| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | APPARATUS FOR AND METHOD OF BRAZING ALUMINIUM PRODUCTS WITH CLOSED LOOP CONVEYOR WITHIN THE FURNACE | US13641317 | 2011-04-11 | US20130062399A1 | 2013-03-14 | Malcolm Roger McQuirk |
| An apparatus (10) for the production of brazed aluminium products on a continuous flow basis includes, in sequence, a flux application zone (12), a tunnel furnace (14), a cooling zone (15,16) and a transportation element (25) for conveying (26) component parts or products though the apparatus, the transportation element including a closed loop conveyor having both conveying (26) and return (27) runs within the tunnel furnace. | ||||||
| 162 | BRAZING SYSTEM | US13356023 | 2012-01-23 | US20130001272A1 | 2013-01-03 | Michiyasu KURIHARA; Kiyoshi FURUKAWA; Toru INAGAKI; Zhenyu YAN |
| A brazing system for brazing component members of a workpiece has a brazing chamber an inside of which is made a heating space of a volume corresponding to the workpiece, a radiant heating means provided with a plurality of heating sources which are positioned so as to correspond to a plurality of regions into which two facing surfaces of the workpiece are respectively divided, a convection heating means for circulating a heated inert gas to the heating space so as to heat the workpiece, and a control means for controlling the operation of the heating sources and the circulation of the inert gas. Each heating source is independently controlled by the control means, and the convection heating means circulates the inert gas so as to reduce a temperature difference of the workpiece caused by the heating sources. | ||||||
| 163 | HEATING DEVICE FOR SOLDERING SYSTEM | US13267102 | 2011-10-06 | US20120088202A1 | 2012-04-12 | Lambertus Petrus Christinus Willemen |
| A heating device for a soldering system. One embodiment of the heating device has at least one heating nozzle equipped with at least two tubular outlet channels. At least one outlet channel of the heating nozzle is arranged at an angle opposite another outlet channel of the heating nozzle. One embodiment of a selective soldering system is also provided. The selective soldering system comprises a heating device and a selective soldering device which is connected downstream from the heating device. The heating device is equipped with at least one heating nozzle in order to guide the heating current in the direction of a flat side of each board to be soldered. At least one heating nozzle is equipped with at least two tubular outlet channels, and at least one outlet channel of each heating nozzle is arranged at an angle opposite another outlet channel of each heating nozzle. | ||||||
| 164 | Soldering apparatus | US12822309 | 2010-06-24 | US07942305B1 | 2011-05-17 | Shen-Chun Li; Shou-Kuo Hsu; Yung-Chieh Chen; Hsien-Chuan Liang |
| A soldering apparatus includes a base body, an actuator connected to the base body, and a pair of soldering arms connected to the actuator, each of the pair of soldering arms including a heating member and a soldering tip thermally coupled to the heating member. The pair of soldering arms is moveable and the actuator is controllable to move one soldering arm relative to the other soldering arm. | ||||||
| 165 | REFLOW BONDING METHOD AND METHOD OF MANUFACTURING HEAD SUSPENSION | US12907406 | 2010-10-19 | US20110101076A1 | 2011-05-05 | Shogo OGAKI; Takashi Ando; Masaru Inoue |
| A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together | ||||||
| 166 | Reflow soldering apparatus | US10511450 | 2003-05-01 | US07690550B2 | 2010-04-06 | Yatsuharu Yokota |
| In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2 and 3, the centers of the impellers in the adjacent fans 6 are not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined. | ||||||
| 167 | REPAIR APPARATUS AND REPAIR METHOD | US12485642 | 2009-06-16 | US20090321500A1 | 2009-12-31 | Toru OKADA; Satoshi EMOTO |
| A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board. | ||||||
| 168 | Induction coil design for portable induction heating tool and method for its use | US11700422 | 2007-01-31 | US07491916B1 | 2009-02-17 | John P. Barber; Robert C. Cravens, II; Antonios Challita; Susan A. Stanton |
| A portable induction tool is provided for soldering or brazing sections of metal pipe together. A work coil head (with induction coil) is U-shaped, allowing placement of the head around lengths of pipe, heating a susceptor (e.g., the pipe) to form a joint, and then to be withdrawn after the pipe joint is made. In one form, the tool uses heat pipes to remove thermal energy from the head, and also a heat exchanger for higher-powered units. Power capacitors are generally included with the induction (work) coil to create a tank circuit of a resonant frequency. The induction coil uses Litz wire, copper tubing, or heat pipes with a conductive outer skin to carry the high-current being delivered to the induction coil. The induction coil has a general racetrack configuration, which is typically wound in a U-shape (or as a semicircle) as a single winding, with multiple turns. | ||||||
| 169 | METHOD OF DETECTING AN OBJECT TO BE DETECTED IN A JOINING DEVICE, JOINING DEVICE, AND JOINING METHOD | US12020682 | 2008-01-28 | US20080179298A1 | 2008-07-31 | Hitoshi NAKAYAMA; Naoki Takeshima |
| Provided is a detection method of detecting presence or absence of an object to be detected in an object hold portion that is used together with an irradiation portion that irradiates the object to be detected with a heat ray, holds the object to be detected, and has an opening, the detection method including: imaging an image signal in a predetermined region having the opening by an imaging device; and making an irradiation optical path of the irradiation portion and an imaging optical path of the imaging device substantially coincide with each other within the opening by an optical unit. | ||||||
| 170 | Heating device | US09732355 | 2000-12-07 | US06649878B2 | 2003-11-18 | Johannes Rehm |
| A heating device for heating merchandise, especially printed boards, comprises a feeding device provided in front of a least one heating line in the transport direction of the merchandise and a discharge device provided behind the heating line in the transport direction, wherein a number of heating zones/devices and/or cooling zones/devices or the like are associated with the heating line. To improve a heating device of the aforementioned type by increasing the throughput of merchandise in a simple manner, at least two heating lines are disposed on top of each other, to which merchandise can be separately fed by the feeding device from a horizontal transport level, and the merchandise can be separately discharged from the heating lines by the discharge device from the heating lines back into a horizontal transport level. | ||||||
| 171 | Heating device | US09732355 | 2000-12-07 | US20020056710A1 | 2002-05-16 | Johannes Rehm |
| A heating device for heating merchandise, especially printed boards, comprises a feeding device provided in front of a least one heating line in the transport direction of the merchandise and a discharge device provided behind the heating line in the transport direction, wherein a number of heating zones/devices and/or cooling zones/devices or the like are associated with the heating line. To improve a heating device of the aforementioned type by increasing the throughput of merchandise in a simple manner, at least two heating lines are disposed on top of each other, to which merchandise can be separately fed by the feeding device from a horizontal transport level, and the merchandise can be separately discharged from the heating lines by the discharge device from the heating lines back into a horizontal transport level. | ||||||
| 172 | Printed circuit board header attachment station | US245125 | 1999-01-14 | US6152353A | 2000-11-28 | Paymon Sani-Bakhtiari; David Lekx |
| The printed circuit board (PCB) header attachment station mounts a header (PCB) onto a PCB having pre-existing solder joints, such as underneath a direct mount IC chip. The apparatus applies a soldering paste to PCB lands configured to receive the pins of the header; nests the header component in stacked alignment with the PCB in order to bring the header pins into contact with the respective PCB lands; heats the PCB to a temperature approaching the reflow temperature of the solder in the pre-existing PCB solder joints; and actuates a compliant heating block or bar to heat the header pins to an extent sufficient for the pins to conduct enough heat to locally reflow the solder on the corresponding PCB lands without reflowing the solder in the pre-existing solder joints. The local reflow of the solder precludes solder reflow in the surrounding pre-existing joints which may coalesce under the direct mount IC chip and render the PCB defective. | ||||||
| 173 | Radiant heating | US752908 | 1985-07-08 | US4604054A | 1986-08-05 | Thomas M. Smith |
| Improved infra-red irradiators and use thereof for soldering, domestic water heating, furnace treatment, drying and moisture profiling of paper webs. Burners can have a ceramic fiber mat held over a shallow combustion mixture plenum essentially completely spanned by a baffle. Mats can have folded-in edges to permit close packing. The plenum can have a partition forming a small ignition compartment with an igniter against the covering portion of the mat. Burners can be fitted to heat radial chambers on a rotating table lehr. | ||||||
| 174 | Soldering method and apparatus for ceramic circuits | US3797100D | 1971-04-12 | US3797100A | 1974-03-19 | BROWNE L |
| Disclosed herein is a method and apparatus for soldering electronic components to conductor pads on a ceramic substrate, wherein the source of heat for melting the solder is applied in a localized manner to the underside of the substrate. In the apparatus, a miniature hydrogen torch is disposed adjacent the underside of the substrate, in alignment with a component to be soldered to the upperside thereof, and the flame of the torch is electronically controlled by an ignition and valving system. The ignition system comprises a heating filament, disposed adjacent the discharge orifice of the torch, for being heated to ignite a valve-released jet of hydrogen, after which the filament is deenergized and the resultant flame is maintained for a predetermined period sufficient to effect a satisfactory soldered connection between the component and the substrate.
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| 175 | Apparatus for manufacture of hollow silverware | US53806531 | 1931-05-18 | US1879908A | 1932-09-27 | MOON CHARLES R |
| 176 | Method of forming tanks | US17424427 | 1927-03-10 | US1755416A | 1930-04-22 | WACHOWITZ WALTER J |
| 177 | Plumber's furnace | US69510824 | 1924-02-25 | US1532071A | 1925-03-31 | PARKER MICHAEL L |
| 178 | Fire pot | US56476522 | 1922-05-31 | US1469598A | 1923-10-02 | HORN EDWARD J |
| 179 | Plumber's furnace | US50396321 | 1921-09-28 | US1438678A | 1922-12-12 | ANDERSON JAMES B |
| 180 | 用于单独施加焊料沉积物的装置 | CN201420531876.4 | 2014-09-16 | CN204075447U | 2015-01-07 | 加西姆·阿兹达什; T·克劳斯 |
| 一种用于单独施加焊料沉积物的装置，装置包括输送装置，输送装置形成为输送盘，输送盘配置在容纳空间内且具有输送保持件，输送保持件均能够从接收位置移动到传送位置，在接收位置接收来自焊料存储部的焊料沉积物，在传送位置经由形成于上壳体部内的压力孔使焊料沉积物暴露于加压气体，焊料沉积物从传送位置被传送到施加装置的施加喷嘴而到达施加位置，施加装置具有形成于下壳体部内的、同时形成输送管道的下部的施加管道，输送管道用于将激光辐射输送到配置于施加喷嘴中的焊料沉积物且其上部延伸穿过上壳体部，施加管道相对于转动轴线以施加角度α倾斜。该装置允许在输送盘的功能不受损的情况下将焊料沉积物施加到朝向彼此成角度地配置的端子面。 | ||||||
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