Hybrid integrated circuit device
专利汇可以提供Hybrid integrated circuit device专利检索，专利查询，专利分析的服务。并且PURPOSE:To prevent the fatal damage of a hybrid integrated circuit device by forming a snap line in the predetermined direction on the surface of a ceramic substrate soldered on a heat conductive metallic plate, thereby producing the crack of the substrate due to the thermal strain and external impact along the snap line. CONSTITUTION:The overall surface of the lower sueface of a ceramic substrate 1 of a high power device is metallized, and is mounted, for example, on a Cu plate 2 by a low melting point solder layer 3. Linear grooves 4a, 4b (snap line) of V- shaped section are formed on the surface side of the substrate 1 at the time of manufacturing the substrate 1 so that the substrate 1 may be readily cracked in the directions of the grooves 4a, 4b. When the substrate cracks due to the external force and heat at the time of operating the circuit, it is cracked along the snap line, and accordingly a problem can be eliminated in the circuit device by conducting countermeasures as prescribed in advance.，下面是Hybrid integrated circuit device专利的具体信息内容。
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