224) in a generator comprising a solid medium to which the radium (224) is bound, followed by the extraction of the lead (212) from the generator in the form of an aqueous solution A1, characterized in that the lead (212) contained in the aqueous solution A1 is purified from the radiological and chemical impurities, also contained in said aqueous solution, by a liquid chromatography on a column. The invention also relates to an apparatus specially designed for automated implementation in a closed system of said method. It further relates to lead (212) produced by means of this method and this apparatus. Applications: manufacture of radiopharmaceuticals based on lead (212), useful in nuclear medicine for the treatment of cancers, particularly by a-radioimmunotherapy, or for medical imaging, in both humans and animals. | ||||||
| 102 | CUTTING ELEMENTS HAVING ACCELERATED LEACHING RATES AND METHODS OF MAKING THE SAME | US15571618 | 2016-05-06 | US20180142522A1 | 2018-05-24 | Abhijit SURYAVANSHI; Andrew GLEDHILL; Christopher LONG; Valeriy KONOVALOV; Kai ZHANG |
| Cutting elements having accelerated leaching rates and methods of making the same are disclosed herein. In one embodiment, a method of forming a cutting element includes assembling a reaction cell having diamond particles, a non-catalyst material, a catalyst material, and a substrate within a refractory metal container, where the non-catalyst material is generally immiscible in the catalyst material at a sintering temperature and pressure. The method also includes subjecting the reaction cell and its contents to a high pressure high temperature sintering process to form a polycrystalline diamond body that is attached to the substrate. The method further includes contacting at least a portion of the polycrystalline diamond body with a leaching agent to remove catalyst material and non-catalyst material from the diamond body, where a leaching rate of the catalyst material and the non-catalyst material exceeds a conventional leaching rate profile by at least about 30%. | ||||||
| 103 | Stable nanocrystalline ordering alloy systems and methods of identifying same | US14282691 | 2014-05-20 | US09791394B2 | 2017-10-17 | Heather A. Murdoch; Christopher A. Schuh |
| Provided in one embodiment is a method of identifying a stable phase of an ordering binary alloy system comprising a solute element and a solvent element, the method comprising: determining at least three thermodynamic parameters associated with grain boundary segregation, phase separation, and intermetallic compound formation of the ordering binary alloy system; and identifying the stable phase of the ordering binary alloy system based on the first thermodynamic parameter, the second thermodynamic parameter and the third thermodynamic parameter by comparing the first thermodynamic parameter, the second thermodynamic parameter and the third thermodynamic parameter with a predetermined set of respective thermodynamic parameters to identify the stable phase; wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase. | ||||||
| 104 | Metallic alloys having amorphous, nano-crystalline, or microcrystalline structure | US13843953 | 2013-03-15 | US09595360B2 | 2017-03-14 | Subhash K. Dhar; Fabio Albano; Erik W. Anderson; Srinivasan Venkatesan |
| A metal alloy for use in a wire included in an electrochemical cell is disclosed having an amorphous structure, microcrystalline grains, or grains that are sized less than about one micron. In various embodiments, the microcrystalline grains are not generally longitudinally oriented, are variably oriented, or are randomly oriented. In some embodiments, the microcrystalline grains lack uniform grain size or are variably sized. In some embodiments, the microcrystalline grains have an average grain size of less than or equal to 5 microns. In some embodiments, the metal alloy lacks long-range crystalline order among the microcrystalline grains. In some embodiments, the wire is used in a substrate used in the electrochemical cell. In some embodiments, the metal alloy is formed using a co-extrusion process comprising warming up the metallic alloy and applying pressure and simultaneously passing a core material through a die to obtain a composite structure. | ||||||
| 105 | SOLDER ALLOY | US14416130 | 2013-07-24 | US20150196978A1 | 2015-07-16 | Takashi Iseki; Toshikazu Shimizu |
| Disclosed herein are a solder alloy and an electronic device using the solder alloy to join electronic components. The solder alloy has virtually no limitation in its alloy composition, is excellent in wettability and joinability necessary for electronic device assembly, and thus ensures high joint reliability.The solder alloy has an oxide layer thickness of 120 nm or less and a surface roughness (Ra) of 0.60 μm or less. The alloy composition of the solder alloy is not particularly limited, but any one of Bi, Pb, Sn, Au, In, and Zn is preferably contained as a main component. | ||||||
| 106 | METALLIC ALLOYS HAVING AMORPHOUS, NANO-CRYSTALLINE, OR MICROCRYSTALLINE STRUCTURE | US13843953 | 2013-03-15 | US20130216857A1 | 2013-08-22 | Subhash K. DHAR; Fabio ALBANO; Erik W. ANDERSON; Srinivasan VENKATESAN |
| A metal alloy for use in a wire included in an electrochemical cell is disclosed having an amorphous structure, microcrystalline grains, or grains that are sized less than about one micron. In various embodiments, the microcrystalline grains are not generally longitudinally oriented, are variably oriented, or are randomly oriented. In some embodiments, the microcrystalline grains lack uniform grain size or are variably sized. In some embodiments, the microcrystalline grains have an average grain size of less than or equal to 5 microns. In some embodiments, the metal alloy lacks long-range crystalline order among the microcrystalline grains. In some embodiments, the wire is used in a substrate used in the electrochemical cell. In some embodiments, the metal alloy is formed using a co-extrusion process comprising warming up the metallic alloy and applying pressure and simultaneously passing a core material through a die to obtain a composite structure. | ||||||
| 107 | METAL-CARBON COMPOSITIONS | US13677690 | 2012-11-15 | US20130084231A1 | 2013-04-04 | Jason V. Shugart; Roger C. Scherer |
| A zinc-carbon compound that is a reaction product of zinc and carbon, wherein the zinc and the carbon form a single phase material that is meltable. The compound is one in which the carbon does not phase separate from the zinc when the single phase material is heated to a melting temperature. | ||||||
| 108 | Metal-carbon compositions | US13021271 | 2011-02-04 | US08349759B2 | 2013-01-08 | Jason V. Shugart; Roger C. Scherer |
| A metal-carbon composition including a metal and carbon, wherein the metal and the carbon form a single phase material, characterized in that the carbon does not phase separate from the metal when the single phase material is heated to a melting temperature, the metal being selected from the group consisting of gold, silver, tin, lead, and zinc. | ||||||
| 109 | Solid composition having enhanced physical and electrical properties | US13004798 | 2011-01-11 | US08316917B2 | 2012-11-27 | John M. Bourque |
| A method of making a treating wash includes mixing brass granules with acetone, mixing carbon nanotube material, iron pyrite granules and copper granules in the acetone brass mixture, and straining the liquid from the remaining solid material. Methods of treating materials such as brass granules, iron pyrite granules, carbon nanotube material, and brass granules comprises washing the materials in the treating wash, followed by straining and drying the materials. | ||||||
| 110 | SOLID COMPOSITION HAVING ENHANCED PHYSICAL AND ELECTRICAL PROPERTIES | US12755601 | 2010-04-07 | US20110024072A1 | 2011-02-03 | John M. Bourque |
| A method of making a treating wash includes mixing brass granules with acetone, mixing carbon nanotube material, iron pyrite granules and copper granules in the acetone brass mixture, and straining the liquid from the remaining solid material. Methods of treating materials such as brass granules, iron pyrite granules, carbon nanotube material, and brass granules comprises washing the materials in the treating wash, followed by straining and drying the materials. | ||||||
| 111 | Solid composition having enhanced physical and electrical properties | US12755626 | 2010-04-07 | US07870887B1 | 2011-01-18 | John M. Bourque |
| A method of making a treating wash includes mixing brass granules with acetone, mixing carbon nanotube material, iron pyrite granules and copper granules in the acetone brass mixture, and straining the liquid from the remaining solid material. Methods of treating materials such as brass granules, iron pyrite granules, carbon nanotube material, and brass granules comprises washing the materials in the treating wash, followed by straining and drying the materials. | ||||||
| 112 | Solid composition having enhanced physical and electrical properties | US12755601 | 2010-04-07 | US07870886B1 | 2011-01-18 | John M. Bourque |
| A method of making a treating wash includes mixing brass granules with acetone, mixing carbon nanotube material, iron pyrite granules and copper granules in the acetone brass mixture, and straining the liquid from the remaining solid material. Methods of treating materials such as brass granules, iron pyrite granules, carbon nanotube material, and brass granules comprises washing the materials in the treating wash, followed by straining and drying the materials. | ||||||
| 113 | SOLID COMPOSITION HAVING ENHANCED PHYSICAL AND ELECTRICAL PROPERTIES | US12755587 | 2010-04-07 | US20100193750A1 | 2010-08-05 | John M. Bourque |
| A method of making a treating wash includes mixing brass granules with acetone, mixing carbon nanotube material, iron pyrite granules and copper granules in the acetone brass mixture, and straining the liquid from the remaining solid material. Methods of treating materials such as brass granules, iron pyrite granules, carbon nanotube material, and brass granules comprises washing the materials in the treating wash, followed by straining and drying the materials. | ||||||
| 114 | Plain Bearing Composite Material, Use Thereof and Production Methods Therefor | US11914350 | 2006-05-13 | US20090263053A1 | 2009-10-22 | Gerd Andler |
| The invention relates to a plain bearing composite material with a supporting layer made of steel, a bearing metal layer made of a copper alloy, and with a lining applied to the bearing metal layer. The copper alloy can contain 0.5 5% by weight of nickel, 0.2 to 2.5% by weight of silicon and =0.1% by weight of lead. The lining can be an electrodeposited layer, a sputtered layer or a plastic layer. The invention also relates to methods for producing this composite material. | ||||||
| 115 | Thermoelectric properties by high temperature annealing | US11100950 | 2005-04-06 | US07591913B2 | 2009-09-22 | Zhifeng Ren; Gang Chen; Shankar Kumar; Hohyun Lee |
| The present invention generally provides methods of improving thermoelectric properties of alloys by subjecting them to one or more high temperature annealing steps, performed at temperatures at which the alloys exhibit a mixed solid/liquid phase, followed by cooling steps. For example, in one aspect, such a method of the invention can include subjecting an alloy sample to a temperature that is sufficiently elevated to cause partial melting of at least some of the grains. The sample can then be cooled so as to solidify the melted grain portions such that each solidified grain portion exhibits an average chemical composition, characterized by a relative concentration of elements forming the alloy, that is different than that of the remainder of the grain. | ||||||
| 116 | HYDROGEN GENERATING METHOD, HYDROGEN GENERATING ALLOY AND METHOD FOR PRODUCING HYDROGEN GENERATING ALLOY | US12307470 | 2007-06-15 | US20090208404A1 | 2009-08-20 | Isao Itoh |
| An alloy generating hydrogen easily and safely for a long time is obtained. The alloy is obtained by melting in a blast furnace a first metal composed of one or more metals of Al, Zn and Mg and a second metal composed of one or more metals of Ga, Cd, In, Sn, Sb, Hg, Pb and Bi; and then placing the alloy in a molten state in water to cool the alloy. | ||||||
| 117 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | US11683612 | 2007-03-08 | US07537961B2 | 2009-05-26 | Seiichi Nakatani; Seiji Karashima; Takashi Kitae; Susumu Sawada |
| The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided. | ||||||
| 118 | Doped alloys for electrical interconnects, methods of production and uses thereof | US11147958 | 2005-06-08 | US20060113683A1 | 2006-06-01 | Nancy Dean; James Flint; John Lalena; Martin Weiser |
| Lead free solder compositions are described herein that include at least one solder material; at least one dopant material, wherein the dopant is present in the material in an amount of less than about 1000 ppm, and wherein the solder composition is substantially lead free. Several doped solder compositions described herein comprise at least one solder material, at least one phosphorus-based dopant and at least one copper-based dopant. Methods of forming doped solder materials include: a) providing at least one solder material; b) providing at least one phosphorus-based dopant; c) providing at least one copper-based dopant, and d) blending the at least one solder material, the at least one phosphorus-based dopant and the at least one copper-based dopant to form a doped solder material. Layered materials are also described herein that comprise: a) a surface or substrate; b) an electrical interconnect; c) a solder composition comprising at least one solder material; at least one dopant material, wherein the dopant is present in the material in an amount of less than about 1000 ppm, and wherein the solder composition is substantially lead free. Layered materials are also described herein that comprise: a) a surface or substrate; b) an electrical interconnect; c) a solder composition comprising at least one phosphorus-based dopant and at least one copper-based dopant, such as those described herein, and d) a semiconductor die or package. Electronic and semiconductor components that comprise solder compositions and/or layered materials described herein are also contemplated. | ||||||
| 119 | Leach-resistant solder alloys for silver-based thick-film conductors | US10252502 | 2002-09-23 | US06630251B1 | 2003-10-07 | Bradley H. Carter; Shing Yeh |
| A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70% tin, up to about 4% silver palladium, platinum and/or gold, about 0.5% to about 10% copper and/or nickel, the balance lead and incidental impurities. The presence of copper and/or nickel in the alloy has the beneficial effect of inhibiting the dissolution and leaching of silver from a silver-containing thick-film, such as a conductor or solder pad, into the molten solder alloy during reflow. In addition, solder joints formed of the solder alloy form a diffusion barrier layer of intermetallic compounds that inhibit solid-state interdiffusion between silver from a silver-containing thick-film and tin from the solder joint. | ||||||
| 120 | Thermo-mechanical treated lead and lead alloys especially for current collectors and connectors in lead-acid batteries | US09991702 | 2001-11-26 | US20020088515A1 | 2002-07-11 | Karl T. Aust; David L. Limoges; Francisco Gonzalez; Gino Palumbo; Klaus Tomantschger; Peter K. Lin |
| Recrystallized lead and lead alloy positive current collectors and connectors such as straps and lugs for use e.g. in lead acid batteries and electrowinning anodes, having an increased percentage of special grain boundaries in at least part of the microstructure, which have been provided by a process comprising of (i) cold or hot rolling or cold or hot extrusion or (ii) steps of deforming the lead or lead alloy, and subsequently annealing the lead or lead alloy. Either a single cycle of working and annealing can be provided, or a plurality of such cycles can be provided. The amount of deformation, the recrystallization time and temperature, and the number of repetitions of such steps are selected to ensure that a substantial increase in the population of special grain boundaries is provided in the microstructure, to improve resistance to creep, intergranular corrosion and intergranular cracking of the current collectors and connectors during battery service, and result in extended battery life and the opportunity to reduce the size and weight of the battery. | ||||||
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