子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 81 | JPH0374013B2 - | JP13006984 | 1984-06-26 | JPH0374013B2 | 1991-11-25 | |
| 82 | Structure of air-core coil bobbin | JP23457883 | 1983-12-12 | JPS60124905A | 1985-07-04 | YAJIMA NOBORU; YAMAUCHI KAZUYOSHI |
| PURPOSE:To facilitate a control operation by forming integrally a winding terminal and a bobbin connecting terminal in each of air-core coil bobbins and adhering the terminals with flanges of the bobbins applied to each other. CONSTITUTION:Two bobbins 1 wound with coils 3 are stacked, and respective winding terminals 2 and 2 and respective bobbin connecting terminals 5 and 5 of the first and second bobbins are soldered respectively to each other. The terminals 2 and 5 of the second bobbin are connected in short circuit. In an air-core coil bobbin constituted in this way, inductance can be easily increased or decreased for modification of the circuit by modifying the connection between the terminals 2 and 5 without removing the bobbin from a printed-circuit board. Further, the bobbin, if provided with a control core, can be easily controlled finely. | ||||||
| 83 | Inductance element | JP4823280 | 1980-04-11 | JPS56144508A | 1981-11-10 | IKEDA YASUICHI |
| PURPOSE:To give no thermal damage to externally mounted parts around an element at the time of mounting the element by mounting an air core coil on a substrate for mounting having through holes and electrodes at opposite end sections to compose the element and the element is soldered to a wiring substrate. CONSTITUTION:Through holes 11a, 11b and electrodes 12a, 12b are provided at the opposite end sections of an insulating board to compose a substrate 11 for mounting. The terminals of an air core coil 10 are inserted in the through holes 11a, 11b to compose an element by soldering by dip process. The electrodes 12a, 12b of the element are closely contacted with the wiring layers 3a, 3b of a wiring substrate 2 such as a hybrid integrated circuit or the like. For example, after fixing the electrodes 12a, 12b by adhesive, the electrodes 12a, 12b are soldered by a reflow furnace. In this way, soldering by hand work becomes unnecessary to improve workability and thermal damage will not be given to externally mounted parts around the element. Furthermore, the preparation of a plurality of elements will easily be done by using the insulating board arranged a plurality of substrates for mounting in matrix shape through a snap line and by splitting the substrates after the dip process. | ||||||
| 84 | ROLLED IRON CORE TRACTION TRANSFORMER | EP15798885 | 2015-04-20 | EP3151256A4 | 2018-01-10 | GAO SHIBIN; WANG BAOGUO; WU ZHIQIANG; GAO MINDONG |
| A rolled iron core traction transformer, comprising an iron core (1); the iron core (1) is formed by splicing two symmetrical annealed iron-core closed single frame (1-1) ; each iron-core closed single frame (1-1) is formed by sequentially coiling continuous silicon steel sheets; the iron-core closed single frame (1-1) has two iron-core column single bodies (1-1-1),which having approximately semicircular cross sections; the iron core (1) has two iron-core columns (1-2), which have approximately circular cross section, thereon formed by splicing two iron-core column single bodies (1-1-1) ; each iron-core column (1-2) is sequentially provided with a low-voltage T winding (6), a low voltage F winding (5) and a high-voltage winding (4) thereon from inside to outside; two sides of each high-voltage winding (4) are respectively provided with a first tapping area and a second tapping area, the first tapping area is provided with low-voltage side high-voltage tapping outgoing lines (16), the second tapping area is provided with high-voltage side high-voltage tapping outgoing lines (18), two low-voltage side high-voltage tapping outgoing lines (16) are connected together with a no-load voltage regulation switch (9), and two high-voltage side high-voltage tapping outgoing lines (18) are connected together with another no-load voltage regulation switch (9).The transformer has a significant the improvement such as a reduced no-load loss, a reduced no-load current, lower noise , stronger anti-short circuitcapability, a reduced electrodynamic force generated by a sudden short circuit, and a improvement of the short circuit tolerance capability of the transformer. | ||||||
| 85 | IMPEDANCE MATCHING ELEMENT | EP11786518 | 2011-05-16 | EP2579459A4 | 2016-11-16 | HIRAI TAKAMI; NAMERIKAWA MASAHIKO; YANO SHINSUKE |
| 86 | SPULENANORDNUNG ZUM ERZEUGEN EINES ROTIERENDEN ELEKTROMAGNETISCHEN FELDS UND ORTUNGSSYSTEM ZUM BESTIMMEN EINER POSITION EINES IDENTIFIKATIONSGEBERS | EP13753653.8 | 2013-08-30 | EP2891162A1 | 2015-07-08 | ETTE, Bernd; HOLLDACK, Bernhard |
| Various embodiments relate to a coil arrangement (200) for generating a rotating electromagnetic field, comprising at least three coils (210a, 210b, 210c), each having at least one associated coil winding (212a-212f). The coil arrangement further comprises a ferromagnetic coil yoke (211) which establishes a magnetic coupling between the at least three coils. | ||||||
| 87 | ELECTRONIC CIRCUIT CHIP AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT CHIP | EP11814485.6 | 2011-07-26 | EP2584571A1 | 2013-04-24 | KIKUKAWA Naohiro |
An electric circuit chip includes: a substrate made of glass or a semiconductor; and a circuit which is disposed in an inside of the substrate, has a first end portion and a second end portion exposed at specific surfaces of the substrate, and includes a spiral inductor. |
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| 88 | PRINTED MULTILAYER SOLENOID DELAY LINE | EP06844653 | 2006-11-30 | EP1955343A4 | 2009-07-22 | |
| A printed solenoid inductor delay line system comprises discrete delay sections, where the inductor is implemented in the form of a printed, spiraling solenoid, with the solenoid axis in the plane of the multi-layer printed circuit board (PCB). | ||||||
| 89 | SEMICONDUCTOR DEVICE, AND METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE | EP01915661 | 2001-03-21 | EP1347474A4 | 2009-05-06 | KYOGOKU TOSHIHIKO; KODU TADASHI; MOCHIDUKI KIYOHARU; KIKUCHI SAKAE; ISHIDU AKIO; KOBAYASHI YOSHIHIKO; MARUYAMA MASASHI; KOJIRO IWAMICHI; SATO SUSUMU |
| A high-frequency power amplification device comprises two amplifier systems including a plurality of cascaded amplification stages and two supply voltage terminals. The first supply voltage terminal is connected to the front amplification stage of the first amplifier system and to the second and succeeding amplification stages of the second amplification system. The second supply voltage terminal is connected to the front amplification stage of the second amplification system and to the second and succeeding amplification stages of the first amplification system. Small air-core coils of low DC resistance formed of a dense spiral of copper wire of 0.1 mm diameter are connected in series between the final amplification stage of each amplification system and each supply voltage terminal. A preferable oscillation margin is achieved from the fact that each amplification system prevents the leakage of the signal from the final amplification stage to the front amplification stage and that the DC resistances of the air-core coils are small. Air-core coils are inexpensive, and the high-frequency power amplification device is thus manufactured at reduced costs. Air-core coils are mounted on a module substrate using a bulk feeder. | ||||||
| 90 | PRINTED MULTILAYER SOLENOID DELAY LINE | EP06844653.3 | 2006-11-30 | EP1955343A2 | 2008-08-13 | The designation of the inventor has not yet been filed |
| A printed solenoid inductor delay line system comprises discrete delay sections, where the inductor is implemented in the form of a printed, spiraling solenoid, with the solenoid axis in the plane of the multi-layer printed circuit board (PCB). | ||||||
| 91 | COMPACT IMPEDANCE TRANSFORMATION CIRCUIT | EP04744561.4 | 2004-07-13 | EP1652198A1 | 2006-05-03 | BLEDNOV, Igor, I. |
| The present invention relates to an impedance transformation circuit (I10; 11 a; 11 b; 12) with a first contact pad (51) and a second contact pad (52) being spaced-apart and formed on a substrate (20). The impedance transformation circuit comprises at least first circuit element (40) providing a contact area (41) formed on the substrate (20) which is arranged adjacent and between the first (51) and the second (52) contact pad. A first 'Wire element (31) extends over the substrate (20) connecting the first contact pad (51) and a first end portion (41 a) of the contact area of the first circuit element (40), whilst at least a second wire element (32) extends over the substrate (20) connecting the second contact pad (52) and a second end portion (41b) of the contact area of the first circuit element (40). The contact area of the first circuit element (40) is shaped such that it is provided a capacitive connection with a predetermined capacitance between the contact area and a fixed reference poteitial. The packing density of the whole circuit can advantageously be increased by having tibe first wire element (31) and the at least second wire element (32) the same shape and having them arranged substantially in parallel to each other and further, by having the first contact's pad (51) and the second contact pad (52) located at opposite sides of the contact area of the at least first circuit element (40). Multiple impedance transformation circuits according to the invention can advantageously combined to a multi-coupled wire impedance transformation circuit (12). | ||||||
| 92 | Low-loss inductor device and fabrication method thereof | EP05014684.4 | 2005-07-06 | EP1619697A2 | 2006-01-25 | Lee, Moon-chul; Choi, Hyung |
An inductor device having an improved quality factor is provided. To obtain the improved quality factor, the inductor device includes a substrate etched away at predetermined intervals; first and second inductors formed on the top and bottom of the substrate, respectively; and first and second protection packages for shielding the first and second inductors, respectively, from outside. The first and second inductors are formed in a symmetrical structure with respect to the substrate, and the inductor device further includes connection parts for electrically connecting the first and second inductors. Further, the inductor device has air gaps between the substrate, first inductor, and second inductor in order for the first and second inductors to be exposed in the air, and the first protection package has an electrode layer formed thereon at predetermined positions to supply electric currents to the inductor device.
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| 93 | COIL FILTER AND METHOD FOR MANUFACTURING THE SAME | EP01978925 | 2001-10-25 | EP1403887A4 | 2004-09-29 | KOMIYA KUNIFUMI |
| A coil filter suitable for automatic surface mounting on an electronic circuit board and realizing a wide band isolation excellent in high frequency characteristics without requiring a significant consideration of the mutual arrangement of parts. In the filter for blocking an electromagnetic wave or a high frequency signal propagating while being superposed on the DC power supply or the signal of an electronic apparatus, e.g. an electronic circuit board, conductor wires are bonded electrically at the coil end part such that the conductor wire part wound by one turn or more constitutes a short ring (1b) conducting in ring shape on the opposite sides of an intermediate part (1a) where electrically insulated conductor wires are coiled and the end part (1c) of the conductor wire is located on the inner side of the outermost circumferential part of the coil−shaped end face. | ||||||
| 94 | PHOTOLITHOGRAPHICALLY-PATTERNED OUT-OF-PLANE COIL STRUCTURES AND METHOD OF MAKING | EP01935209.5 | 2001-05-10 | EP1301827A1 | 2003-04-16 | CHUA, Christopher, L.; LEMMI, Francesco; VAN SCHUYLENBERGH, Koenraad, F.; LU, Jeng, Ping; FORK, David, K.; PEETERS, Eric; SUN, Decai; SMITH, Donald, L.; ROMANO, Linda, T. |
| An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers. | ||||||
| 95 | ELEKTRISCHES BAUTEIL, INSBESONDERE SPULE, VORZUGSWEISE FÜR SMD-MONTAGETECHNIK | EP95941585.2 | 1995-12-15 | EP0799487B1 | 1999-07-14 | Hagn, Erwin |
| The invention concerns an electric component which is in particular in the form of a coil and is preferably provided for an SMD assembly technique. In order to facilitate assembly, a mass point (4) is applied to one face of the component, in particular the top thereof, this mass point having a flat surface and not projecting laterally beyond the component. | ||||||
| 96 | AUTOMATED METHOD FOR THE MANUFACTURE OF TRANSPONDER DEVICES | EP91910963 | 1991-05-24 | EP0531426A4 | 1993-06-30 | ZIRBES, GLEN, LEO; HADDEN, LEONARD, D.; TROYK, PHILIP, R. |
| An improved automated method for the manufacture of alternatively sized passive transponder devices is presented which utilizes a single leadframe design and manufacturing process, including automated coil winding and wire-to-lead termination. A specially designed leadframe (10) is prepared, with augmented leads (14, 16), and is coated with a thin layer of silver. One or more semiconductor chips (33, 35, 37) are bonded to individual assembly sites (32, 34, 36) on the leadframe, after which the lead-die assembly is encapsulated by transfer molding. The cap (41) and leads (14, 16) are singulated, and a bobbin (44) is attached to the leads, which extend laterally from each individual molded cap. In an automated process, a conductive wire (45) is attached to a first of the protruding leads, fly-wound around the bobbin core, and terminated by connection to a second of the protruding leads. | ||||||
| 97 | AUTOMATED METHOD FOR THE MANUFACTURE OF TRANSPONDER DEVICES | EP91910963.0 | 1991-05-24 | EP0531426A1 | 1993-03-17 | ZIRBES, Glen, Leo; HADDEN, Leonard, D.; TROYK, Philip, R. |
| Procédé automatisé amélioré pour la fabrication de répondeurs passifs de différentes dimensions, utilisant une seule figure de cadre de montage. Le procédé de fabrication comporte notamment un bobinage et une terminaison câble-fils automatisés. Un cadre de montage de conception spéciale (10) est préparé, avec des fils agrandis (14, 16), et le tout est revêtu d'une fine couche d'argent. Une ou plusieurs puces à semi-conducteurs (33, 35, 37) sont reliées à des emplacements de montage individuels (32, 34, 36) sur le cadre de montage, puis l'ensemble fils-dé est encapsulé par moulage par transfert. Le capuchon (41) et les fils (14, 16) sont séparés et une bobine (44) est fixée aux fils, qui s'étendent latéralement à partir de chaque capuchon moulé. Dans un procédé automatisé, un câble conducteur (45) est fixé à un premier fil sortant du capuchon, enroulé par volant d'inertie autour du noyau de la bobine, et terminé par connexion à un autre fil sortant du capuchon. | ||||||
| 98 | コイルデバイスおよび電子デバイス | JP2017504989 | 2016-02-29 | JP6380648B2 | 2018-08-29 | 加藤 登; 小澤 真大 |
| 99 | 平面コイル素子及び平面コイル素子の製造方法 | JP2017506486 | 2016-03-10 | JPWO2016147993A1 | 2017-12-21 | 上田 宏; 上田 宏; 宏介 三浦; 賀人 山口; 由佳 卜部 |
| 本発明の平面コイル素子は、第一の面および第一の面とは反対側の第二の面を有する絶縁性ベースフィルムと、この絶縁性ベースフィルムの第一の面の面側に積層される第一導電パターンと、この第一導電パターンを第一の面側から被覆する第一絶縁層とを備える平面コイル素子であって、上記第一導電パターンが、芯体と、この芯体の外面にメッキにより積層される拡幅層とを有し、上記第一導電パターンの平均厚みの第一導電パターンの平均回路ピッチに対する比が1/2以上5以下である。 | ||||||
| 100 | インピーダンス整合素子 | JP2012517221 | 2011-05-16 | JPWO2011148819A1 | 2013-07-25 | 隆己 平井; 滑川 政彦; 政彦 滑川; 信介 矢野 |
| 本発明は、品質のばらつきが小さく、大電流耐性を有する、小型インピーダンス整合素子を提供することを目的とする。上記目的は、第1の誘電体材料D1の内部に埋設若しくは表面に形成された配線用導体パターンを含んでなる配線部と、前記第1の誘電体材料D1の内部に埋設若しくは表面に形成されたインダクタ用導体パターンを含んでなるインダクタ部L4及びL5、又は少なくとも一対のコンデンサ用導体パターンCC1と、当該コンデンサ用導体パターンの対の間に介在する、第1の誘電体材料D1よりも高い誘電率を有する第2の誘電体材料D2とを含んでなるコンデンサ部C1、のいずれかあるいは両方と、を備えるインピーダンス整合素子であって、前記配線用導体パターン及びインダクタ用導体パターンの厚みが20μm以上である、インピーダンス整合素子によって達成される。【選択図】図2 | ||||||
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