专利汇可以提供Cleaving process and cleaving device of semicnductor laser专利检索,专利查询,专利分析的服务。并且PURPOSE:To facilitate the operation avoiding the damage to the cleaved surface by a method wherein, when the wafer of the semiconductor laser is cleaved by means of a sharp blade along the separating line provided on the wafer, said wafer is stickd to the elastic seal and cleaved by said blade with the seat extended in the direction perpendicular to the separating line. CONSTITUTION:The cleaving device comprises the supporting base 20, the wafer fixing unit 30 respectively located on said supporting base 20 and the blade operating unit 40. In such a constitution, said wafer fixing unit comprises the Y direction travelling unit 31, the X direction travelling unit 32, the turning unit 33 mounted on said units 31 and 32, the wafer holder 34 mounted on said turning unit 33 and the seat holders 35 and 35' located on both sides of said wafer holder 34. Besides said blade operating unit 40 comprises the lever 49, the arm 44 and the blade holder 46 fixing the blade 12 to the end of said blade holder 6. In the device so far constituted, the wafer is attracted onto the vinyl chloride seat extended between said seat holders 35 and 35' making use of the static electricity to be cleaved by the blade 12 held to the wafer in the direction perpendicular to the separating line.,下面是Cleaving process and cleaving device of semicnductor laser专利的具体信息内容。
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