| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 电子部件 | CN201410025768.4 | 2014-01-20 | CN104021914A | 2014-09-03 | 桥本良太; 下江一伸 |
| 本发明的目的在于提供一种能够使电子部件的卷芯部的绕线的匝数增加的电子部件。电子部件1A具备芯体（12）、绕线（20）以及外部电极（22）。芯体（12）包括：沿轴向延伸的卷芯部（14）、以及设置于卷芯部（14）的轴向的一端且从卷芯部（14）朝向与轴向正交的正交方向中的至少第一方向伸出的第一凸缘部（16A）。绕线（20）被卷绕于卷芯部（14）。外部电极（22）设置于第一凸缘部（16A）中的位于所述正交方向的侧面（S1），且与所述绕线（20）连接。在从所述第一方向观察时，与同绕线（20）交叉的第一凸缘部（16A）的第一外缘（L1）相切的向量α具有所述轴向的成分。 | ||||||
| 2 | 一种宽频带高稳定高频电感器 | CN201710892285.8 | 2017-09-27 | CN107464654A | 2017-12-12 | 梁琼崇 |
| 本发明提供了一种宽频带高稳定高频电感器，它包括金属屏蔽盒、带BNC接头面板、电感芯和两片连接件，所述电感芯安装在带BNC接头面板上，所述两片连接件与带BNC接头面板连接并置于金属屏蔽盒中，其特征在于，所述电感芯包括电感器、防潮筒和高频蜡，所述电感器放置在防潮筒中，并浇灌高频蜡形成电感芯；本发明提供的一种宽频带高稳定高频电感器采用全封闭结构，屏蔽外部电磁干扰，电感芯使用螺纹筒结构，保证了较高的稳定性，采用防潮筒结构，灌注高频蜡，保证了很低的湿度系数，并采用最佳的长宽比，使可用频率达30MHz，满足了计量校准的要求。 | ||||||
| 3 | Wire wound-type inductor | US15371575 | 2016-12-07 | US09685268B1 | 2017-06-20 | Masashi Miyamoto |
| A wire wound-type inductor is a chip type and includes a core including a winding core part having a substantially taper-shaped portion and flange portions, a winding wire that is coated with an electrically insulating coating film, terminal electrodes to which respective end portions of the winding wire are connected, and a resistive conductor containing conductive powder. The core is made of ceramics and the resistive conductor is arranged so as to cover at least a part of the surrounding of an outer side portion of the winding wire. | ||||||
| 4 | COUPLED DISCRETE INDUCTOR WITH FLUX CONCENTRATION USING HIGH PERMEABLE MATERIAL | US13791113 | 2013-03-08 | US20140253279A1 | 2014-09-11 | James Thomas Doyle; Amirali Shayan Arani; Farsheed Mahmoudi |
| Some implementations provide a coupled inductor structure that includes a first discrete inductor configured to generate a magnetic field, a second discrete inductor, and a first ferromagnetic layer coupled to the first discrete inductor and the second discrete inductor. The first ferromagnetic layer is configured to concentrate the magnetic field generated by the first discrete inductor within the coupled inductor structure. In some implementations, the coupled inductor structure further includes a second ferromagnetic layer coupled to the first discrete inductor and the second discrete inductor. The second ferromagnetic layer is configured to concentrate the magnetic field generated by the first discrete inductor within the coupled inductor structure. In some implementations, the coupled inductor structure is a bifilar inductor structure. The first discrete inductor includes a first set of windings and the second discrete inductor includes a second set of windings. The first and second discrete inductors share a common core. | ||||||
| 5 | Sensor assembly, transformers and methods of manufacture | US11528236 | 2006-09-27 | US20080072681A1 | 2008-03-27 | James Anthony Ruud; Emad Andarawis Andarawis; Samhita Dasgupta; Minesh Ashok Shah; Mahadevan Balasubramaniam |
| A sensor assembly is provided. The sensor assembly includes a sensor configured to measure an impedance value representative of a sensed parameter and a transformer coupled to the sensor. The transformer includes at least one ceramic substrate and at least one electrically conductive line disposed on the ceramic substrate to form at least one winding. The electrically conductive line includes an electrically conductive material. | ||||||
| 6 | Method for producing an inductor | US09610151 | 2000-07-05 | US06560851B1 | 2003-05-13 | Takahiro Yamamoto; Tadashi Morimoto |
| A method for producing an inductor having an internal conductor includes coating an internal conductor with a covering material, placing the internal conductor coated with the covering material in a shaping mold, and filling a material around the internal conductor so as to form a compact unbaked chip element with the internal conductor provided at a predetermined position. The unbaked chip element is then baked in order to eliminate the covering material so as to form a gap around the internal conductor. | ||||||
| 7 | Inductance coil | US71143746 | 1946-11-21 | US2509049A | 1950-05-23 | WHITE SIDNEY Y |
| 8 | MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS | US13027150 | 2011-02-14 | US20110131798A1 | 2011-06-09 | Alexandros Papavasiliou; Jeffrey F. DeNatale; Philip A. Stupar; Robert L. Borwick, III |
| The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral. | ||||||
| 9 | MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS | US12398942 | 2009-03-05 | US20100225436A1 | 2010-09-09 | Alexandros Papavasiliou; Jeffrey F. DeNatale; Philip A. Stupar; Robert L. Borwick, III |
| The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral. | ||||||
| 10 | Sensor assembly, transformers and methods of manufacture | US11528236 | 2006-09-27 | US07404331B2 | 2008-07-29 | James Anthony Ruud; Emad Andarawis Andarawis; Samhita Dasgupta; Minesh Ashok Shah; Mahadevan Balasubramaniam |
| A sensor assembly is provided. The sensor assembly includes a sensor configured to measure an impedance value representative of a sensed parameter and a transformer coupled to the sensor. The transformer includes at least one ceramic substrate and at least one electrically conductive line disposed on the ceramic substrate to form at least one winding. The electrically conductive line includes an electrically conductive material. | ||||||
| 11 | LC composite component | US11062698 | 2005-02-23 | US20050184829A1 | 2005-08-25 | Masahiro Yoshimoto; Hiroshi Fujita; Nobuaki Nagai; Tokuji Nishino; Shinichirou Kaneko |
| The LC composite component of the present invention comprises a base, a first to third terminals provided on the base, a helical conductor provided on the base, and an internal layer conductor inside the base, the internal layer conductor being opposed to the helical conductor provided on the base, each of the first to third terminals being mutually and electrically noncontinuous, the helical conductor being provided in either position between the first to third terminals. A high-pass filter is thus realized. The component can be used for various devices that require a reduction in size and cost of the electronic device while ensuring the filter performance. | ||||||
| 12 | Inductor and production method thereof | US139745 | 1998-08-25 | US6104272A | 2000-08-15 | Takahiro Yamamoto; Tadashi Morimoto |
| The present invention provides a system and method for producing a reliable inductor having an internal conductor with a small electric resistance. A metal wire formed in a nonlinear shape is used as the internal conductor. In an exemplary embodiment of the invention, the internal conductor has a coil-like shape with portions adjacent to each other with respect to the axial direction of the coil being positioned in a substantially cylindrical gap formed in the axial direction of the coil. By providing a gap around the internal conductor, stress between the internal conductor and a ceramic material surrounding the conductor can be eliminated. As a result, the characteristic deterioration or crack generation in the inductor chip is eliminated. Moreover, the leakage flux among the coil pitches of the conductor is reduced, thereby improving the characteristics of the inductor. | ||||||
| 13 | Inductance coil with ceramic form for high frequency | US11961949 | 1949-10-05 | US2583854A | 1952-01-29 | GEORG KEHBEL HEINZ |
| 14 | COMMON MODE CHOKE COIL | US15371703 | 2016-12-07 | US20170169935A1 | 2017-06-15 | Masashi MIYAMOTO; Shigeto YAMAMOTO; Kentaro YAMAGUCHI |
| A common mode choke coil includes a core having a winding core part and a first and second wire wound around the winding core part. The winding core part has a first winding region, a switching region and second winding regions in this order along the axis of the winding core part. In the first winding region, each turn of the first wire is located closer to a first end portion of the winding core part than the corresponding same-numbered turn of the second wire. In the second winding region, each turn of the first wire is located closer to a second end portion of the winding core part than the corresponding same-numbered turn of the second wire. The number of turns of the first and second wires in the first winding region differs from the number of turns of the first and second wires in the second winding region. | ||||||
| 15 | WIRE WOUND-TYPE INDUCTOR | US15371575 | 2016-12-07 | US20170169927A1 | 2017-06-15 | Masashi MIYAMOTO |
| A wire wound-type inductor is a chip type and includes a core including a winding core part having a substantially taper-shaped portion and flange portions, a winding wire that is coated with an electrically insulating coating film, terminal electrodes to which respective end portions of the winding wire are connected, and a resistive conductor containing conductive powder. The core is made of ceramics and the resistive conductor is arranged so as to cover at least a part of the surrounding of an outer side portion of the winding wire. | ||||||
| 16 | Microfabricated inductors with through-wafer vias | US13027150 | 2011-02-14 | US08826514B2 | 2014-09-09 | Alexandros Papavasiliou; Jeffrey F. DeNatale; Philip A. Stupar; Robert L. Borwick, III |
| Microfabricated inductors with through-wafer vias and including a first wafer and a second wafer, each wafer having a plurality of metal fillings therein, and a plurality of metal conductors connecting the plurality of metal fillings together to form a spiral. A method for producing an inductor including steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral, performing the foregoing steps similarly on a second substrate formed with a second plurality of vias filled with a second plurality of metal fillings, and bonding the first substrate with the second substrate. | ||||||
| 17 | ELECTRONIC COMPONENT | US14151738 | 2014-01-09 | US20140247105A1 | 2014-09-04 | Ryota HASHIMOTO; Kazunobu SHIMOE |
| An electronic component having a core including a winding base extending in an axial direction. A first flange is located at an end in the axial direction and having at least one first protruded side surface, which is protruded from the winding base, at least at an end in a first direction, which is one of perpendicular directions that are perpendicular to the axial direction. A wire is wound around the winding base. A first external electrode is connected to the wire and is provided on a side surface of the first flange located at an end in one of the perpendicular directions. A first outer edge of the first flange crosses the wire when viewed from the first direction has a vector having a component in the axial direction. | ||||||
| 18 | Chip electronic part | US921508 | 1997-09-02 | US5973390A | 1999-10-26 | Keishiro Amaya; Kenichi Aoki |
| The present invention is a chip electronic part having: a ceramic member; a conductor pattern formed on the surface of the ceramic member; an insulating protective layer formed on the conductor pattern; an external electrode which is formed at least one end face of the ceramic member, electrically connected to the conductor pattern, and composed of an undercoating layer formed by dry plating and at least one plating layer formed by wet plating; and at least one groove formed near an end face of the insulating protective layer so as to limit the formation of the undercoating layer. | ||||||
| 19 | Noise filter | US64838 | 1993-05-19 | US5357226A | 1994-10-18 | Takahiro Azuma |
| A noise filter 11 of the CR type in which electrodes 17a and 17b and electrodes 17d and 17e are formed on the outer surface of a collar portion 15 in a bobbin 12 composed of a dielectric body, recess portions 15c and 15d are respectively formed between the electrodes 17a and 17b and between the electrodes 17d and 17e, and resistance films 18a and 18b are respectively formed along the recess portions 15c and 15d. To form a noise filter of the LCR type, a coil 14 is formed on the bobbin 12 and connected to the electrodes 17b and 17d via electrodes 13a and 13b, respectively. | ||||||
| 20 | Inductance coil for radio frequencies | US19887727 | 1927-06-15 | US1825105A | 1931-09-29 | EMMONS TERMAN FREDERICK |
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