序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
101 FAST CURE EPOXY RESIN SYSTEMS US14441196 2013-12-20 US20150299407A1 2015-10-22 Chris Harrington
A fast cure epoxy resin system is provided that upon curing has a Tg no greater than 140° C. and a Phase angle below 20° at a temperature of 140° C. or below, and prepregs and mouldings based on the system. The resin formulation matches the reactivity of the resin to the amount of curative and hardener employed.
102 THERMAL EXPANSION RESIN COMPOSITION US14434201 2013-10-10 US20150291773A1 2015-10-15 Toshitaka Yoshitake; Masaki Tono; Kenji Otsuka; Hideaki Yano
A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40.
103 EPOXY RESIN FORMULATION FOR LARGE AND THICK COMPOSITE STRUCTURES US14431039 2013-03-26 US20150274902A1 2015-10-01 Rahul Harshe; Ranjith Kottot; Anoop Anand; Makarand Joshi
In the present disclosure!, there is disclosed an epoxy resin formulation for the manufacturing of large and thick composite structures, said formulation comprising i) at least one epoxy resin in a weight proportion varying between 50 parts to 70 parts; (ii) at least one hardening agent in a weight proportion varying between 21 phr to 29 phr; (iii) at least one diluent in a weight proportion varying between 10 phr to 40 phr; and (iv) N,N′dimethylaminopropylamine as an accelerator in a weight proportion varying between 0.5 phr to 3.0 phr. The formulation is used in the manufacturing of large and thick composite structures by employing Vacuum Assisted Resin Transfer Molding Process.
104 FIBER REINFORCED HIGH MODULUS POLYMER COMPOSITE WITH A REINFORCED INTERPHASE US14435494 2013-10-10 US20150259580A1 2015-09-17 Felix N. Nguyen; Alfred P. Haro; Kenichi Yoshioka
A fiber reinforced polymer composition is disclosed comprising a reinforcing fiber and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin, a curing agent, and an interfacial material, the fiber is suitable for concentrating the interfacial material in an interfacial region between the fiber and the adhesive composition upon curing of the adhesive composition, and the cured adhesive has a resin modulus of at least 4.0 GPa. Also provided is a prepreg comprising the fiber reinforced polymer composition and a method of manufacturing a composite article by curing the reinforced polymer composition. The resulting interfacial region, viz., the reinforced interphase, is reinforced by one or more layers of the interfacial material such that substantial improvements in tensile, compression and fracture toughness may be observed.
105 HIGH MODULUS FIBER REINFORCED POLYMER COMPOSITE US14435577 2013-10-10 US20150240042A1 2015-08-27 Felix N. Nguyen; Alfred P. Haro; Kenichi Yoshioka
A fiber reinforced polymer composition is provided comprising a fiber and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin and a curing agent, the reinforcing fiber has a tensile modulus of at least 300 GPa and the cured adhesive has a resin modulus of at least 3.2 GPa, and the adhesive composition when cured makes good bonds to the reinforcing fiber. Additional embodiments include a prepreg comprising the fiber reinforced polymer composition and a method of manufacturing a composite article by curing the adhesive composition and a reinforcing fiber.
106 Curable epoxy resin compositions and composites made therefrom US13389028 2010-09-21 US09074041B2 2015-07-07 Marvin L. Dettloff; Gary A. Hunter; Susan K. Falcone-Potts; Ha Q. Pham; Martine Rousse; Bernd Hoevel
A curable epoxy resin composite composition including a reinforcing material and an epoxy resin composition, and a process for preparing a composite from such composition; wherein a combination of at least one alkanolamine and at least one styrenated phenol are present in the epoxy resin composition in a sufficient amount to increase the rate of reaction of the at least one epoxy resin and the at least one alkanolamine curing agent while maintaining the thermal and mechanical properties of the composite upon curing of the epoxy resin composition.
107 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD US14407190 2013-06-06 US20150181707A1 2015-06-25 Hiroaki Kobayashi; Masanobu Sogame; Kentaro Nonizu; Yoshinori Mabuchi; Yoshihiro Kato
A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.
108 PHOSPHORUS-CONTAINING PHENOLIC RESIN, METHOD FOR MANUFACTURING THE SAME, AND USE OF THE SAME US14279673 2014-05-16 US20140378622A1 2014-12-25 Masato Takenouchi; Tadatoshi Fujinaga; Erina Kimura; Yu-Chin Lee; Jen-Hai Liao; Sung-Chen Lo
The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.
109 Phosphazene blocked imidazole as latent catalyst for epoxy resins US13640645 2010-04-30 US08916655B2 2014-12-23 Journey Lu Zhu; Ping Shao Ren; Shaoguang Feng
Epoxy resin compositions utilizing phosphazene blocked azole compounds as curing catalyst are provided. Also provided are epoxy resins cured with phosphazene blocked azole compounds and methods of making cured epoxy resins using curing catalysts of phosphazene blocked azole compounds.
110 FIBER SIZING AGENT COMPOSITION US14345953 2012-09-20 US20140228481A1 2014-08-14 Masahito Inoue; Kazuki Aoki
A fiber sizing agent is described, which is capable of imparting sufficient sizing properties and fiber spreading properties to reinforced fiber bundles for producing fiber-reinforced composite materials. A fiber sizing agent composition (E) includes a sizing agent (A) having a viscosity of 50 to 3,000 Pa·s at 35° C., and has a thixotropic index of 3 to 15. The sizing agent (A) is preferably an epoxy resin, a polyester resin, a polyurethane resin, a polyether resin or a vinyl ester resin.
111 FLEXIBLE REINFORCING FIBER YARN PRE-IMPREGNATED WITH RESIN US14235564 2012-07-20 US20140205831A1 2014-07-24 Markus Schneider; Silke Stüsgen; Silke Witzel; Bernd Wohlmann
A pre-impregnated yarn having a bundle made of reinforcing fiber filaments impregnated with a first resin composition infiltrated into the pre-impregnated yarn and at least partially connected via the first resin composition. The first resin composition contains at least two bisphenol A epichlorohydrin resins H1 and H2 in a weight ratio H1:H2 of 1.1 to 1.4, and an aromatic polyhydroxy ether P1. The pre-impregnated yarn has a second resin composition on the bundle outer side in the form of adhesive particles or drops. The second resin composition is solid at ambient temperatures and has a melting temperature in the range from 80 to 150° C. The bundle interior and at least 50% of the surface of the bundle outer side are free of the second resin composition.
112 METHOD FOR PRODUCING POROUS EPOXY RESIN SHEET US13991695 2011-12-05 US20130248442A1 2013-09-26 Noriaki Harada; Yoshihide Kawaguchi; Atsushi Hiro; Atsuko Mizuike; Osamu Hayashi; Katsumi Ishii; Chiaki Harada
Provided is a porous epoxy resin sheet produced by cutting a cured epoxy resin body to a predetermined thickness, the porous epoxy resin sheet having a large surface area and a uniform in-plane pore size distribution. A method for producing a porous epoxy resin sheet, comprising forming a cylindrical or columnar cured resin body from a resin mixture containing an epoxy resin, a curing agent, and a porogen, cutting the surface of the cured resin body at a predetermined thickness to make an epoxy resin sheet, and then removing the porogen from the sheet to render the sheet porous, wherein when the cured resin body is formed from the resin mixture, curing is performed in a state where the viscosity of the mixture is at least 1,000 mPa·s.
113 TUBULAR BODY MADE OF FIBER-REINFORCED EPOXY RESIN MATERIAL US13729327 2012-12-28 US20130172098A1 2013-07-04 Kazuyoshi SHIGA; Yasuo NAITO
It is an object to provide a tubular body made from a novel fiber-reinforced epoxy resin material having improved strength. A tubular body made of a fiber-reinforced epoxy resin material according to the present invention is a tubular body made of a fiber-reinforced epoxy resin material comprising a cured product of an epoxy resin composition and a reinforcing fiber. The cured product of the epoxy resin composition has a swelling ratio of 20% by mass to 42.5% by mass in methyl ethyl ketone.
114 Epoxy resin composition, prepreg, and fiber reinforced composite material US12919285 2009-02-26 US08309631B2 2012-11-13 Nobuyuki Tomioka; Shiro Honda; Yuki Mitsutsuji; Maki Mizuki; Takayuki Imaoka
It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]: [A] a diglycidyl ether-type epoxy resin having a molecular weight of 1,500 or more; [B] an epoxy resin in which an SP value of a structural unit thereof is greater by 1.5 to 6.5 than an SP value of a structural unit of [A]; [C] a diglycidyl ether-type epoxy resin having a molecular weight of 500 to 1,200; and [D] an epoxy resin curing agent, in a ratio that satisfies the following formulas (1) to (4): 0.2≦A/(A+B+C+E)≦0.6;  (1), 0.2≦B/(A+B+C+E)≦0.6;  (2), 0.15≦C/(A+B+C+E)≦0.4; and  (3), 0≦E/(A+B+C+E)≦0.2,  (4) wherein A, B, and C represent weights of [A], [B], and [C], respectively, and E represents a weight of an epoxy resin other than [A], [B], and [C].
115 Epoxy resin composition US12808304 2008-09-16 US08231820B2 2012-07-31 Amit Dixit; Pradip Kumar Dubey; Thitikan Prommaneewat
A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.0% with respect to the reaction mass either alone or in solution with compatible diluents, to obtain an epoxy resin mix having intrinsic viscosity in the range of 100 to 850 cPs, pouring the resin mix in a mold having an in-situ glass fiber scaffold at a mold temperature in the range of 45 to 50 C. and applying pressure to the resin mix in the mold to form a compressed green composition: partially curing the compressed green composition at a temperature in the range of 60 to 80 C. to obtain a partially cured composite; and further curing the partially cured composite at a temperature in the range of 80 to 90 C. to obtain a fully cured composite. The composite is used for structural applications like windmill blades, yachts, domes, ships made from a composite made in accordance with the process as mentioned herein.
116 Carbon fiber reinforced prepreg of gas barrier properties, carbon fiber reinforced plastic and methods of producing the same US12741553 2008-10-27 US07981500B2 2011-07-19 Koichi Yonemoto; Takeo Ebina; Fujio Mizukami; Keiichi Okuyama; Shoji Kamiya
There are provided a carbon fiber reinforced prepreg of gas barrier properties comprising a sheet-like carbon fiber reinforcement and a matrix resin including therein a gas barrier layer having a clay mineral with a plate-like crystal structure unidirectionally aligned and densely laminated, and a carbon fiber reinforced plastic produced from the carbon fiber reinforced prepreg. Such prepreg is obtained by disposing a film material of gas barrier properties having a clay mineral with a plate-like crystal structure unidirectionally aligned and densely laminated, in at least one interlayer of a laminate of a carbon fiber reinforced prepreg comprising a sheet form carbon fiber reinforcement and a matrix resin; and then heating and/or pressurizing the laminate. The carbon fiber-reinforced composite material of the invention exhibits high gas barrier properties, and particularly hydrogen gas barrier properties.
117 Composites having an improved resistance to fatigue US11764493 2007-06-18 US07896190B2 2011-03-01 Elisabeth J. Berger; John N. Owens
Compositions including a base resin, a reinforcement and a modifier including a block copolymer for producing vesicles, spherical and/or cylindrical micelles and composites made therefrom.
118 Filling foam composition and foam filling member US12805777 2010-08-19 US20110045278A1 2011-02-24 Atsushi Kuriu; Yoshiaki Mitsuoka
Provided is a filling foam composition for filling a gap between members by foaming. The filling foam composition has a heat sagged length of 14 mm or less in (1) heat sag test without any breakage caused by (2) impact test.
119 EPOXY RESIN VARNISHES, LAMINATES AND PRINTED CIRCUIT BOARDS US12337651 2008-12-18 US20100092764A1 2010-04-15 Chien-Jen CHUNG; Zhuo Wang
Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In farther embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).
120 Novolac-epoxy resin foam, foamable composition for making novolac-epoxy resin foam and method of making novolac-epoxy resin foam US10265389 2002-10-07 US06610754B1 2003-08-26 Samuel L. Rader
Provided is a foamable composition adapted to form a cross-linked novolac-epoxy resin foam. The foamable composition is formulated from a composition comprising at least one novolac resin, at least one epoxy resin, and at least one blowing agent.
QQ群二维码
意见反馈