| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 121 | Process for producing epoxy-type-lacquer | US574081 | 1984-01-26 | US4525497A | 1985-06-25 | Seishichi Kobayashi; Tetsuo Miyazawa; Hiroshi Ueno |
| A process for producing an epoxy-type lacquer, which comprises reacting a liquid epoxy resin having about one bisphenol A skeleton on an average in the molecular chain and derived from bisphenol A and an epihalohydrin, with bisphenol A in the presence of a catalyst in an inert organic solvent to prepare a concentrated solution of an epoxy resin having a number average molecular weight of from 2,000 to 10,000, adding an organic solvent to the concentrated solution to dilute it and maintain it at a temperature lower than that at which the catalyst is active, and mixing the resulting diluted solution with a solution of a resin acting as a curing agent for the epoxy resin. The resulting lacquer is especially useful for coating metallic containers. | ||||||
| 122 | LOW-VISCOSITY EPOXY RESINS AND LOW VOC CURABLE FORMULATIONS THEREFROM | US16301343 | 2017-05-15 | US20190194382A1 | 2019-06-27 | Nebojsa JELIC; Rainer KOENIGER; Lucca LOTTI; Timothy MORLEY; Zeljko SIKMAN; Alkaterini TSOUTSOURA |
| The present invention provides curable moldable compositions comprising from 10 to 80 volume % of heat resistant fiber compositions, a two component resin mixture of (i) one or more epoxy resins, and (ii) a hardener comprising a combination of triethylenetetraamine (TETA) and from 3 to 15 wt. %, based on the weight of the TETA, of 2-phenylimidazole (2-PI). The compositions cure to provide composite articles having a short demold time of 90 s or less at 130° C. and 101 kPa and a high DSC glass transition temperature (Tg) of from 130 to 180° C. when cured at 130° C. for 90 seconds at a pressure of 101 kPa. The invention enables lightweight, heat resistant composite articles, such as for use in automotive applications. | ||||||
| 123 | DYNAMIC NETWORKS FOR RECYCLING THERMOSET POLYMERS | US15964824 | 2018-04-27 | US20180312657A1 | 2018-11-01 | Liang Yue; Vahab Solouki Bonab; Ammar Patel; Dian Yuan; Vahid Karimkhani; Ica Manas-Zloczower |
| Methods for recycling thermoset polymers, particularly by changing them into dynamic networks with the use of an appropriate catalyst solution which transforms the thermoset polymer into a vitrimer-like composition. The methods include the step of swelling a crosslinked thermoset polymer in a solution including a catalyst, whereby the catalyst diffuses into the thermoset polymer, in particular into the thermoset network. Upon removal of the liquid portion of the solution, such as solvent, the catalyst facilitates the occurrence of exchange reactions at elevated temperatures, rendering the system a dynamic network. The vitrimerized composition having the thermoset polymer and catalyst is recyclable and processable and thus suitable for many end uses. | ||||||
| 124 | CURABLE COMPOSITION, CURED PRODUCT, PREPREG AND FIBER-REINFORCED MOLDED PRODUCT | US15997191 | 2018-06-04 | US20180298155A1 | 2018-10-18 | Tomoya Hosoda; Takashi Sato; Masatoshi Abe |
| To provide a curable composition capable of obtaining a cured product excellent in outer appearance and abrasion resistance; a cured product excellent in outer appearance and abrasion resistance; a prepreg capable of obtaining a fiber-reinforced molded product excellent in outer appearance and abrasion resistance; and a fiber-reinforced molded product excellent in outer appearance and abrasion resistance. The curable composition comprises a thermosetting resin, a fluororesin powder and a curing agent, wherein the fluororesin powder is made of a resin material containing a melt-moldable fluororesin having a melting point of from 100 to 325° C. and having functional groups of at least one type selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups, and in 100 mass % of the total of the thermosetting resin and the fluororesin powder, the proportion of the thermosetting resin is from 70.0 to 99.9 mass % and the proportion of the fluororesin powder is from 0.1 to 30 mass %. | ||||||
| 125 | PREPREG TAPE AND USE THEREOF | US16004475 | 2018-06-11 | US20180291165A1 | 2018-10-11 | Satoshi OKAMOTO; Yukihiro HARADA; Atsushi NOHARA |
| A prepreg tape in which reinforcing fiber bundles are impregnated with a thermosetting resin composition, wherein the prepreg tape has a tack value measured at 23° C. at a plunger push pressure of 90 kPa of 5-40 kPa, a tack value measured at 45° C. and a plunger push pressure of 150 kPa of 35-100 kPa, and a drape value at 23° C. of 10-40°, and includes unidirectional fibers arranged along the direction of length of the prepreg tape. | ||||||
| 126 | EXTRUDED STYRENE RESIN FOAM AND METHOD FOR PRODUCING SAME | US15983938 | 2018-05-18 | US20180265661A1 | 2018-09-20 | Takenori Kikuchi; Shunji Kurihara; Koji Shimizu |
| A styrene resin extruded foam includes a styrene resin, a flame retarder, a hydrofluoroolefin, an alcohol, and at least one selected from the group consisting of a saturated hydrocarbon having 3 to 5 carbon atoms, dimethyl ether, and alkyl chloride. An amount of the flame retarder is 0.5 to 8.0 parts by weight relative to 100 parts by weight of the styrene resin. The styrene resin extruded foam has an apparent density of 20 to 45 kg/m3 and a closed cell ratio of not less than 90%. An amount of the hydrofluoroolefin added is 65 to 90 mol % relative to 100 mol % in total of the hydrofluoroolefin and the alcohol which are added. An amount of the alcohol added is 10 to 35 mol % relative to 100 mol % in total of the hydrofluoroolefin and the alcohol which are added. | ||||||
| 127 | Resin composition, copper clad laminate and printed circuit board using same | US15813165 | 2017-11-15 | US10072148B2 | 2018-09-11 | Rongtao Wang; Yu-Te Lin; Wenjun Tian; Ziqian Ma; Wenfeng Lv; Ningning Jia |
| The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA). | ||||||
| 128 | RESIN SUPPLY MATERIAL, PREFORM, AND METHOD OF PRODUCING FIBER-REINFORCED RESIN | US15553804 | 2016-02-24 | US20180244879A1 | 2018-08-30 | Tomohiro Takehara; Satoshi Seike; Masato Honma; Naokichi Imai; Satomi Hiasa |
| A resin supply material used for press molding or vacuum-pressure molding of a fiber-reinforced resin, the resin supply material including a continuous porous material and a thermosetting resin, wherein an average pore cross-sectional area ratio P expressed by formula (I) is 1.1 or more: P=AII/AI (I) AI: average pore cross-sectional area in region I AII: average pore cross-sectional area in region II Region I: region occupying 10% of total volume of continuous porous material from surface layer on both surfaces thereof Region II: whole region of continuous porous material. | ||||||
| 129 | Thermosetting resin composition and uses thereof | US15033299 | 2013-11-06 | US10053547B2 | 2018-08-21 | Cuiming Du; Songgang Chai |
| The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity. | ||||||
| 130 | EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION OF EPOXY RESIN COMPOSITION | US15743930 | 2015-12-07 | US20180201761A1 | 2018-07-19 | Ying XU; Kehong FANG |
| The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition may be used for the preparation of pre-pregs and copper clad laminates. By respectively using brominated bisphenol A and a phosphorus-containing phenolic aldehyde as bromine and phosphorus sources, and adjusting the proportions of the brominated bisphenol A and the phosphorus-containing phenolic aldehyde within the epoxy resin composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Pre-pregs and laminates manufactured using the epoxy resin composition have reduced halogen content and improved heat resistance. Substrate pressure resistance is improved, moisture absorption is low, adhesion, reactivity and processability are good, comparative tracking index (CTI)>600V is satisfied, and production costs are significantly reduced. | ||||||
| 131 | Inductively curable composition | US15324738 | 2015-08-18 | US10011699B2 | 2018-07-03 | Jung-Sheng Wu; Lijun Zu; Zeba Parkar |
| An inductively curable thermoset compositions comprising a thermoset resin and, dispersed therein, susceptor particles and surface modified silica particles is described. | ||||||
| 132 | Retaining compressive strength of thermoplastic-toughened epoxy composites under hot and wet conditions | US15439981 | 2017-02-23 | US10000615B1 | 2018-06-19 | Yen-Seine Wang; Maureen Boyle |
| Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high levels of compressive strength under dry conditions at room temperature and which retain their compressive strength when subjected to hot and wet conditions. The pre-impregnated composite materials are composed of reinforcing fibers and an uncured resin matrix. The uncured resin matrix includes a resin component made up of one or more difunctional epoxy resins and multifunctional epoxy resins. The uncured resin matrix further includes a thermoplastic particle component, a thermoplastic toughening agent and a curing agent. The thermoplastic particle component is composed of a mixture of a first group of polyamide particles that do not contain crosslinked polyamide and a second group of polyamide particles that contain crosslinked polyamide. | ||||||
| 133 | COMPOSITES WITH THERMOPLASTIC EPOXY POLYMERIC PHASE, ARTICLES SUCH AS CARRIERS MADE THEREWITH AND ASSOCIATED METHODS | US15556419 | 2016-03-10 | US20180037703A1 | 2018-02-08 | Henry E. Richardson; Sylvain Gleyal |
| A structural reinforcement for an article including a carrier (10) that includes: (t) a mass of polymeric material (12) having an outer surface; and (ii) at least one fibrous composite Insert (14) or overlay (980) having an outer surface and including at least one elongated fiber arrangement (e.g., having a plurality of ordered fibers). The fibrous Insert (14) or overlay (980) is envisioned to adjoin the mass of the polymeric material in a predetermined location for carrying a predetermined load that Is subjected upon the predetermined location (thereby effectively providing localized reinforcement to that predetermined location). The fibrous insert (14) or overlay (980) and the mass of polymeric material (12) are of compatible materials, structures or both, for allowing the fibrous insert or overlay to be at feast partially joined to the mass of the polymeric material. Disposed upon at least a portion of the carrier (10) may be a mass of activatable material (126). The fibrous insert (14) or overlay (980) may include a polymeric matrix that includes a thermoplastic epoxy. | ||||||
| 134 | Electrical and thermal conductive paste composition and method of reducing percolation threshold and enhancing percolating conductivity using the same | US15115039 | 2015-03-10 | US09870843B2 | 2018-01-16 | Xinfeng Zhang; Matthew Ming-Fai Yuen |
| An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent. | ||||||
| 135 | Aromatic Amine Resin, Epoxy Resin Composition And Cured Product Thereof | US15544706 | 2016-01-20 | US20170369636A1 | 2017-12-28 | Kenichi Kuboki; Masataka Nakanishi |
| There are provided an aromatic amine resin represented by the following formula (1) wherein a plurality of R1's each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, provided that a case where all R1's represent each a hydrogen atom is excluded, m represents an integer of 1 to 4, n represents an integer, and the average value (A) of n represents: 1≦A≦5, which can be utilized for a high-reliability semiconductor, a high-performance fiber-reinforced composite material, and others; an epoxy resin composition containing the aromatic amine resin; and an epoxy resin cured product having properties excellent in high heat resistance and low hygroscopicity, which is obtained by curing the epoxy resin composition. | ||||||
| 136 | Resin composition, prepreg, metal foil-clad laminate and printed wiring board | US14407190 | 2013-06-06 | US09832870B2 | 2017-11-28 | Hiroaki Kobayashi; Masanobu Sogame; Kentaro Nomizu; Yoshinori Mabuchi; Yoshihiro Kato |
| A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide. | ||||||
| 137 | Degradable Resin Composition, and Prepreg, Laminate and Copper Clad Laminate Using Same, and Degrading method thereof | US15534557 | 2015-05-27 | US20170321001A1 | 2017-11-09 | Huayang DENG; Zengbiao HUANG; Qianfa LIU; Zhongqiang YANG; Peng WANG |
| Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components. | ||||||
| 138 | Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed Circuit Board Containing the Same | US15318787 | 2016-09-08 | US20170298218A1 | 2017-10-19 | Hui LI; Kehong FANG; Yongjing XU |
| The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards. | ||||||
| 139 | ISOCYANATE-MODIFIED EPOXY RESIN AND USES THEREOF | US15175485 | 2016-06-07 | US20170260321A1 | 2017-09-14 | Qingchong Pan |
| The present invention relates to an isocyanate-modified epoxy resin having a structure of Formula (I): in Formula (I), R is selected from divalent organic groups; n is an integer greater than or equal to zero; in Y, R1, R2, R3, R4, R18, R19, R20, R21 are independently selected from organic groups; X is omitted or is selected from divalent organic groups; and R1, R2, R3, R4, R18, R19, R20, R21 are not hydrogen atoms at the same time. The epoxy resin of the present invention utilizes polyisocyanate containing more than 2 cyanate groups as a raw material for preparation and reacts it with resin monomer having epoxy group, thereby achieving the purpose of introducing oxazolidinonyl into epoxy resin monomer; in addition, the epoxy resin of the present invention is terminated by epoxy groups, making the provided epoxy resin components have high heat resistance and low dielectric properties. | ||||||
| 140 | Internal Combustion Engine Ignition Coil and Method for Manufacturing Internal Combustion Engine Ignition Coil | US15427215 | 2017-02-08 | US20170241393A1 | 2017-08-24 | Masayuki KAMIKAWA; Nobutake TSUYUNO; Toshiaki ISHII; Yoichi ANZO |
| An internal combustion engine ignition coil according to the present invention includes: a central iron core; a primary coil disposed on an outer circumference of the central iron core; a secondary coil disposed on an outer circumference of the primary coil; a side iron core disposed on an outer circumference of the secondary coil; and an insulating material sealing the central iron core, the primary coil, and the secondary coil on an inner side of the side iron core. A first layered silicate having a particle diameter less than a winding diameter of the secondary coil is present at a higher concentration in a vicinity of the secondary coil than that in a vicinity of the side iron core in the insulating material. A second layered silicate having a particle diameter greater than the winding diameter of the secondary coil is present at a higher concentration than that of the first layered silicate between the outer circumference side of the secondary coil and the side iron core. The second layered silicate has an aspect ratio of 50 or more, the aspect ratio being a ratio of a long side of a particle of the layered silicate to a thickness of the particle. | ||||||
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