子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 具有改进的反应性的源自生物的环氧树脂 | CN201380010198.5 | 2013-02-18 | CN104144963B | 2016-10-26 | 让-皮埃尔·阿巴; 文森特·拉皮内; 阿梅利亚·乌略亚-阿巴; 奥利维亚·吉亚尼 |
| 一种源自生物的环氧树脂，包括在存在至少一种共反应物的情况下一种或更多种源自生物的环氧化脂类衍生物与至少一种交联剂的反应产物，所述至少一种共反应物选自源自生物的多元醇的缩水甘油醚衍生物、或一种或更多种源自生物的多元醇的缩水甘油醚与至少一种交联剂的反应产物。 | ||||||
| 2 | 能够通过加热活化的粘合性聚氨酯粉末 | CN201180035346.X | 2011-05-19 | CN103003383A | 2013-03-27 | 米歇尔·布雷蒙特; 米歇尔·奥卡尔 |
| 本发明公开一种用于将部件粘结到如玻璃的表面的可加热活化的粉末粘合剂组合物。本发明公开的组合物包含至少两种聚合物，至少一种粉末形式的固体双-或聚-异氰酸酯及催化剂。两种聚合物都具有高于40℃的熔点且选自由双官能聚合物和多官能聚合物组成的群组。制备本发明的组合物的方法包括首先形成三部分，包括：包含聚合物的第一熔化部分、包含聚合物和催化剂的第二熔化部分及包含异氰酸酯的第三部分。冷却后，第一和第二部分形成固体块，粉碎固体块并过筛。然后将三个干燥的部分混合到一起形成本发明的粘合剂粉末。粘合剂粉末可预加在待粘结部件的连接表面。组合物不需要惰化剂或阻断剂来惰化异氰酸酯或催化剂，也不需要惰化的异氰酸酯或惰化的催化剂。 | ||||||
| 3 | 用于覆盖、封闭或者粘结细胞组织的复合粘合体系 | CN201080056352.9 | 2010-12-06 | CN102725320A | 2012-10-10 | S.德尔; H.赫克罗特; C.埃格特 |
| 本发明涉及一种复合粘合体系，其包括组织粘合剂的粘合层和大面积施涂到所述粘合层表面的保护层，其中所述组织粘合剂基于亲水的聚氨酯聚合物，且所述保护层为不透水的。本发明还涉及生产所述复合粘合体系的方法，能根据所述方法获得的复合粘合体系，可用于覆盖、封闭或者粘结细胞组织的复合粘合体系，以及所述复合粘合体系用于生产用于覆盖、封闭或者粘结细胞组织的器件的应用。 | ||||||
| 4 | 能够通过加热活化的粘合性聚氨酯粉末 | CN201180035346.X | 2011-05-19 | CN103003383B | 2015-10-14 | 米歇尔·布雷蒙特; 米歇尔·奥卡尔 |
| 本发明公开一种用于将部件粘结到如玻璃的表面的可加热活化的粉末粘合剂组合物。本发明公开的组合物包含至少两种聚合物，至少一种粉末形式的固体双-或聚-异氰酸酯及催化剂。两种聚合物都具有高于40℃的熔点且选自由双官能聚合物和多官能聚合物组成的群组。制备本发明的组合物的方法包括首先形成三部分，包括：包含聚合物的第一熔化部分、包含聚合物和催化剂的第二熔化部分及包含异氰酸酯的第三部分。冷却后，第一和第二部分形成固体块，粉碎固体块并过筛。然后将三个干燥的部分混合到一起形成本发明的粘合剂粉末。粘合剂粉末可预加在待粘结部件的连接表面。组合物不需要惰化剂或阻断剂来惰化异氰酸酯或催化剂，也不需要惰化的异氰酸酯或惰化的催化剂。 | ||||||
| 5 | 具有改进的反应性的源自生物的环氧树脂 | CN201380010198.5 | 2013-02-18 | CN104144963A | 2014-11-12 | 让-皮埃尔·阿巴; 文森特·拉皮内; 阿梅利亚·乌略亚-阿巴; 奥利维亚·吉亚尼 |
| 一种源自生物的环氧树脂，包括在存在至少一种共反应物的情况下一种或更多种源自生物的环氧化脂类衍生物与至少一种交联剂的反应产物，所述至少一种共反应物选自源自生物的多元醇的缩水甘油醚衍生物、或一种或更多种源自生物的多元醇的缩水甘油醚与至少一种交联剂的反应产物。 | ||||||
| 6 | 树脂组合物 | CN201280026996.2 | 2012-05-31 | CN103582662A | 2014-02-12 | 丹尼尔·霍夫曼; 丹尼尔·雷曼; 约翰·弗朗茨·格雷达斯·安托尼斯·詹森 |
| 本发明涉及包含不饱和聚酯树脂和/或甲基丙烯酸酯官能树脂的树脂组合物，其中所述树脂组合物还包含根据式(1)的芳胺(b)，其中P1为有机残基，R1＝H或C1-C6烷基，R2＝H或CH3。 | ||||||
| 7 | Cured product | US15104030 | 2015-01-28 | US10090219B2 | 2018-10-02 | Min Jin Ko; Kyung Mi Kim; Jae Ho Jung; Bum Gyu Choi; Min Kyoun Kim |
| The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device. | ||||||
| 8 | Cured product | US15112387 | 2015-01-28 | US09837329B2 | 2017-12-05 | Min Jin Ko; Kyung Mi Kim; Jae Ho Jung; Bum Gyu Choi; Min Kyoun Kim |
| The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device. | ||||||
| 9 | Cured product | US15104037 | 2015-01-28 | US09805999B2 | 2017-10-31 | Min Jin Ko; Kyung Mi Kim; Jae Ho Jung; Bum Gyu Choi; Min Kyoun Kim |
| The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability. | ||||||
| 10 | Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same | US15111265 | 2015-01-09 | US09617451B2 | 2017-04-11 | Takuro Oda; Daisuke Kanamori; Toshihisa Nonaka |
| The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component. | ||||||
| 11 | POLYURETHANE HOT-MELT ADHESIVE HAVING A LOW CONTENT OF DIISOCYANATE MONOMERS AND GOOD CROSS-LINKING SPEED | US15125552 | 2015-03-05 | US20170002239A1 | 2017-01-05 | Doreen JANKE; Mathias CORDES; Kai PASCHKOWSKI |
| A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry. | ||||||
| 12 | RESIN COMPOSITION | US14123372 | 2012-05-31 | US20150034243A1 | 2015-02-05 | Daniel Haveman; Daniel Raimann; Johan Franz Gradus Antonius Jansen |
| The present invention relates to a resin composition comprising (a) an unsaturated polyester resin and/or a methacrylate functional resin, wherein the resin composition further comprises an aromatic amine (b) according to formula (1) in which P1 is an organic residue, R1=H or a C1-C6 alkyl, R2=H or CH3. | ||||||
| 13 | 고유하게 감소된 점도를 갖는 알콕시실릴-함유 접착 실란트 | KR1020167014489 | 2014-11-26 | KR1020160094951A | 2016-08-10 | 로베르트,마티아스; 레빈,앙케; 페렌츠,미하엘; 슈베르트,프랑크 |
| 본발명은, 특정알콕실화생성물, 그의제조방법, 상기알콕실화생성물을함유하는조성물, 및그의용도에관한것이다. | ||||||
| 14 | Polyimide resin, resin composition using same, and laminated film | US15121446 | 2015-02-24 | US10026637B2 | 2018-07-17 | Masao Tomikawa; Takuo Watanabe; Chungseo Lee |
| A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group. | ||||||
| 15 | Polyurethane hot-melt adhesive having a low content of diisocyanate monomers and good cross-linking speed | US15125552 | 2015-03-05 | US09982173B2 | 2018-05-29 | Doreen Janke; Mathias Cordes; Kai Paschkowski |
| A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry. | ||||||
| 16 | HARDENER AND CURE ACCELERANT WITH FLAME RETARDANCY EFFECT FOR CURING EPOXY RESINS (II) | US15566837 | 2016-04-14 | US20180105545A1 | 2018-04-19 | Frank EIßMANN; Martin EBNER; Hans-Peter KRIMMER; Doris KRAMMER |
| The present invention relates to novel hardeners for curing epoxy resins and to cure accelerants for the accelerated curing of epoxy resins comprising, in each case, at least one compound from the group of esters of phosphorus-containing acids according to Formula (I), wherein there applies to Formula (I): wherein there applies to the radicals R1, R2, R3, R6, X and indices m, n, p, simultaneously or independently of one another: R1, R2=simultaneously or independently of one another, hydrogen or alkyl, R3=alkyl, aryl, —O-alkyl, —O-aryl, —O-alkylaryl or —O-arylalkyl, R6=hydrogen, alkyl or —NHC(O)NR1R2, X=oxygen or sulphur, m=1, 2 or 3, n=0, 1 or 2, wherein there applies: m+n=3 p=0, 1 or 2. | ||||||
| 17 | Alkoxysilyl-containing adhesive sealants with intrinsically reduced viscosity | US15101819 | 2014-11-26 | US09896534B2 | 2018-02-20 | Matthias Lobert; Anke Lewin; Michael Ferenz; Frank Schubert |
| The present invention provides specific alkoxylation products, a process for preparing them, compositions comprising these alkoxylation products, and their use. | ||||||
| 18 | Cured product | US15035903 | 2015-01-28 | US09870970B2 | 2018-01-16 | Min Jin Ko; Kyung Mi Kim; Jae Ho Jung; Bum Gyu Choi; Min Kyoun Kim |
| The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device. | ||||||
| 19 | POLYIMIDE RESIN, RESIN COMPOSITION USING SAME, AND LAMINATED FILM | US15121446 | 2015-02-24 | US20160372357A1 | 2016-12-22 | Masao Tomikawa; Takuo Watanabe; Chungseo Lee |
| A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group. | ||||||
| 20 | CURED PRODUCT | US15112387 | 2015-01-28 | US20160336248A1 | 2016-11-17 | Min Jin KO; Kyung Mi KIM; Jae Ho JUNG; Bum Gyu CHOI; Min Kyoun KIM |
| The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device. | ||||||
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