| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | Disk having an electrical connection element | US14400476 | 2013-05-16 | US09496632B2 | 2016-11-15 | Klaus Schmalbuch; Bernhard Reul; Lothar Lesmeister; Mitja Rateiczak |
| A pane with at least one electrical connection element, having: a substrate, an electrically conductive structure on a region of the substrate, a connection element that is implemented as a snap and contains at least one chromium-containing steel, and a layer of a soldering compound, which electrically connects the connection element to a subregion of the electrically conductive structure. | ||||||
| 162 | Method and apparatus for attaching a laser diode and a slider in an energy assisted magnetic recording head | US13664271 | 2012-10-30 | US09475151B1 | 2016-10-25 | Lei Wang; Jih-Chiou Hser |
| A method and apparatus attach a laser diode on a submount to a slider. The submount and laser diode form a submount assembly. The slider includes an air-bearing surface (ABS) and a transducer. The apparatus includes an optical fiber and a holder. The optical fiber is configured to carry a laser pulse. The holder includes a vacuum channel and an optical fiber aperture therein. A portion of the optical fiber is held in the optical fiber aperture. The vacuum channel is configured to hold the submount assembly by a pressure differential between a pressure developed in the vacuum channel and an external pressure at a remaining portion of the submount assembly. The pressure in the vacuum channel is less than the external pressure. The method holds the submount assembly in the apparatus, aligns the submount assembly to the slider and provides a laser pulse through the fiber. | ||||||
| 163 | HEAT-BONDING APPARATUS AND METHOD OF MANUFACTURING HEAT-BONDED PRODUCTS | US14763150 | 2014-01-09 | US20150321278A1 | 2015-11-12 | Jun MATSUDA; Takayuki SUZUKI; Masami KURODA |
| A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature suitable for heat-bonding, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part in contact with the object in the chamber, a cooler for discharging heat of the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object. | ||||||
| 164 | Soldering apparatus and manufacturing method of soldered product | US14396030 | 2013-04-24 | US09156101B2 | 2015-10-13 | Masami Kuroda; Jun Matsuda; Takayuki Suzuki |
| An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece. | ||||||
| 165 | HYBRID DIFFUSION-BRAZING PROCESS AND HYBRID DIFFUSION-BRAZED ARTICLE | US13905669 | 2013-05-30 | US20140356056A1 | 2014-12-04 | Liangde XIE; Ronald Lee SOUTHER; Mark Lawrence HUNT; Steven Charles WOODS |
| A hybrid diffusion-brazing process and hybrid diffusion-brazed article are disclosed. The hybrid diffusion-brazing process includes providing a component having a temperature-tolerant region and a temperature-sensitive region, brazing a braze material to the temperature-tolerant region during a localized brazing cycle, then heating the component in a furnace during a diffusion cycle. The brazing and the heating diffusion-braze the braze material to the component, and the localized brazing cycle is performed independent of the diffusion cycle in the hybrid diffusion-brazing process. The hybrid diffusion-brazed article includes a component, and a braze material diffusion-brazed to the component with a filler material. The filler material has a melting temperature that is above a tolerance temperature of the component. | ||||||
| 166 | Method of Manufacturing a semiconductor module and device for the same | US13580754 | 2010-02-24 | US08791564B2 | 2014-07-29 | Hiroki Mizuno |
| In the disclosed method for manufacturing a semiconductor module, a metal layer and a cooler, which have different coefficients of thermal expansion from each other, are joined into a single unit via an insulating resin sheet. A work, comprising a semiconductor element placed on the metal layer with solder interposed therebetween, is fed into a reflow furnace. The work, in that state, is heated in the reflow furnace, thereby mounting the semiconductor element to the metal layer. The heating is carried out such that the temperature of the cooler and the temperature of the metal layer differ by an amount that make the cooler and the metal layer undergo the same amount of thermal expansion as each other. | ||||||
| 167 | Microwave brazing process for forming coatings | US11611259 | 2006-12-15 | US08574686B2 | 2013-11-05 | Laurent Cretegny; Daniel Joseph Lewis; Jeffrey Reid Thyssen |
| A process for forming a coating on a surface of a substrate, so that heating of the coating material is selective and sufficient to cause at least partial melting of the coating material and permit bonding to the substrate without excessively heating the substrate so as not to significantly degrade its properties. The process generally entails forming a brazing paste containing powder particles dispersed in a binder. The particles are formed of a composition that is susceptible to microwave radiation. The brazing paste is then applied to the surface of the substrate and subjected to microwave radiation so that the particles couple with the microwave radiation and are sufficiently heated to burn off the binder and then at least partially melt to form an at least partially molten layer on the substrate. The microwave radiation is then interrupted to allow the at least partially molten layer to cool, solidify, and form the coating. | ||||||
| 168 | Permanent conversion adapter for lighting fixtures | US12983623 | 2011-01-03 | US08432088B2 | 2013-04-30 | Scott Riesebosch |
| A permanent adapter for incandescent lighting fixtures can removably receive LEDs but cannot itself be removed from the fixture. | ||||||
| 169 | Braze materials and processes therefor | US12236788 | 2008-09-24 | US08342386B2 | 2013-01-01 | Laurent Cretegny; Sundar Amancherla; Jeffrey Jon Schoonover; Balasubramaniam Vaidhyanathan |
| Braze materials and processes for using braze materials, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material contains a plurality of first particles of a metallic material having a melting point, and a plurality of second particles comprising at least one nonmetallic material chosen from the group consisting of oxides, carbides, and nitrides of at least one metal. The nonmetallic material is more susceptible to heating by microwave radiation than the metallic material of the first particles, and the nonmetallic material is present in the braze material in an amount sufficient to enable the first particles to completely melt when the first and second particles are subjected to heating by microwave radiation. | ||||||
| 170 | SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AND MANUFACTURING DEVICE | US13580754 | 2010-02-24 | US20120319253A1 | 2012-12-20 | Hiroki Mizuno |
| In the disclosed method for manufacturing a semiconductor module, a metal layer and a cooler, which have different coefficients of thermal expansion from each other, are joined into a single unit via an insulating resin sheet. A work, comprising a semiconductor element placed on the metal layer with solder interposed therebetween, is fed into a reflow furnace. The work, in that state, is heated in the reflow furnace, thereby mounting the semiconductor element to the metal layer. The heating is carried out such that the temperature of the cooler and the temperature of the metal layer differ by an amount that make the cooler and the metal layer undergo the same amount of thermal expansion as each other. | ||||||
| 171 | Method of positioning conveyance section, and conveyance device | US12449870 | 2008-11-05 | US08297429B2 | 2012-10-30 | Masanari Matsuura; Sotaro Ol; Tomoyuki Kubota; Masaya Tsuruta |
| A conveyance section positioning method has carrier pallets on which workpieces are fixed, a conveyer, a heating furnace for heating the workpieces, and a positioning mechanism for positioning the carrier pallets, and the method stops the carrier pallets at predetermined positions. The heating furnace has halogen heaters for heating the workpieces. The carrier pallets each have projections and output grooves. Comb tooth-shaped stopper projections engaging with the projections are formed on a carrier stopper. When the carrier stopper is moved forward, the stopper projections and the projections are engaged with each other. In this one operation, the carrier pallets are positioned at places corresponding to the halogen heaters, and then the workpieces are heated. | ||||||
| 172 | METHOD FOR CONDUCTIVELY CONNECTING A COMPONENT ON A TRANSPARENT SUBSTRATE | US13273154 | 2011-10-13 | US20120266461A1 | 2012-10-25 | Andreas Nickut; Bernd Albrecht; Peter Kracht |
| The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established. | ||||||
| 173 | PERMANENT CONVERSION ADAPTER FOR LIGHTING FIXTURES | US12983623 | 2011-01-03 | US20120171881A1 | 2012-07-05 | Scott Riesebosch |
| A permanent adapter for incandescent lighting fixtures can removably receive LEDs but cannot itself be removed from the fixture. | ||||||
| 174 | MICROWAVE BRAZING PROCESS AND ASSEMBLIES AND MATERIALS THEREFOR | US12362948 | 2009-01-30 | US20100193574A1 | 2010-08-05 | Laurent Cretegny; Jeffrey Jon Schoonover |
| A brazing process and assembly utilizing microwave radiation and a plasma generator that is heated by microwave radiation and generates a localized plasma capable of selectively heating and melting a braze alloy. The plasma generator contains a microwave-susceptible material that is susceptible to heating by microwave radiation, and a plasma-generating material capable of volatilizing and generating the plasma when the plasma generator is subjected to heating and microwave radiation. The brazing process includes applying a braze material to a surface of a substrate, positioning the plasma generator in proximity to the braze material, and then subjecting the plasma generator to microwave radiation to volatilize the plasma-generating material and generate a plasma that melts the braze alloy within the braze material. | ||||||
| 175 | Microwave filter and microwave brazing system thereof | US11999961 | 2007-12-07 | US20090107994A1 | 2009-04-30 | Kim Yong Lim; Garimella Balaji Rao |
| A microwave filter for use with a microwave brazing system having a brazing chamber, a vacuum line, and a pressure gauge located proximate the vacuum line. The microwave filter comprises a baffle plate configured to be mounted in an opening between the brazing chamber and the pressure gauge, and a plurality of hollow pipes configured to substantially prevent the transmission of microwaves from the brazing chamber to the pressure gauge, and further configured to allow gas to flow between the brazing chamber and the vacuum line. | ||||||
| 176 | MOVABLE HEATING SYSTEM HAVING FIXED HEATING SOURCE FOR BRAZING STATOR BARS | US12193185 | 2008-08-18 | US20080296289A1 | 2008-12-04 | Yu Wang; David Robert Schumacher; James Michael Fogarty; Alan Michael Iversen |
| A heating system for brazing a stator bar to a clip including: a heating coil having a seat to receive the stator bar and clip; a heating mass adapted to fit into the seat of the coil, and an extendible press applying the mass to the stator bar or clip. | ||||||
| 177 | Movable heating method and system having fixed heating source for brazing stator bars | US11195590 | 2005-08-03 | US07414226B2 | 2008-08-19 | Yu Wang; David Robert Schumacher; James Michael Fogarty; Alan Michael Iversen |
| A method to heat a stator bar and clip assembly in a brazing chamber including: placing the stator bar and clip assembly in the brazing chamber, wherein the assembly is seated in a heating coil; positioning a conductive mass between a press and the stator bar and clip; applying the press to the assembly while the assembly is seated in the coil; heating the stator bar and clip by applying energy to the coil; brazing the stator bar to the clip with the heat from the coil, and removing the press and cooling the brazed clip. | ||||||
| 178 | Solder reflow system and method thereof | US11008769 | 2004-12-09 | US20060124705A1 | 2006-06-15 | Joseph Kuczynski; Arvind Sinha; Timothy Tofil |
| A reflow heating system includes a housing assembly defining an internal thermal processing chamber that encapsulates at least a microelectronic assembly on a substrate. A first heating source is coupled to the housing assembly and within the thermal processing chamber. The first heating source is biased by a force-applying assembly into engagement with the microelectronic assembly. The first heating source comprises one or more heating platens adapted to engage the microelectronic assembly for applying direct heat sufficient to melt solder. A vacuum assembly is incorporated in the heating platen for allowing application of at least a partial vacuum to the microelectronic assembly to permit withdrawal thereof from the substrate. A radiant heating source is applied beneath the substrate and a directional heating source is applied to the microelectronic assembly. | ||||||
| 179 | Movable heating method and system having fixed heating source for brazing stator bars | US11195590 | 2005-08-03 | US20060108357A1 | 2006-05-25 | Yu Wang; David Schumacher; James Fogarty; Alan Iversen |
| A method to heat a stator bar and clip assembly in a brazing chamber including: placing the stator bar and clip assembly in the brazing chamber, wherein the assembly is seated in a heating coil; positioning a conductive mass between a press and the stator bar and clip; applying the press to the assembly while the assembly is seated in the coil; heating the stator bar and clip by applying energy to the coil; brazing the stator bar to the clip with the heat from the coil, and removing the press and cooling the brazed clip. | ||||||
| 180 | Connecting method of wheel rim of bicycle | US10379813 | 2003-03-05 | US20040173667A1 | 2004-09-09 | Lai-Chien Chen |
| A connecting method of a wheel rim of a bicycle includes the following steps: forming a wheel rim, inserting an inner connecting member between two abutment ends of the wheel rim, connecting the two abutment ends, heating, packing, permeating, and returning. Thus, the structural strength of the wheel rim is enhanced, thereby increasing the lifetime of the wheel rim. In addition, the connecting seam of the two abutment ends will not form a protruding rough bur, so that it is unnecessary to perform a secondary working process to grind the surface of the connecting seam of the two abutment ends, thereby simplifying the working process of the wheel rim, and thereby decreasing costs of fabrication. | ||||||
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