序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
81 LATENT EPOXY RESIN FORMULATIONS FOR LIQUID IMPREGNATION PROCESSES FOR PRODUCTION OF FIBRE-REINFORCED COMPOSITES US15375668 2016-12-12 US20170166688A1 2017-06-15 Martina ORTELT; Eike LANGKABEL; Dirk FUCHSMANN; Britta KOHLSTRUK; Katharina KARNS
Epoxy compositions containing at least one resin component and at least one hardener component, are suitable as a thermoset matrix for production of semi-finished fibre matrix products and cured fibre matrix laminates.
82 PRECURSOR BLEND FOR PREPARING A THERMOPLASTIC POLYMER FOR A FIBER-REINFORCED COMPOSITE MATERIAL AND METHOD FOR PREPARING THE FIBER-REINFORCED COMPOSITE MATERIAL US14990969 2016-01-08 US20170137587A1 2017-05-18 Chen-Han Chien; Yu-Tsan Tseng; Kok-Sheng Tan
A precursor blend for preparing a thermoplastic polymer for a fiber-reinforced composite material includes a major amount of a stoichiometric mixture of a diepoxide, and an amine compound selected from the group consisting of monofunctional primary amine and difunctional secondary amine, and a minor amount of a modifier selected from the group consisting of difunctional primary amine, trifunctional primary amine, triepoxide, tetraepoxide, and combinations thereof.
83 EPOXY SYSTEM US15342759 2016-11-03 US20170121452A1 2017-05-04 Matthaeus KOPCZYNSKI; Michael HENNINGSEN; Miran YU
The invention is directed to a curable composition, which comprises an epoxy resin mixture, wherein the epoxy resin mixture comprises a) an epoxy resin; b) diethyl methyl benzene diamine (DETDA) as hardener; c) at least one compound selected from the group consisting of 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU) and 1,5-diazabicyclo[4.3.0]non-5-ene (DBN) as catalyst.
84 EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE US15127158 2015-03-03 US20170121451A1 2017-05-04 Koji Hayashi; Makoto Kimura; Kunihiro Morinaga; Shigeki Matsui
Provided is an epoxy resin which has a low viscosity and excellent impregnation capability into reinforcing fibers and provides a cured product having a high elastic modulus and excellent heat resistance when the epoxy resin is used for a fiber-reinforced resin material, and a method for producing the epoxy resin, a curable resin composition, and a cured product thereof, a fiber-reinforced composite material, and a molded article. An epoxy resin which is polyglycidyl ether that is a polycondensation product of phenol and hydroxybenzaldehyde, the resin includes the trinuclear body (X) represented by the following Structural Formula (1), in which the content of a [o,p,p] bonding body (x1) represented by the following Structural Formula (1-1) among the trinuclear body (X) is in the range of 5% to 18% in terms of an area ratio as measured by liquid chromatography.
85 EPOXY SYSTEMS EMPLOYING TRIETHYLAMINETETRAAMINE AND TIN CATALYSTS US15308940 2015-07-14 US20170114180A1 2017-04-27 Sergio Grunder; Timothy A. Morley; Rainer Koeniger; Nebojsa Jelic
The invention relates to curable epoxy resin systems comprising polyethylene tetraamine and a tin catalyst as hardening agents, and optionally comprising 1,4-diaza[2.2.2]bicyclo octane. The invention also relates to articles made therefrom, including composites such as carbon fiber reinforced composites. The curable epoxy resins have rapid demold times and/or high glass temperature.
86 A PROCESS FOR THE PREPARATION OF A FIBER REINFORCED COMPOSITE ARTICLE, THE COMPOSITE ARTICLES OBTAINED AND THE USE THEREOF US15126351 2015-03-02 US20170081487A1 2017-03-23 Pavel SMOLKA; Josef GRINDLING; Kenneth SCOBBIE; Duncan HOWLAND; Zoubair Cherkaoui
A process for the preparation of a fiber reinforced composite article comprising the steps of a) providing a fibre preform in a mold, b) injecting a multiple component thermosetting resin composition into the mold, wherein the resin composition comprises (b 1) a liquid epoxy resin, (b2) a curing agent comprising 1,3-bis(aminomethyl)cyclohexane, and (b3) an accelerator comprising at least one compound selected from the group sulfonic acid and imidazolium salt of a sulfonic acid, c) allowing the resin to impregnate the fiber preform, d) curing the resin impregnated preform, e) demolding the cured composite part, facilitates manufacturing of composite articles with reduced cycle times, said composite articles exhibit excellent mechanical properties, especially elongation and fracture toughness, and can be used for the construction of mass transportation vehicles, in particular in automotive and aerospace industry.
87 POLYMERIC LAPPING MATERIALS, MEDIA AND SYSTEMS INCLUDING POLYMERIC LAPPING MATERIAL, AND METHODS OF FORMING AND USING SAME US15222779 2016-07-28 US20170028526A1 2017-02-02 George Wasilczyk; Brent Muncy; Scott Daskiewich
A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to lap hard surfaces, such as sapphire surfaces. The lapping process can be performed after a grinding process and before a polishing process.
88 SIZING AGENT-COATED REINFORCING FIBERS, METHOD FOR PRODUCING SIZING AGENT-COATED REINFORCING FIBERS, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL US15120708 2015-03-04 US20170002154A1 2017-01-05 Takumi HIASA; Daigo KOBAYASHI; Tomoko ICHIKAWA; Makoto ENDO
Sizing agent-coated reinforcing fibers include reinforcing fibers and a sizing agent containing a polyrotaxane, the reinforcing fibers being coated with the sizing agent. Provided are sizing agent-coated reinforcing fibers that provide a fiber-reinforced composite material with excellent mechanical properties, a method for producing the sizing agent-coated reinforcing fibers, a prepreg including the sizing agent-coated reinforcing fibers, and a fiber-reinforced composite material with excellent mechanical properties including the sizing agent-coated reinforcing fibers.
89 EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE USING SAME US15113618 2015-06-01 US20170002131A1 2017-01-05 Xianping Zeng; Liexiang He; Yongjing Xu
Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.
90 GOLF CLUB SHAFT US14902097 2014-06-06 US20160367872A1 2016-12-22 Yasuo NAITO; Takehiko HYODO; Kazuyoshi SHIGA; Hiroshi HASEGAWA
An object of the present invention is to provide a golf club shaft having excellent strength. The present invention provides a golf club shaft made of a fiber-reinforced epoxy resin material comprising a cured product of an epoxy resin composition and a reinforcing fiber, wherein the epoxy resin composition comprises at least one selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin and a novolac type epoxy resin, and a tetraglycidyl type epoxy resin as an epoxy resin component, and the cured product of the epoxy resin composition has a swelling ratio in a range from 20 mass % to 44 mass % in methyl ethyl ketone.
91 Electrical and thermal conductive paste composition and method of reducing percolation threshold and enhancing percolating conductivity using the same US15115039 2015-03-10 US20160358687A1 2016-12-08 Xinfeng ZHANG; Matthew Ming-Fai YUEN
An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent.
92 CURABLE COMPOSITIONS WHICH FORM INTERPENETRATING POLYMER NETWORKS US15032814 2014-10-28 US20160280907A1 2016-09-29 Chao ZHANG; Yanli FENG; Hongyu CHEN; Michael J. MULLINS; Yi ZHANG; Jiawen XIONG; Lijing FANG; Guihong LIAO
A curable composition comprising a) an epoxy component; b) a hardener component selected from the group consisting of a maleic anhydride-containing compound, a maleic anhydride-containing vinyl compound, and combinations thereof; and c) a vinyl component wherein upon curing under curing conditions, the curable composition forms at least one interpenetrating polymer network is disclosed.
93 THERMOSETTING RESIN COMPOSITION AND USES THEREOF US15033299 2013-11-06 US20160264745A1 2016-09-15 Cuiming Du; Songgang Chai
The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.
94 DEGRADABLE HYDRAZONE CURING AGENTS AND APPLICATIONS THEREOF US15080317 2016-03-24 US20160229949A1 2016-08-11 BING QIN; XIN LI; BO LIANG
This invention provides, among others, curing agents of Formula II, methods for preparing these curing agents, prepreg materials, degradable cross-linked polymers and reinforced composites made from these curing agents and epoxy resins, and methods for degrading and/or recycling the degradable polymers and reinforced composites.
95 Epoxy resin blend dispersion and a process for preparing the dispersion US14408106 2013-06-24 US09346925B2 2016-05-24 Liang Chen; Liang Hong
The present invention relates to an aqueous epoxy resin blend dispersion of a high mw epoxy resin and a liquid epoxy resin with a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the epoxy resin blend against water is less than 2 dynes/cm, preferably less than 1 dyne/cm, and a process for preparing this epoxy resin blend dispersion. Specifically, the process is a solvent free melt kneading or shearing dispersion process wherein the dispersion is processed at from 50 to 150° C., and the resulting dispersion is stable.
96 RESIN COMPOSITION FOR PRINTED WIRING BOARD MATERIAL AND PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING THE SAME US14890714 2014-06-02 US20160125971A1 2016-05-05 Keiichi HASEBE; Naoki KASHIMA; Takenori TAKIGUCHI; Takaaki OGASHIWA
A resin composition used as a material of an insulating layer of a printed wiring board including the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition including: an epoxy compound; a cyanate compound; a maleimide compound; an inorganic filler; and an imidazole silane, wherein the maleimide compound includes a predetermined maleimide compound, a content of the maleimide compound is 25% by mass or less based on 100% by mass of a total content of the epoxy compound, the cyanate compound, and the maleimide compound, and the imidazole silane includes a compound represented by the formula (3).
97 ADDUCT AND THERMOSETTING SURFACING FILM AND METHOD OF FORMING THE SAME US14624117 2015-02-17 US20160039983A1 2016-02-11 Qiang Wang; Ito Akihiro; Paul Kyle; Augusto Arakaki; Catalina Gutierrez
In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.
98 METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS US14797802 2015-07-13 US20150315432A1 2015-11-05 Mark B. Wilson; Michael J. Mullins; Perrin Shao Ping Ren; Yonghua Gong; Ludovic Valette
A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed.
99 FIBER REINFORCED POLYMER COMPOSITE WITH A HARD INTERPHASE US14650138 2013-12-23 US20150315430A1 2015-11-05 Felix N. NGUYEN; Kenichi YOSHIOKA; Swezin Than TUN; Alfred P. HARO
A fiber reinforced polymer composition is provided comprising a fiber and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin, a curing agent, and a hard interfacial material. When cured, the adhesive composition forms good bonds to the reinforcing fiber, and an interfacial region between the reinforcing fiber and the adhesive composition is formed which comprises the hard interfacial material. Additional embodiments include a prepreg and a method of manufacturing a composite article by curing the adhesive composition and the reinforcing fiber.
100 Epoxy resin varnishes, laminates and printed circuit boards US12337651 2008-12-18 US09169346B2 2015-10-27 Chien-Jen Chung; Zhuo Wang
Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In farther embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).
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