| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | COATING SYSTEMS FOR CEMENT COMPOSITE ARTICLES | US11775080 | 2007-07-09 | US20080008895A1 | 2008-01-10 | Archie Garner; T. Killilea; Carl Cavallin; Kevin Evanson; Dan Hartinger; Larry Brandenburger |
| The present invention provides a coating composition, a method of coating a substrate, and a coated substrate (e.g., a coated cement fiberboard article). In preferred embodiments the coating composition includes one or more latex polymers and an aliphatic epoxy resin system. The coating composition can include one or more coating compositions that may be applied in one or more layers. A coated article comprising a cement fiberboard substrate and a coating system applied to the substrate is also provided. The article includes a first coating system applied to the substrate, wherein the first coating system includes an aliphatic epoxy resin system having an aqueous dispersion of polymer particles, optionally a silicate additive, and optionally one or more olefinic compounds and initiator for same. The first coating system preferably includes one or more coating compositions that may be applied in one or more layers. In a preferred embodiment, the first coating system is applied to all the surfaces of the substrate (e.g., the front side, back side and edges of a board). The coated substrate may then be coated with other optional coatings, e.g., decorative or protective topcoats. | ||||||
| 162 | Protective surface modification system and application to substrates | US11132835 | 2005-05-19 | US07267881B2 | 2007-09-11 | Rolf Thomas Weberg; Shitong Zhu; Timothy James Sanford; Lawrence J. Simmons |
| A protective surface modification system employs two separate formulations to enhance visual appearance and in many instances provide abrasion resistance on a surface such as a countertop. | ||||||
| 163 | Microwave process for porous ceramic filters with passivation and catalyst coatings | US11261226 | 2005-10-27 | US20070098914A1 | 2007-05-03 | Roychelle Ingram-Ogunwumi; Steven Ogunwumi; Barbara Oyer; Paul Shustack |
| A method for base-coating a porous ceramic catalyst support includes coating the support with a passivation coating via vacuum infiltration, and subsequently exposing the support to a microwave field to dry the coating and form a polymerized film. The method further includes coating the support with a catalyst coating or washcoat, and subsequently exposing the support to a second microwave field, thereby removing water from the catalyst coating or washcoat. | ||||||
| 164 | Decoration method | US11544973 | 2006-10-06 | US20070031604A1 | 2007-02-08 | James Lodge |
| A method of decorating an article, the method comprising mixing a thermochromic ink with a transparent lacquer, applying the mixture on to part or all of the surface of an article, once the mixture is set, applying a second layer of dishwasher proof transparent lacquer. | ||||||
| 165 | Composite fiber cement article with radiation curable component | US11035386 | 2005-01-12 | US20050208285A1 | 2005-09-22 | David Lyons; Donald Merkley; Theresa Sukkar |
| A composite building article is configured with one or more subsurface interfacial zones provided to improve the durability of the article. Each subsurface interfacial zone is made of a matrix of fiber cement and radiation curable material. The radiation curable material forms an interlocking network with the fiber cement to provide a interfacial zone against ingress of environmental agents that can degrade the article. The number, configuration and distribution of the subsurface interfacial zones can vary dependent on the desired characteristics of the final product. The subsurface interfacial zones also improves the adhesion between exterior coatings and the substrate as the interfacial zones can be integrally formed with the substrate as well as exterior coating layer. | ||||||
| 166 | Decoration method | US10745138 | 2003-12-23 | US06902775B2 | 2005-06-07 | James Anthony Lodge |
| A method of decorating an article, the method comprising mixing a thermochromic ink with a transparent lacquer, applying the mixture on to part or all of the surface of an article, once the mixture is set, applying a second layer of dishwasher proof transparent lacquer. | ||||||
| 167 | Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element | US10213093 | 2002-08-07 | US06806028B2 | 2004-10-19 | Masahiro Kubota |
| Provided is a photosensitive conductive paste that is unlikely to gel, has superior storage stability and adhesion to a substrate, and can be formed into a fine and thick pattern. In a photosensitive conductive paste containing a powdered base metal, an organic binder having acidic groups and a photosensitive organic component, a powdered base metal processed by surface oxidation treatment and a material such as a polyvalent alcohol having at least four hydroxyls, which forms microgels by reaction with metal hydroxides present on the surface of the powdered base metal, is used. | ||||||
| 168 | Method for making polymer surfaced composites | US10097845 | 2002-03-15 | US06709717B2 | 2004-03-23 | John N. Mushovic |
| To produce a composite building unit having a polymer-cladded surface, a polymerizable resin binder and a blend of filler particles are combined to provide a resin binder/filler mixture which is deposited in a mold. A concrete substrate is then positioned in the mold with a face surface contacting a transition layer comprising a lightly filled resin binder/filler layer portion of the deposited mixture overlying a highly filled resin binder/filler layer portion of the deposited mixture. The resin binder in the transition layer migrates into pockets and pores in the substrate face surface to create mechanical locks when the resin binder is cured. These locks, in addition to chemical bonding, serve to permanently affix the cured resin binder as a surface cladding to the substrate. Initiators may be added to the resin binder to promote thermal and/or UV radiation cures thereof. | ||||||
| 169 | Method for gas assisted energy beam engraving of a target object | US10208227 | 2002-07-30 | US06660962B2 | 2003-12-09 | Mary Helen McCay; C. Michael Sharp; John Brice Bible; John A. Hopkins; T. Dwayne McCay; Narendra Dahotre; Frederick A. Schwartz |
| This invention relates to a method for gas assisted energy beam engraving of a target object. This invention employs and energy beam, such as a laser beam or an electron beam, to irradiate a target object in the presence of a selected gaseous environment in order to engrave a mark in the object. | ||||||
| 170 | Method of coating cutting edges | US10401225 | 2003-03-27 | US20030224115A1 | 2003-12-04 | Raymond Guimont |
| A process for applying a coating containing a fusible material to a cutting edge of a cutting tool includes heating the fusible material to fuse the same, the heating being provided by microwave energy. | ||||||
| 171 | Method for forming thick film pattern and photosensitive paste used therefor | US09897305 | 2001-07-02 | US06630287B2 | 2003-10-07 | Shuichi Towata |
| A method for forming a thick film pattern is provided which can easily perform pattern formation even when a photosensitive paste containing a powdered conductor at a high content and having a low optical transmittance is used and which can form a thick film pattern having a rectangular cross-section and superior high-frequency transmission characteristics. In addition, a photosensitive paste used therefor is also provided. The thick film pattern having a predetermined shape can be formed by the steps of determining the photocurable depth d of a photosensitive paste; coating with the photosensitive paste in consideration of the photocurable depth d so as to form a photosensitive paste film having a predetermined thickness t; exposing the photosensitive paste film; and developing the exposed photosensitive paste film. Preferably, the coating with the photosensitive paste is performed so that the relationship between the photocurable depth d of the photosensitive paste and the thickness t of the photosensitive paste film satisfies the equation t≦d. | ||||||
| 172 | Method for making a lithographic printing plate | US10324638 | 2002-12-19 | US20030145749A1 | 2003-08-07 | Rene Van de Leest |
| A method for making a lithographic printing plate from an imaging material comprising a ceramic oxide or an oxidic ceramic is disclosed, wherein a lithographic image is created by increasing the contact angle for water of the ceramic oxide or oxidic ceramic, characterized in that an oxygen vacancy is introduced in the ceramic oxide or oxidic ceramic by a step selected from the group consisting of exposing the imaging material to ultraviolet radiation having a wavelength between 200 and 400 nm; and heating the imaging material under low partial oxygen pressure or in a reducing atmosphere. The plate obtained can be used as a printing master for lithographic printing. After the print job, the lithographic image can be erased by heating the ceramic oxide or oxidic ceramic in an oxidizing atmosphere and the erased imaging material thus obtained can then be reused in a next cycle of imaging and printing. | ||||||
| 173 | Photosensitive copper paste and method of forming copper pattern using the same | US09998354 | 2001-11-30 | US06531257B2 | 2003-03-11 | Masahiro Kubota |
| Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 &mgr;m from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight. | ||||||
| 174 | Method for selective activation and metallization of materials | US09333325 | 1999-06-15 | US06524663B1 | 2003-02-25 | Patrick V. Kelly; Gabriel M. Crean; Daniel J. Macauley |
| An activated substrate surface suitable for electronics and microsystems preparation is prepare by contacting the surface with a surface activation compound, e.g. organometallic based on palladium, platinum, rhodium or iridium. The photo labile ligand has an optical absorption band which overlaps with the wavelength of the UV. A UV lamp is used, in combination with a mask, to selectively irradiate the contacted surface. Irradiation of the surface with light of a suitable wavelength decomposes the organometallic compound to the activating metal. The surface is then ready for electroless plating with the desired conducting material. The mask is patterned to delineate areas where surface activation is not to occur. The organometallic compound absorbs ultraviolet radiation in the wavelength range 210-260 nm, or in the wavelength range 290-330 nm, in the solid state if the compound exists as a solid at 25° C. or in the liquid state if the compound exists as a liquid at 25° C. | ||||||
| 175 | Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element | US10213093 | 2002-08-07 | US20030036020A1 | 2003-02-20 | Masahiro Kubota |
| Provided is a photosensitive conductive paste that is unlikely to gel, has superior storage stability and adhesion to a substrate, and can be formed into a fine and thick pattern. In a photosensitive conductive paste containing a powdered base metal, an organic binder having acidic groups and a photosensitive organic component, a powdered base metal processed by surface oxidation treatment and a material such as a polyvalent alcohol having at least four hydroxyls, which forms microgels by reaction with metal hydroxides present on the surface of the powdered base metal, is used. | ||||||
| 176 | Process for preparing coatings on porous and/or absorbent materials | US09960035 | 2001-09-20 | US20020106524A1 | 2002-08-08 | Jan Weikard; Wolfgang Fischer; Manfred Muller |
| The present invention relates to a process for process for preparing a coating by a) applying to a porous and/or absorbent substrate a liquid coating composition containing at least one component having (meth)acryloyl groups and a dynamic viscosity of less than 2000 mPa.s and 0.1 to 10 wt. %, based on the non-volatile content of the coating composition, of an additive selected from polyamides, oligomeric fatty acid amides and polymeric fatty acid amides and b) polymerizing the composition with radiation. The present invention also relates to the resulting coated substrates and to the coating compositions used in the process. | ||||||
| 177 | Treatment of etching chambers using activated cleaning gas | US08955181 | 1997-10-21 | US06379575B1 | 2002-04-30 | Gerald Zheyao Yin; Xue-Yu Qian; Patrick L. Leahey; Jonathan D. Mohn; Waiching Chow; Arthur Y. Chen; Zhi-Wen Sun; Brian K. Hatcher |
| An apparatus 20 and process for treating and conditioning an etching chamber 30, and cleaning a thin, non-homogeneous, etch residue on the walls 45 and components of the etching chamber 30. In the etching step, a substrate 25 is etched in the etching chamber 30 to deposit a thin etch residue layer on the surfaces of the walls and components in the chamber. In the cleaning step, cleaning gas is introduced into a remote chamber 40 adjacent to the etching chamber 30, and microwave or RF energy is applied inside the remote chamber to form an activated cleaning gas. A short burst of activated cleaning gas at a high flow rate is introduced into the etching chamber 30 to clean the etch residue on the walls 45 and components of the etching chamber. The method is particularly useful for cleaning etch residue that is chemically adhered to ceramic surfaces in the chamber, for example surfaces comprising aluminum nitride, boron carbide, boron nitride, diamond, silicon oxide, silicon carbide, silicon nitride, titanium oxide, titanium carbide, yttrium oxide, zirconium oxide, or mixtures thereof. | ||||||
| 178 | Process for making a radiation cured cement board substrate | US09352020 | 1999-07-12 | US06284327B1 | 2001-09-04 | Paul Neumann; Donald P. Hart, Jr. |
| A coated cement board article capable of receiving a sublimatable ink and a process for making same includes coating a cement board substrate with a radiation curable top coat. The radiation curable top coat is subjected to a curing step which includes curing with either an electron beam, ultraviolet radiation or a combination thereof. A sublimatable ink may be transferred into the top coat. | ||||||
| 179 | Multi-functional material with photocatalytic functions and method of manufacturing same | US09167326 | 1998-10-07 | US06210779B1 | 2001-04-03 | Toshiya Watanabe; Eiichi Kojima; Keiichiro Norimoto; Tamon Kimura; Mitsuyoshi Machida; Makoto Hayakawa; Atsushi Kitamura; Makoto Chikuni; Yoshimitsu Saeki; Tatsuhiko Kuga; Yasushi Nakashima |
| Multi-functional materials which have a photocatalytic layer with a photocatalytic function disposed on the surface of a base through an amorphous binder layer 6 interposed therebetween. Photocatalytic particles of the photocatalytic layer are joined together by a surface energy or solid-state sintering. The photocatalytic layer may have a structure in which fine particles fill interstices defined between photocatalytic particles or a structure in which no fine particles fill interstices defined between photocatalytic particles. A metal such as Ag, Pt, or the like may be fixed or not fixed to surfaces of the photocatalytic particles. A lower layer of the photocatalytic layer is embedded in the binder layer such that an intermediate layer is formed between the binder layer and the photocatalytic layer, the intermediate layer including components of the binder and photocatalytic layers in varying concentrations therethrough. | ||||||
| 180 | Process for modifying surfaces of nitride, and nitride having surfaces modified thereby | US839373 | 1997-04-18 | US6162512A | 2000-12-19 | Seok Keun Koh; Hyung Jin Jung; Won Kook Choi; Yong Bai Son |
| A process for modifying a nitride surface includes irradiating energized ion particles onto the nitride surface while blowing a reactive gas directly on the nitride surface under a vacuum condition. An aluminum nitride for a direct bond copper (DBC) can be obtained by forming a thin copper film on the thusly modified nitride. | ||||||
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