Polyurethane hot-melt adhesive having a low content of diisocyanate monomers and good cross-linking speed

申请号 US15125552 申请日 2015-03-05 公开(公告)号 US09982173B2 公开(公告)日 2018-05-29
申请人 SIKA TECHNOLOGY AG; 发明人 Doreen Janke; Mathias Cordes; Kai Paschkowski;
摘要 A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry.
权利要求
说明书全文
QQ群二维码
意见反馈