| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | Light beam heating device | JP28057894 | 1994-11-15 | JPH08141759A | 1996-06-04 | KAWASAKI MORIAKI; IKEDA TAMOTSU; HAJI NOBUYUKI; UEDA MASAYOSHI |
| PURPOSE: To provide the light beam heating device capable of discriminating change timing of a light emitting lamp before the light energy emitted from optical fiber is lowered and the temp. of an object to be heated is lowered. CONSTITUTION: By lowering of light collecting power of an oval reflecting mirror 3 due to lowering of emitted light quantity and enlarging of arc light source from electrode wear while lighting time of a light emitting lamp is elapsed, when no-detected value of a temp. detector 8 to detect the temp. of object to be heated is turned to the setting value of an output command unit 15, the electric current supplied to the light emitting lamp 1 is increased. When the increased electric current is turned to the electric current value set lower by several amperes beforehand than the upper limit value of under constraint of electric current supplied to the light emitting lamp 1 at an electric current setting unit 20, by outputting signal to outside from a signal output unit 21, the change timing of light emitting lamp 1 is discriminated before temp. of object to be heated to prevent defect of heating execution. | ||||||
| 142 | Upward soldering method by optical beam | JP29949092 | 1992-11-10 | JPH06169167A | 1994-06-14 | CHIBA HIROSHI; KOBAYASHI MAKOTO |
| PURPOSE: To provide an automatic soldering method least in waste, wherein a useless process in which a printed wiring board is turned upside down can be dispensed with, whereby a soldering equipment is set simple and lessened in cost, and a jig which prevents parts inserted into the printed wiring board from falling off when the printed board is turned upside down is eliminated. CONSTITUTION: A printed wiring board 3 is arranged so as to make its soldered part face down, the lead 2 of an electronic part 1 provided with leads is inserted from above into the hole provided to the soldered part, light rays 6 are made to irradiate the soldered part from below at 0° to a certain angle with a line perpendicular to the printed wiring board 3 to heat the soldered part. After the heated part reaches above a melting point of solder, a wire solder is fed to the heated part at a certain angle above 0° with a line perpendicular to the printed wiring board 3, and when a certain time elapses after the feed of wire solder is stopped, the irradiation of light is stopped, and then a soldering operation is carried out. COPYRIGHT: (C)1994,JPO&Japio | ||||||
| 143 | Self-cooling type small-sized spot heater | JP27691091 | 1991-09-27 | JPH0589943A | 1993-04-09 | HAYAKAWA HIROMI; ONODA KAZUO |
| PURPOSE:To locally irradiate a portion to be machined with a high temperature beam so as to prevent an adverse thermal effect on portions other than the portion to be machined, and forcibly take in cooling air into a spot heater so as to prevent an increase in temperature of the whole of the spot heater. CONSTITUTION:Cooling air is forcibly taken in through an air inlet 5 formed on one side of a fan motor case 1, to be supplied into a mirror case 7 where a reflection mirror 12 is detachably fixed. A lamp base 17 having a lamp 16 is detachably held under a predetermined pressure in the reflection mirror 12 by a presser spring 18. The cooling air is introduced into a cooling passage 21 of the reflection mirror 12. The cooling passage 21 is constituted of a cooling fin 19 and the mirror case 7 each connected in the circumferential direction of the reflection mirror 12 and disposed along the vertical direction. The cooling air is adapted to cool the whole of the reflection mirror 12 through the cooling passage 21, to be discharged to a portion apart from a portion 26 to be machined through an air outlet 22. | ||||||
| 144 | Continuous working device for x axis and y axis directions | JP15705685 | 1985-07-18 | JPS6221462A | 1987-01-29 | HAYAKAWA HIROMI; ONODA KAZUO |
| PURPOSE: To execute efficiently a soldering work by turning a pair of irradiating units in the X axis and the Y axis directions, which respect to a semiconductor element which has been placed correctly, by soldering a substrate of the semiconductor element by a laser beam, and executing an automatic control to each working width and length. CONSTITUTION: In case of soldering by a laser beam of pins 2a, 2b projected in four directions of a rectangular semiconductor element 2 which has been placed correctly on a substrate 1, a focal height of a pair of heat source units 47, 48 is adjusted by moving up and down a holding plate 12 by a cylinder 17. When a direction converting element 22 is rotated by a motor 18, the units 47, 48 are turned in the X axis and the Y axis directions. Focal interval widths L 1, L 2 in the respective turning positions are adjusted by sliding the units 47, 48 to the right and the left by a cylinder 25 and links 28, 29. Also, irradiated beam lengths l 1, l 2 are adjusted by an opening degree of masking elements 72, 73 by releases 82, 83. By controlling automatically such an operation, a soldering work is executed with a high efficiency. COPYRIGHT: (C)1987,JPO&Japio | ||||||
| 145 | Non-contact type soldering device | JP26269184 | 1984-12-14 | JPS61140368A | 1986-06-27 | HAYAKAWA FUTOKI; ONODA KAZUO |
| PURPOSE: To perform efficiently the connection without defective connection with irradiating the heat ray of high temp. from plural directions simultaneously on the working part by fitting plural holding arms having plural heat source units to the fitting base held by a main shaft. CONSTITUTION: The lower end of a main shaft 19 projects to the lower part with penetrating a fitting base 24. Holding arms 32, 33 are fitted to the base 24 at the prescribed intervals and a heat source unit 35 is fitted with the angle adjustable to the holding arms 32,33. In case of soldering IC 28, etc. on a substrate 27 the heat source unit 35 is fixed with rocking to the center of a shaft 37 so as to coincide the focus of the heat source unit 35 with the terminal part 28a of the IC 28. The focus of the heat source unit 35 is freely changed with changing the work dimension of the IC 28. COPYRIGHT: (C)1986,JPO&Japio | ||||||
| 146 | Laser soldering method and soldering device used therefor | JP3595884 | 1984-02-29 | JPS60180666A | 1985-09-14 | KOMIYAMA KATSUMI |
| PURPOSE:To perform soldering with a high grade in short time by taking widely a laser-irradiating area at a soldering point in the initial period of heating then narrowing said irradiating area to increase energy density and heating the soldering point by the laser. CONSTITUTION:An electrode part 2 of an electronic part 1 is disposed on a soldering pattern 4 formed on a printed wiring board 3 and is heated by a laser beam 5 in a method for soldering said part 1 to the board 3 by laser heating. The laser beam 5 is applied to a wide area of the part 1, the electrode 2, the pattern 4, the board 3, etc. by making the beam diameter of said beam relatively large in the initial period of the heating. The inside of the irradiated surface is thus preheated and the fit of soldering is improved while the damage on the board 3 is averted. The irradiating area of the beam 5 is thereafter decreased to perform soldering in the short time at the increased energy density. | ||||||
| 147 | Method of coupling with ion beam | JP1651982 | 1982-02-05 | JPS583238A | 1983-01-10 | KAATO RUDORUFU GURIIBU; JIEEMUZU MATSUKERU EDOUIN HAAP |
| A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation. In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow. | ||||||
| 148 | JPS5016559B1 - | JP4954868 | 1968-07-15 | JPS5016559B1 | 1975-06-13 | |
| 149 | JPS4853941A - | JP9018871 | 1971-11-10 | JPS4853941A | 1973-07-28 | |
| 150 | 릴-투-릴 레이저 리플로우 방법 | KR1020160072647 | 2016-06-10 | KR1020170140479A | 2017-12-21 | 최지훈; 조성윤; 조완기 |
| 본발명은릴-투-릴레이저리플로우방법에관한것으로, 보다상세하게는균질화된레이저빔을조사하고, 조사영역을용이하게조절할수 있으며, 생산성을높이기위한릴-투-릴레이저리플로우방법에관한것이다. 본발명의일실시예는 a) 롤형태로감긴기판을풀어주면서일측으로이송시키는단계; b) 상기기판에솔더부를형성하는단계; c) 상기솔더부상에조사대상소자를안착시키고, 상기기판상에비조사대상소자를안착시키는단계; d) 상기조사대상소자가안착된솔더부에레이저빔을면 조사하여상기조사대상소자를상기기판에부착시키는단계; e) 상기 d) 단계를통해제조된기판구조체를검사하는단계; 및 f) 상기기판구조체를롤 형태로감는단계를포함하는것인릴-투-릴레이저리플로우방법을제공한다. | ||||||
| 151 | 레이저 솔더링 장치 | KR1020150119830 | 2015-08-25 | KR1020170024491A | 2017-03-07 | 전주현; 박거동; 김고은; 정태오 |
| 기판상의솔더링가공영역에레이저빔을조사하여솔더링공정을수행하는레이저솔더링장치가개시된다. 개시된레이저솔더링장치는, 다중모드레이저빔을발진시키는레이저광원; 및상기레이저광원으로부터방출된상기다중모드레이저빔을처리하여상기솔더링가공영역에조사하는것으로, 입사되는상기다중모드레이저빔을일정한크기의평행빔으로만들어출사시키는콜리메이터(collimator)를포함하는광학계;를포함한다. | ||||||
| 152 | 납땜 장치 및 납땜 제품의 제조방법 | KR1020147032884 | 2013-04-24 | KR101660622B1 | 2016-09-27 | 구로다마사미; 마쓰다준; 스즈키다카유키 |
| 짧은사이클타임으로효율좋게워크를납땜할수 있는우수한납땜장치및 납땜제품의제조방법을제공한다. 납땜장치는, 납땜할워크를열방사에의해가열하는열방사히터와, 납땜한워크를냉각하는, 열방사히터를사이에끼워배치되며, 대기위치와냉각위치와의사이를이동하는 2개의냉각기로서, 2개의냉각기의사이에끼운열방사히터를설치하는오목부를형성한냉각기를구비하며, 냉각기는, 열방사히터가워크를가열하는동안, 열방사히터가오목부로부터돌출한상태가되도록워크로부터이간하여대기하는대기위치로이동가능하게구성되고, 냉각기가워크를냉각할때에는, 대기위치로부터냉각위치로이동가능하게구성된다. | ||||||
| 153 | 전기 연결 요소를 갖춘 디스크 | KR1020147033980 | 2013-05-16 | KR1020150008161A | 2015-01-21 | 슈말부흐클라우스; 레울베른하르드; 레스마이스터로다르; 라테이크자크미트자 |
| 본 발명은 적어도 하나의 전기 연결 요소를 갖춘 디스크로서, 기판(1), 기판(1)의 영역 상의 전기 도전성 구조물(2), 누름 버튼으로서 형성되고 적어도 하나의 크롬 함유 강을 함유하는 연결 요소(3) 및 전기 도전성 구조물(2)의 일부 영역에 연결 요소(3)를 전기적으로 연결하는 솔더 재료(4)층을 포함하는 디스크에 관한 것이다.
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| 154 | 태양열 인두기 및 이를 이용한 숄더링 및 커팅 방법 | KR1020100076806 | 2010-08-10 | KR1020120014687A | 2012-02-20 | 박희상; 최만용; 박정학 |
| PURPOSE: A soldering iron using solar heat, soldering and a cutting method using the same is provided to improve resources-saving effect by using solar energy using a light-collecting part. CONSTITUTION: A soldering iron using solar heat comprises a lens part, a light-collecting part(200), a handle part(300) and a soldering iron tip(400). A lens part passes through the solar radiation energy in order to focus the energy in a fixed radiation direction. The light-collecting part stores the radiation energy as heat energy. The handle part interlinks the lens part and light-collecting part. The handle part comprises a lens controlling part(310) for the lens part location control or the radiation direction adjustment. | ||||||
| 155 | 반송부 위치 결정 방법 및 반송 장치 | KR1020097017937 | 2008-11-05 | KR101076969B1 | 2011-10-26 | 마쯔우라마사나리; 오오이소따로오; 구보따도모유끼; 쯔루따마사야 |
| 작업물을고정하는캐리어(40)와, 반송용컨베이어(20)와, 작업물의가열을행하는가열로(13)와, 캐리어(40)의위치결정을행하는위치결정기구를구비하고, 캐리어(40)를소정의위치에정지시키는반송부위치결정방법에있어서, 가열로(13)는작업물을가열하는할로겐히터(30)를복수구비하고, 캐리어(40)에돌기(41) 및절결홈(42)을구비하고, 캐리어스토퍼(35)에빗살형상으로복수개형성된돌기(41)와결합하는위치결정돌기(35a)를갖고, 캐리어스토퍼(35)를전진시킴으로써, 위치결정돌기(35a)와돌기(41)를결합시키고, 복수매의캐리어(40)를할로겐히터(30)와대응하는위치에한 번에위치결정하여, 작업물을가열한다. | ||||||
| 156 | Heat-bonding apparatus and method of manufacturing heat-bonded products | US14763150 | 2014-01-09 | US09919372B2 | 2018-03-20 | Jun Matsuda; Takayuki Suzuki; Masami Kuroda |
| A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for the buffer part in contact with the object in the chamber, a cooler for the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object. | ||||||
| 157 | JOINING APPARATUS AND METHOD FOR LOADING A JOINING ELEMENT | US15637498 | 2017-06-29 | US20180009056A1 | 2018-01-11 | Michael SCHNEIDER; Hubert IVO; Bettina FISCHERMANNS |
| Joining apparatus for joining joining elements onto workpieces, comprising a joining element holding device, which is configured to radially hold a joining element, and comprising a loading pin arrangement, which is configured to slide a joining element axially into a holding position in the joining element holding device, and/or to axially support the joining element during a joining process, wherein the loading pin arrangement has a loading pin, which is slidable by means of a loading pin actuator arrangement in the direction of the joining element holding device. The loading pin arrangement is here designed to variably establish a loading pin stroke of the loading pin between at least two stages, so that in a first stage the loading pin is displaceable less far in the direction of the joining element holding device than in a second stage. | ||||||
| 158 | Method of manufacturing electronic device, electronic apparatus, and mobile apparatus | US14031663 | 2013-09-19 | US09660176B2 | 2017-05-23 | Hideo Miyasaka |
| A method of manufacturing an electronic device including an electronic element, a base substrate, and a lid member, includes joining the lid member to the sealing part by application of an energy beam so that a plate thickness of the lid member may be larger in a part joined to the sealing part than in a part located inside of the part in a plan view along the thickness direction. | ||||||
| 159 | Electronic component mounting system, electronic component mounting method, and electronic component mounting machine | US14952639 | 2015-11-25 | US09572295B2 | 2017-02-14 | Naoki Azuma; Masayuki Kuwabara |
| In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder. | ||||||
| 160 | Apparatus of mounting and removing component, method of mounting component and method of removing component | US13754351 | 2013-01-30 | US09517520B2 | 2016-12-13 | Yasuyuki Kusakabe; Tooru Harada |
| An apparatus for mounting and removing a component includes: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source. | ||||||
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