| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 焊料合金 | CN201380039591.7 | 2013-07-24 | CN104640668A | 2015-05-20 | 井关隆士; 清水寿一 |
| 本发明提供一种不实质性地限制合金组成而用于电子装置组装等所需润湿性与接合性优异、且具有较高的接合可靠性的焊料合金、以及将该焊料合金使用于电子零件接合的电子装置。本发明焊料合金氧化物层的厚度为120nm以下且表面粗糙度(Ra)为0.60μm以下，其合金组成并无特别限定，但其中较佳为以Bi、Pb、Sn、Au、In及Zn中任一种为主成分。 | ||||||
| 2 | 一种动力铅酸蓄电池正极板栅合金及其制备方法 | CN201611195700.6 | 2016-12-22 | CN106367632A | 2017-02-01 | 陈申申 |
| 本发明公开了一种动力铅酸蓄电池正极板栅合金及其制备方法，该正极板栅合金由以下重量百分数的成分组成：钡0.03-0.09%；铜0.002-0.004%；锡0.04-0.15%；锌0.25-1.80%；B2O30.02-0.20%；稀土合金0.01-0.015%；全氟烷基的丙烯酸系添加剂 0.03-0.06%；核壳丙烯酸弹性乳液 0.04-0.18%；PC 4-8%；ABS 2-6 %铅余量。在同等条件下，本发明可以提高蓄电池充电接受能力30-40%。增加合金的抗腐蚀能力，比传统的合金提高25%-35%。本发明合金的抗拉强度比传统合金高，采用GB/T228-2002进行实验，实验结果表明抗拉强度提高25-35%。 | ||||||
| 3 | JPH02504047A - | JP50406489 | 1989-04-14 | JPH02504047A | 1990-11-22 | |
| 4 | Blei-Kupfer-Legierung | EP80200481.2 | 1980-05-22 | EP0040649A1 | 1981-12-02 | Reinert, Max; Heubner, Ulrich, Dr. Dipl.-Ing. |
Um bei einer Blei-Kupfer-Legierung mit 0,03 bis 0,08 Masse-% Kupfer zur Herstellung von Blechen und Bändern für das Bauwesen die mechanischen und technologischen Eigenschaften zu verbessern, enthält diese noch 0,005 bis 0,05 Masse-% Selen. |
||||||
| 5 | SCHICHTWERKSTOFF ODER SCHICHTWERKSTÜCK MIT EINER AUF EINER TRÄGERSCHICHT ANGEBRACHTEN FUNKTIONSSCHICHT, INSBESONDERE GLEITSCHICHT MIT DER STRUKTUR EINER FESTEN, ABER SCHMELZBAREN DISPERSION | EP89904009.0 | 1989-04-14 | EP0404819A1 | 1991-01-02 | HODES, Erich, Dr.; ENGEL, Ulrich, Dr. |
| Un matériau ou une pièce stratifié comprend une couche de support et une couche fonctionnelle, notamment une couche de glissement, ayant la structure d'une dispersion solide mais fusible composée d'une matrice et d'au moins un élément dispersé dans la matrice qui, au moins à l'état solide, est insoluble dans le matériau dont se compose la matrice, ou n'y est soluble qu'en quantités moindres que les quantités utilisées, ou présente une structure caractérisée par un mélange en soi uni, essentiellement fusible et utilisable à des fins tribologiques d'éléments mutuellement insolubles, ou solubles les uns dans les autres uniquement en quantités moindres que les quantités utilisées, éventuellement partiellement cristallins. La dispersion de la couche fonctionnelle est transformée à sa surface exposée par un traitement de surface en une autre structure de l'alliage par dispersion ou du mélange, plus précisément par fusion et par refroidissement extrêmement rapide depuis l'état de fusion, de façon à provoquer une fine distribution globulaire des éléments non dissous et à consolider le matériau de cette zone superficielle presque amorphe. Cette zone superficielle peut avoir entre 20 mum et 500 mum, de préférence entre 50 mum et 100 mum. La transformation de la structure est effectuée par un faisceau laser à foyer ponctuel étroitement limité qui s'avance progressivement sur la surface à traiter, de sorte que le faisceau laser forme à l'emplacement de son foyer un petit bain de fusion ponctuel qui se refroidit immédiatement et très rapidement, se consolidant à l'état presque amorphe, lorsque le foyer se déplace, c'est-à-dire lorsque le faisceau laser s'éloigne. | ||||||
| 6 | Materials for near field transducers and near field transducers containing same | US14313551 | 2014-06-24 | US09286931B2 | 2016-03-15 | Sethuraman Jayashankar; Michael C. Kautzky |
| A method of forming a near field transducer (NFT) layer, the method including depositing a film of a primary element, the film having a film thickness and a film expanse; and implanting at least one secondary element into the primary element, wherein the NFT layer includes the film of the primary element doped with the at least one secondary element. | ||||||
| 7 | Materials for near field transducers and near field transducers containing same | US14313528 | 2014-06-24 | US09281002B2 | 2016-03-08 | Justin Glen Brons; Tong Zhao; Sethuraman Jayashankar; Steve C. Riemer; Michael C. Kautzky |
| Disclosed herein are near field transducers (NFTs) that include either silver, copper, or aluminum and one or more secondary elements. | ||||||
| 8 | SOLDER ALLOY | US14416130 | 2013-07-24 | US20150196978A1 | 2015-07-16 | Takashi Iseki; Toshikazu Shimizu |
| Disclosed herein are a solder alloy and an electronic device using the solder alloy to join electronic components. The solder alloy has virtually no limitation in its alloy composition, is excellent in wettability and joinability necessary for electronic device assembly, and thus ensures high joint reliability.The solder alloy has an oxide layer thickness of 120 nm or less and a surface roughness (Ra) of 0.60 μm or less. The alloy composition of the solder alloy is not particularly limited, but any one of Bi, Pb, Sn, Au, In, and Zn is preferably contained as a main component. | ||||||
| 9 | Multilayer sliding material | US10222804 | 2002-08-19 | US06800377B2 | 2004-10-05 | Satoshi Takayanagi; Hideo Tsuji; Masahito Fujita; Takayuki Shibayama |
| There is provided a multi-layer sliding material, comprising a back metal layer, a bearing alloy layer bonded onto the back metal layer, and a coating layer bonded onto the bearing alloy layer, said coating layer being made of an alloy consisting of 20 to 80 mass % Pb, at least one optional element not more than 10 mass % in total selected from the group consisting of In, Sb, Sn and Ag, and the balance Cu and incidental impurities. The material may further comprise a conforming layer made of an alloy containing not less than 80 mass % Pb. | ||||||
| 10 | Method of making composite metal bearing strips | US3513520D | 1967-02-20 | US3513520A | 1970-05-26 | VANDERVELL GUY ANTHONY |
| 11 | Alloy | US7761436 | 1936-05-02 | US2089939A | 1937-08-17 | BETTERTON JESSE O; PHILLIPS ALBERT J |
| 12 | Materials for near field transducers and near field transducers containing same | US15871781 | 2018-01-15 | US10134436B2 | 2018-11-20 | Sethuraman Jayashankar; Michael C. Kautzky |
| A method of forming a near field transducer (NFT) layer, the method including depositing a film of a primary element, the film having a film thickness and a film expanse; and implanting at least one secondary element into the primary element, wherein the NFT layer includes the film of the primary element doped with the at least one secondary element. | ||||||
| 13 | Materials for near field transducers and near field transducers containing same | US15064977 | 2016-03-09 | US09870793B2 | 2018-01-16 | Sethuraman Jayashankar; Michael C. Kautzky |
| A method of forming a near field transducer (NFT) layer, the method including depositing a film of a primary element, the film having a film thickness and a film expanse; and implanting at least one secondary element into the primary element, wherein the NFT layer includes the film of the primary element doped with the at least one secondary element. | ||||||
| 14 | MATERIALS FOR NEAR FIELD TRANSDUCERS, NEAR FIELD TRANDUCERS CONTAINING SAME, AND METHODS OF FORMING | US15357333 | 2016-11-21 | US20170069342A1 | 2017-03-09 | Yuhang Cheng; Tong Zhao; Michael C. Kautzky; Ed F. Rejda; Kurt W. Wierman; Scott Franzen; Sethuraman Jayashankar; Sarbeswar Sahoo; Justin Glen Brons; Steve C. Riemer; Jie Gong; Michael Allen Seigler |
| A device including a near field transducer, the near field transducer including gold (Au), silver (Ag), copper (Cu), or aluminum (Al), and at least two other secondary atoms, the at least two other secondary atoms selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), manganese (Mn), tellurium (Te), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), germanium (Ge), hydrogen (H), iodine (I), rubidium (Rb), selenium (Se), terbium (Tb), nitrogen (N), oxygen (O), carbon (C), antimony (Sb), gadolinium (Gd), samarium (Sm), thallium (Tl), cadmium (Cd), neodymium (Nd), phosphorus (P), lead (Pb), hafnium (Hf), niobium (Nb), erbium (Er), zinc (Zn), magnesium (Mg), palladium (Pd), vanadium (V), zinc (Zn), chromium (Cr), iron (Fe), lithium (Li), nickel (Ni), platinum (Pt), sodium (Na), strontium (Sr), calcium (Ca), yttrium (Y), thorium (Th), beryllium (Be), thulium (Tm), erbium (Er), ytterbium (Yb), promethium (Pm), neodymium (Nd cobalt (Co), cerium (Ce), lanthanum (La), praseodymium (Pr), or combinations thereof. | ||||||
| 15 | SLIDING MEMBER | US14384909 | 2013-02-07 | US20150016766A1 | 2015-01-15 | Hiroyuki Asakura; Mikihito Yasui; Shigeya Haneda |
| There is provided a sliding member formed by combining a resin overlay and a soft metal overlay. The sliding member has a soft layer comprising a metallic material with a hardness of less than 40 HV provided under a resin overlay layer comprising a solid lubricant and resin. In the event of contamination by a foreign matter, the soft layer under the resin overlay layer is capable of plastic deformation and the resin overlay layer is capable of partial deformation accompanying the plastic deformation due to the hardness (T1) (μm) of the soft layer and the hardness (T2) (μm) of the resin overlay layer being such that 0.2≦T1/T2≦7.0 and 3.0≦T1≦20.0. Consequently, a foreign matter is desirably embedded and resistance to a foreign matter can be improved. Low friction is maintained by the resin overlay layer even after contamination by a foreign matter. | ||||||
| 16 | Sliding member with composite plating film | US10263816 | 2002-10-04 | US06740426B2 | 2004-05-25 | Toshiaki Kawachi; Hideo Ishikawa; Masaaki Sakamoto |
| Disclosed is a sliding member having a bearing alloy layer and a composite plating film provided on the bearing alloy layer. The composite plating film is made of a lead alloy containing 0.1 to 10 mass percent in total of copper and 0.3 to 25 volume percent in total of co-deposited inorganic particles. The outermost surface layer of the composite plating film, which has a thickness proportion of 10 to 40% to the entire thickness of the composite plating film, does not contain inorganic particles and copper. The lower layer of the composite plating film contains Cu and inorganic particles, such as Si3N4, dispersed therein. | ||||||
| 17 | Sliding member with composite plating film | US10263816 | 2002-10-04 | US20030118862A1 | 2003-06-26 | Toshiaki Kawachi; Hideo Ishikawa; Masaaki Sakamoto |
| Disclosed is a sliding member having a bearing alloy layer and a composite plating film provided on the bearing alloy layer. The composite plating film is made of a lead alloy containing 0.1 to 10 mass percent in total of copper and 0.3 to 25 volume percent in total of co-deposited inorganic particles. The outermost surface layer of the composite plating film, which has a thickness proportion of 10 to 40% to the entire thickness of the composite plating film, does not contain inorganic particles and copper. The lower layer of the composite plating film contains Cu and inorganic particles, such as Si3N4, dispersed therein. | ||||||
| 18 | Multilayer sliding material | US10222804 | 2002-08-19 | US20030099855A1 | 2003-05-29 | Satoshi Takayanagi; Hideo Tsuji; Masahito Fujita; Takayuki Shibayama |
| There is provided a multi-layer sliding material, comprising a back metal layer, a bearing alloy layer bonded onto the back metal layer, and a coating layer bonded onto the bearing alloy layer, said coating layer being made of an alloy consisting of 20 to 80 mass % Pb, at least one optional element not more than 10 mass % in total selected from the group consisting of In, Sb, Sn and Ag, and the balance Cu and incidental impurities. The material may further comprise a conforming layer made of an alloy containing not less than 80 mass % Pb. | ||||||
| 19 | Solder alloy | JP2012165344 | 2012-07-26 | JP2014024082A | 2014-02-06 | IZEKI TAKASHI; SHIMIZU JUICHI |
| PROBLEM TO BE SOLVED: To provide a solder alloy superior in wettability and bondability and having high joining reliability required to be used for assembling an electronic part without substantially limiting an alloy composition, and the electronic part using its solder alloy.SOLUTION: The solder alloy is provided by setting a thickness of an oxide layer to 120 nm or less, and setting surface roughness (Ra) to 0.60 μm or less, and its alloy composition is not particularly limited, but is desirably mainly composed of any of Bi, Pb, Sn, Au, In and Zn among these. | ||||||
| 20 | Composite plating film with a sliding member | JP2001350100 | 2001-11-15 | JP3754353B2 | 2006-03-08 | 雅昭 坂本; 利明 川地; 日出夫 石川 |
QQ群二维码
意见反馈
意见反馈