| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
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| 181 | WÄRMEÜBERTRAGUNGSVORRICHTUNG FÜR DIE LÖTVERBINDUNGSHERSTELLUNG ELEKTRISCHER BAUTEILE | EP15817776.6 | 2015-12-09 | EP3230003B1 | 2018-09-26 | OETZEL, Christoph; CLÄRDING, Sebastian |
| 182 | ELECTRICAL CONNECTION TAPE | EP16749792 | 2016-02-10 | EP3257109A4 | 2018-08-01 | PROKOPIAK STEVEN DANE; ARORA SANYOGITA; PANDHER RANJIT S; TORMEY ELLEN S; SINGH BAWA |
| A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape. | ||||||
| 183 | ELECTRICAL CONNECTION TAPE | EP16749792.4 | 2016-02-10 | EP3257109A1 | 2017-12-20 | PROKOPIAK, Steven, Dane; ARORA, Sanyogita; PANDHER, Ranjit, S.; TORMEY, Ellen, S.; SINGH, Bawa |
| A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape. | ||||||
| 184 | GAS-BLOWING-HOLE PLATE AND SOLDERING DEVICE | EP13867869.3 | 2013-12-20 | EP2941103B1 | 2017-09-27 | HIYAMA, Tsutomu |
| 185 | HEAT PROCESSING DEVICE | EP12862549.8 | 2012-12-25 | EP2800462B1 | 2017-08-16 | YOKOTA, Yatsuharu |
| 186 | APPARATUS AND METHOD FOR ATTACHING INTERCONNECTOR OF SOLAR CELL PANEL | EP16191720.8 | 2016-09-30 | EP3151288A1 | 2017-04-05 | Hwang, Sunghyun; Kim, Jinsung; Kang, Woojoong; Kim, Jangho; Kang, Dongju; Sim, Kyuhyeok |
Disclosed is an apparatus for attaching an interconnector of a solar cell panel. A first interconnector-jig coupling is formed by fixing a plurality of first interconnectors (142) to a jig (243), locating the first interconnector-jig coupling over a working table (252), fixing the first interconnectors and a first solar cell (150) to each other, separating the jig from the first interconnectors, and attaching the first interconnectors to the first solar cell by applying heat to the first interconnectors and the first solar cell, which are fixed to each other.
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| 187 | HEAT-PROCESSING DEVICE | EP13841015 | 2013-09-06 | EP2902147A4 | 2016-08-31 | AKAMA HIROSHI; MATSUMOTO YUTAKA; KURODA MASAMI; NISHIMURA HIRONOBU |
| 188 | VORRICHTUNG ZUR VEREINZELTEN APPLIKATION VON VERBINDUNGSMATERIALDEPOTS | EP14742161.4 | 2014-07-03 | EP3057732A1 | 2016-08-24 | AZDASHT, Ghassem |
| The invention relates to an apparatus (10) for the individual application of deposits of soldering material, in particular solder balls, comprising a feeding device for the individual feeding of the deposits of soldering material from a soldering material reservoir to an application device (33), wherein the feeding device has transporting receptacles formed as through-holes, which can in each case be moved from a receiving position P1, in which a deposit of soldering material is received from the soldering material reservoir, into a transfer position P2, in which the deposit of soldering material is subjected to compressed gas and from which the deposit of soldering material is transferred to the application device, into an application position P3, wherein a removal device (46) for removing a deposit of soldering material from a transporting receptacle arranged in a removal position P4 is arranged downstream of the transfer position in the feeding direction, wherein, for initiating the removing function, the removal device is connected to a detector device, which checks the state of the transporting receptacle in the transfer position. | ||||||
| 189 | SOLDERING APPARATUS AND METHOD FOR MANUFACTURING SOLDERED PRODUCT | EP13782231 | 2013-04-24 | EP2842682A4 | 2016-03-09 | KURODA MASAMI; MATSUDA JUN; SUZUKI TAKAYUKI |
| 190 | VERFAHREN UND ANORDNUNG ZUM HERSTELLEN EINES RÄUMLICHEN WERKSTOFFVERBUNDS UNTER VERWENDUNG EINES EXPANSIONSKÖRPERS | EP14722625.2 | 2014-04-29 | EP2866968B1 | 2015-11-18 | Betz, Gerhard, Dr. |
| 191 | GAS-BLOWING-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE | EP13867869.3 | 2013-12-20 | EP2941103A1 | 2015-11-04 | HIYAMA Tsutomu |
In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P2 of blowing nozzles 2 is arranged to be line symmetry with a nozzle pattern Plof the blowing nozzles 2 in upper and lower divided sections of one side of the nozzle cover 3 relative to a center portion thereof that is orthogonal to a conveying direction, as shown in |
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| 192 | JOINT STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM FOR SAME | EP11800738 | 2011-06-24 | EP2587900A4 | 2015-10-28 | ABE HIDEYUKI; MAWATARI KAZUAKI |
| A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween. | ||||||
| 193 | HEAT PROCESSING DEVICE | EP12862549 | 2012-12-25 | EP2800462A4 | 2015-07-08 | YOKOTA YATSUHARU |
| 194 | VERFAHREN UND ANORDNUNG ZUM HERSTELLEN EINES RÄUMLICHEN WERKSTOFFVERBUNDS UNTER VERWENDUNG EINES EXPANSIONSKÖRPERS | EP14722625.2 | 2014-04-29 | EP2866968A1 | 2015-05-06 | Betz, Gerhard, Dr. |
| Method and arrangement for producing a three-dimensional material composite using an expansion body. To produce a material composite, at least two metal bodies are firstly assembled in such a manner that surface regions to be connected rest loosely against one another. Then, this composite is heated to a target temperature. In this process, said surface regions are pressed against one another with no gaps, with a form-fitting and/or integral connection being established. To generate the pressure required to press said surface regions against one another, at least one expansion cavity (8) having a predefined initial volume is arranged in one of the metal bodies or in an additional expansion body (7) resting against at least one of the metal bodies (11) in such a manner that, when said expansion cavity expands, the surface regions to be connected are pressed against one another. A predefined quantity of at least one substance, which is gaseous at least at the target temperature or forms at least one gaseous substance in a predefined proportion before the target temperature is reached, is hermetically enclosed in the expansion cavity. | ||||||
| 195 | PORTABLE INDUCTION HEATING TOOL FOR SOLDERING PIPES HAVING A U-SHAPED HEAD PORTION COMPRISING AN INDUCTION COIL | EP05724080.6 | 2005-02-28 | EP1725366B1 | 2011-11-16 | BARBER, John, P.; CRAVENS II, Robert, C.; CHALLITA, Antonios; STANTON, Susan, A. |
| A portable induction tool (10) is provided for soldering or brazing sections of metal pipe tog they. A work coil head (20), with induction coil (34), is U-shaped, allowing placement of the head (20) around lengths of pipe, heating a susceptor, e.g., the pipe, to form a joint, and then to be wit drawn after the pipe joint is made. In one form, the tool (10) uses heat pipes (32) to remove he mal energy from the head (20), and also heat exchanger (50) for higher-powered units. Power capacitors (46) are generally included with the induction coil (34) to create a tank circuit of a resonant frequency. The induction coil (34) uses Litz wire, copper tubing, or heat pipes with a conductive outer skin to carry the high-current being delivered to the induction coil (34). The induction coil (34) has a general racetrack configuration, which is typically wound in a U-shape or as a semicircle as a single winding, with multiple turns. | ||||||
| 196 | Lötverfahren und -vorrichtung zum Reflow-Löten mit zwei unterschiedlichen Gasen | EP06021440.0 | 2006-10-12 | EP1878527A1 | 2008-01-16 | Wandke, Ernst, Dr. |
Die Erfindung betrifft ein Verfahren zum Reflow-Löten von Werkstücken (1), wobei das der Lötbehandlung zu unterziehende Werkstück (1) entlang einer bestimmten Bahn durch eine äußere Einhausung (9) transportiert wird, die eine Lötzone (5) mit einer Heizvorrichtung (4) und mindestens eine weitere Zone (7,8) umgibt, und wobei in die äußere Einhausung (9) ein Schutz- und/oder Aktivgas einer ersten Zusammensetzung eingebracht wird und das Werkstück (1) zumindest in der Lötzone (5) mit Hilfe der Heizvorrichtung (4) erwärmt wird, wobei die Lötzone (5) zusätzlich von einer inneren Einhausung (12) umgeben wird, in die ein Schutz- und/oder Aktivgas einer zweiten Zusammensetzung eingebracht wird. Desweiteren betrifft die Erfindung eine Vorrichtung zur Durchführung des Verfahrens.
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| 197 | Verfahren zum MSG-Löten mit Verwendung eines aktiven Schutzgases | EP00122769.3 | 2000-10-19 | EP1101559B1 | 2006-11-29 | Tischler, Friedrich |
| 198 | SPARK EROSION | EP02751388.6 | 2002-08-06 | EP1417070A2 | 2004-05-12 | HARVEY, John Patrick |
| Manufacture of a spark-erosion electrode from a blank (2) is carried out with the blank (2) clamped in a vice 1 mounted on a standard pallet. The closing faces (11,12) of the vice-jaws (9,10) have projections (15-17) of pyramidal form for indenting the blank (2). The indentations (19-21) establish references enabling the blank (2) or electrode manufactured from it, to be removed from the vice 1 and returned to it with precisely the same positioning, solely by registration of the indentations (19-21) with the projections (15-17). Accuracy of positioning similarly results for transfer of the blank (2) or electrode to another, corresponding vice. The projections may be provided as inserts (26) in the respective jaws (9,10). | ||||||
| 199 | Verfahren zum MSG-Löten und Verwendung eines Schutzgases | EP00122769.3 | 2000-10-19 | EP1101559A3 | 2003-10-22 | Tischler, Friedrich |
Die Erfindung betrifft das MSG-Löten (Metallschutzgas-Löten) von metallischen Werkstoffen unter Verwendung von Loten und eines elektrischen Lichtbogens mit abschmelzender oder mit nicht abschmelzender Elektrode, wobei ein im wesentlichen aus Inertgas zusammengesetztes Schutzgas verwendet wird. |
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| 200 | OPTICAL APPARATUS AND METHODS FOR SHRINKING ELECTRONIC COMPONENTS | EP01939739.7 | 2001-05-31 | EP1292798A1 | 2003-03-19 | The designation of the inventor has not yet been filed |
| Optical heat-generating apparatus (10) to deliver heat energy to heat shrink tubing (11) disposed over wires or other components, or to fuse insulated wires, or solder and unsolder packaged IC chips. A housing has one or more reflective cavities each having a linear elliptical reflective surface (13) with first and second focal lines, into which heatable component is placed along coincident first focal lines. Optical heat-generating elements (15) are placed along the second focal lines so as to focus heat energy along the first focal line. | ||||||
