序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
21 CURED PRODUCT US15104037 2015-01-28 US20160322546A1 2016-11-03 Min Jin KO; Kyung Mi KIM; Jae Ho JUNG; Bum Gyu CHOI; Min Kyoun KIM
The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.
22 CURED PRODUCT US15104030 2015-01-28 US20160315026A1 2016-10-27 Min Jin KO; Kyung Mi KIM; Jae Ho JUNG; Bum Gyu CHOI; Min Kyoun KIM
The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
23 ADHESIVE POLYURETHANE POWDER CAPABLE OF BEING ACTIVATED BY HEAT US12783751 2010-05-20 US20110288242A1 2011-11-24 Michel Brémont; Michel Awkal
A heat-activable powder adhesive composition for use in bonding a component to a surface such as glass is disclosed. The composition of the disclosed invention includes at least two polymers, at least one solid di- or poly-isocyanate in powder form, and a catalyst. The two polymers each have a melting point above 40° C. and are selected from the group consisting of di-functional polymers and multi-functional polymers. The preferred method of preparing the composition of the disclosed invention includes first forming three parts, including a first melted part comprising the polymers, a second melted part comprising the polymers and a catalyst, and a third part comprising the isocyanate. Once cooled, each of the first and second parts forms solid blocks which are fragmented and sieved. The three dry parts are then brought together to form the adhesive powder of the disclosed invention. The adhesive powder can be pre-applied to the attachment surface of a component to be bonded. The composition does not require either a deactivating agent or a blocking agent for deactivating the isocyanate or the catalyst nor does it require either a deactivated isocyanate or a deactivated catalyst.
24 Laminate Comprising at Least One Polyether Block Copolymer Substrate, Manufacturing Process and Use in the Shoe Industry US12161636 2007-01-19 US20080318037A1 2008-12-25 Jean-Luc Maral; Bruno Dherbecourt
The present invention relates to a laminated product comprising a first and a second substrate that adhere to each other only by means of a cured and crosslinked layer of a polymeric adhesive containing no organic solvent, characterized in that: a) the polymeric material of either or both of the first or second substrates is a polyether block copolymer; and b) the polymeric adhesive is a moisture-crosslinkable hot-melt adhesive based on a polyurethane prepolymer or on a blend of polyurethane prepolymers containing free isocyanate (—N═C═O) functional groups. The present invention also relates to a process for manufacturing such a laminate and to its use in the shoe industry, especially for the manufacture of soles and most particularly sports shoe soles.
25 Method for heat-sealing textile materials with polyurethane adhesives US119954 1980-02-08 US4310373A 1982-01-12 Gunter Schuhmacher; Erich Fahrbach; Sepp Wagner
The invention described herein relates to a method for heat sealing the opposing surfaces of planar textile materials which comprises applying a heat-seal adhesive to at least one of the opposing surfaces of the textiles, and then pressing the opposing surfaces of the textiles together under heat and pressure to heat-seal the textile surfaces together. The heat-seal adhesive employed is a low-melting polyurethane prepared by reacting at least one diisocyanate with at least one polyol having a molecular weight between about 500 and 5000, at least one diol which is branched or includes an ether group, and at least one diol which is unbranched. The diol reactants have an average molecular weight of less than about 500. The total hydroxyl group content of the reactants exceeds or equals the total isocyanate content of the reactants.
26 硬化体 JP2016548742 2015-01-28 JP2017513958A 2017-06-01 ミン・ジン・コ; キョン・ミ・キム; ジエ・ホ・ジュン; ブム・ギュ・チェ; ミン・キョン・キム
本出願は、硬化体及びその用途に関する。上記硬化体は、例えば、LEDなどのような光半導体に適用される場合に、素子を長時間使用しても、輝度の低下が最小化され、ネクレック特性に優れ、長期信頼性に優れた素子を提供することができる。硬化体は、加工性、作業性及び接着性などに優れ、白濁及び表面でのべたつきなどが誘発されない。また、硬化体は、高温耐熱性及びガスバリア性などに優れている。硬化体は、例えば、半導体素子の封止材や接着素材に適用することができる。
27 硬化体 JP2016535686 2015-01-28 JP2017505353A 2017-02-16 ミン・ジン・コ; キョン・ミ・キム; ジェ・ホ・ジュン; ブム・ギュ・チェ; ミン・キョン・キム
本出願は、硬化体及びその用途に関する。硬化体は、加工性、作業性及び接着性などに優れ、白濁及び表面でのべたつきなどが誘発されない。硬化体は、透明度、耐湿性、機械的特性及び亀裂耐性などに優れている。硬化体は、例えば、半導体素子の封止材や接着素材に適用され、長期信頼性に優れた素子を提供することができる。
28 エポキシ樹脂硬化剤、エポキシ樹脂組成物、及びガスバリア性接着剤、並びにガスバリア性積層体 JP2014512428 2013-03-25 JPWO2013161481A1 2015-12-24 栄一 本多; 和起 河野
本発明のエポキシ樹脂硬化剤は、少なくとも下記成分(I)と成分(II)とを、質量比[成分(I)/成分(II)]で50/50〜92/8の割合で含有するものである。成分(I):少なくとも(A)メタキシリレンジアミン又はパラキシリレンジアミンと(B1)アクリル酸及びアクリル酸誘導体から選ばれる少なくとも1種とを反応させて得られる反応生成物成分(II):少なくとも前記(A)と(B2)下記一般式(1)で表される不飽和カルボン酸及びその誘導体から選ばれる少なくとも1種とを反応させて得られる反応生成物(式(1)中、R1及びR2はそれぞれ独立に、原子、炭素数1〜8のアルキル基、炭素数1〜8のアラルキル基又はアリール基を表す。但し、R1及びR2の少なくとも一方は炭素数1〜8のアルキル基、炭素数1〜8のアラルキル基又はアリール基のいずれかである。)
29 The adhesive composition system for the closure or adhere the tissue JP2012542496 2010-12-06 JP2013513679A 2013-04-22 ゼバスティアン・デーア; ハイケ・ヘックロート; クリストフ・エッゲルト
本発明は、組織接着剤の接着剤層およびこの接着剤層の表面に適用する保護層とを含み、前記組織接着剤が親性ポリウレタンポリマーに基づき、保護層が防水性である複合接着剤系に関する。 また、本発明は、前記複合接着剤系の製造方法、その製造方法により得られる複合接着剤系、細胞組織を被覆、封止または結合させるために使用することのできる複合接着剤系、および細胞組織を被覆、封止または結合するための生成物の製造方法に関する。
30 Use of water-dispersible polyisocyanate as additive for aqueous adhesive JP4752682 1982-03-26 JPS57170972A 1982-10-21 RUUDORUFU HOOMU BATSUHA; HERUMUUTO RAIFU; BUORUFUGANGU BUENTSUERU; MANFUREETO DORUHAUZEN
31 硬化体 JP2016535686 2015-01-28 JP6271017B2 2018-01-31 ミン・ジン・コ; キョン・ミ・キム; ジェ・ホ・ジュン; ブム・ギュ・チェ; ミン・キョン・キム
32 硬化体 JP2016527209 2015-01-28 JP2017508008A 2017-03-23 ミン・ジン・コ; キョン・ミ・キム; ジェ・ホ・ジュン; ブム・ギュ・チェ; ミン・キョン・キム
本出願は、硬化体及びその用途に関する。上記硬化体は、例えば、LEDなどのような光半導体に適用される場合に、素子を長時間使用しても、輝度の低下が最小化され、亀裂耐性に優れ、長期信頼性に優れた素子を提供することができる。硬化体は、加工性、作業性及び接着性などに優れ、白濁及び表面でのべたつきなどが誘発されない。また、硬化体は、高温耐熱性及びガスバリア性などに優れている。硬化体は、例えば、半導体素子の封止材や接着素材に適用することができる。
33 硬化体 JP2016535172 2015-01-28 JP2017505352A 2017-02-16 ミン・ジン・コ; キョン・ミ・キム; ジェ・ホ・ジュン; ブム・ギュ・チェ; ミン・キョン・キム
本出願は、硬化体及びその用途に関する。上記硬化体は、例えば、LEDなどのような光半導体に適用される場合に、素子を長時間使用しても、輝度の低下が最小化され、亀裂耐性に優れ、長期信頼性に優れた素子を提供することができる。硬化体は、加工性、作業性及び接着性などに優れ、白濁及び表面でのべたつきなどが誘発されない。また、硬化体は、高温耐熱性及びガスバリア性などに優れている。硬化体は、例えば、半導体素子の封止材や接着素材に適用することができる。
34 Thixotropic reactive composition JP2006550173 2005-01-21 JP4643593B2 2011-03-02 デイヴィッド・トブラー
35 Thixotropic reactive composition JP2006550173 2005-01-21 JP2007522278A 2007-08-09 デイヴィッド・トブラー
本発明は、イソシアネート、エポキシド、アルコキシシラン、及びそれらの混合基を含む群から選択される少なくとも2つの反応性基を含む少なくとも1種の化合物Aと、(メタ)アクリレートB1の単独重合もしくは(メタ)アクリレートB1と少なくとも1種の追加の(メタ)アクリレートとの共重合によって製造される少なくとも1種のポリマー型チキソ性付与剤Bとを含む反応性組成物に関し、前記(メタ)アクリレート混合物は2.5〜4.5の平均(メタ)アクリレート官能性fを有する。 前記(メタ)アクリレートB1は3つ又は4つの(メタ)アクリレート基をもつ。 本発明はさらに、チキソ性付与剤としての化合物Bの使用にも関する。
36 Heat fixing of fabric surface by polyurethane JP200480 1980-01-11 JPS55112380A 1980-08-29 GIYUNTAA SHIYUUMATSUHAA; EERITSUHI FUAARUBATSUHA; SETSUPU BUAGUNAA
37 CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, USE OF CURABLE COMPOSITION, AND OPTICAL DEVICE US15780537 2016-12-21 US20180355111A1 2018-12-13 Yutaka NANASHIMA; Hidekazu NAKAYAMA; Manabu MIYAWAKI; Mikihiro KASHIO
The invention is a curable composition comprising the following component (A) and component (B):Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1): R1—D—SiO3/2  (a-1) Component (B): a silane coupling agent having a nitrogen atom in its molecule, anda method for producing the curable composition, anda cured product obtained by curing the curable composition, anda method for using the curable composition as an adhesive for an optical element-fixing material, anda method for using the curable composition as a sealant for an optical element-fixing material, andan optical device obtained by using the curable composition as an adhesive or a sealant for an optical element-fixing material.One aspect of the curable composition according to one embodiment of the invention can provide a cured product excellent in adhesiveness and heat resistance and having a low refractive index.
38 Process for the preparation of lignin based polyurethane products US14911648 2014-07-31 US09598529B2 2017-03-21 Armand Langlois; Michel Drouin
A process for the production of a lignin based polyurethane products is provided. The process comprises mixing at least one dried lignin and at least one isocyanate to form a lignin-isocyanate mixture, and submitting the lignin-isocyanate mixture to a polymerization reaction. The polymerization reaction may include heating the lignin-isocyanate mixture, adding at least one catalyst to the lignin-isocyanate mixture, or mixing the lignin-isocyanate mixture with a resin comprising at least one polyol, in the presence of at least one catalyst. The lignin based polyurethane products obtained by the process may be rigid foams, flexible foams, rigid boards, rigid blocks, coatings, packagings, adhesives, binders, sealants, elastomers, Thermoplastic Polyurethanes or Reaction Injection Moldings. There is also provided a mixture comprising at least one dried lignin and at least one isocyanate for use in the production of a lignin based polyurethane products.
39 ADHESIVE COMPOSITION AND ADHESIVE FILM HAVING SAME, SUBSTRATE PROVIDED WITH ADHESIVE COMPOSITION, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME US15111265 2015-01-09 US20160340558A1 2016-11-24 Takuro ODA; Daisuke KANAMORI; Toshihisa NONAKA
The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.
40 ALKOXYSILYL-CONTAINING ADHESIVE SEALANTS WITH INTRINSICALLY REDUCED VISCOSITY US15101819 2014-11-26 US20160311963A1 2016-10-27 Matthias Lobert; Anke Lewin; Michael Ferenz; Frank Schubert
The present invention provides specific alkoxylation products, a process for preparing them, compositions comprising these alkoxylation products, and their use.
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