子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 61 | Broadband stop filter | JP2001398563 | 2001-12-27 | JP2003198305A | 2003-07-11 | KOMIYA KUNIFUMI |
| PROBLEM TO BE SOLVED: To provide a broadband stop filter which cuts off a harmonic noise ranging from kHz band to dozens of GHz band. SOLUTION: A band cut-off filter cuts off predetermined band width for harmonic noise superimposed on a direct current power source of electronics devices. In order to realize high density mounting in which effect of magnetic flux between adjacent inductors is small, a plurality of inductors in which conductors are wound in a coil shape, mounting electrodes are used commonly, electrically short-circuited rings are provided on the both ends, and their self resonance point are different, are connected in series and capacitors are grounded in each connection point of the inductors. COPYRIGHT: (C)2003,JPO | ||||||
| 62 | Automatic method of manufacturing a transponder device | JP51084791 | 1991-05-24 | JP2639456B2 | 1997-08-13 | JIRUBESU GUREN REO; HETSUDEN REONARUDO DEI; TOROIKU FUIRITSUPU AARU |
| 63 | High frequency coil | JP5676885 | 1985-03-20 | JPS61216309A | 1986-09-26 | NISHIMURA SEIICHI |
| PURPOSE:To secure the terminal holding strength of the titled coil without reducing the quantity of winding by a method wherein the outside diameter of a terminal plate is formed same as that of a bobbin. CONSTITUTION:The effective utilization of the winding part of the title coil can be made possible by unnecessitating to entirely distinguish them when a winding work is performed by forming a terminal plate part 5a and a bobbin 1 in the same outside diameter. Also, if the number of winding on the terminal plate is same as that of the bobbin, the entire coil can be made thinner in the amount of thickness of the terminal plate part than the conventional one, and the number of winding can be increased on the contrary to the above, if the measurements of the two are the same. | ||||||
| 64 | Spiral conductor laminated electric winding and manufacture of the same | JP10503883 | 1983-06-14 | JPS59231804A | 1984-12-26 | UETSUHARA TSUNEO |
| PURPOSE:To obtain a small size lightweight electric winding with a large conductor space factor and a high efficiency by a method wherein a plurality of unit windings, composed of rectangular conductors wound into a spiral shape with insulators between winding layers, are laminated on the same axis with their directions of spiral reversed alternately and the unit windings are connected in series. CONSTITUTION:An insulated conductor 2 is wound around, for instance, a circumference of a cylindrical frame with an adhesive between layers into a spiral shape to form a hollow cylinder. The hollow cylinder is cut by a plane perpendicular to the cylinder axis into rectangular spiral conductor unit windings 1 of a prescribed thickness. A plurality of these spiral conductor unit windings are laminated on the same axis with their directions of spiral reversed alternately and adjacent outside ends and adjacent inside ends of the unit winding spiral conductors are connected reciprocally. With this constitution, a small size lightweight electrical winding with a large space factor and a high efficiency can be obtained. | ||||||
| 65 | Chip type high frequency coil | JP3286482 | 1982-03-01 | JPS58148412A | 1983-09-03 | MATSUMURA KATSUMI; OOTANI YOSHIAKI |
| PURPOSE:To obtain a high frequency coil simple in construction with a wide range of capacitance available, excellent temperature characteristics, etc. by using a chip capacitor itself. CONSTITUTION:The dielectric 2 of a chip capacitor was covered with synthetic resin and made into a bobbin 4. A coil 5 was formed by winding copper wire on the bobbin. The ends of the coil 5 were connected to the external electrode 1 of the chip capacitor. Numeral 6 indicates grooves 6 for coil lead wiring provided at both the ends of the bobbin made of the resin to prevent the disconnection of the coil. This construction makes it possible to obtain a chip type high frequency coil compact in size and readily prepared, with a wide range of capacitance available because of the chip capacitor, excellent temperature characteristics, high performance, and easily handled. Moreover, since the bobbin is provided on the dielectric only of the chip capacitor, the external electrode of the chip capacitor is left in tier and can be used as the electrode of the coil. | ||||||
| 66 | 車両用巻鉄芯主変圧器 | JP2016559222 | 2015-04-20 | JP6422994B2 | 2018-11-14 | 高 仕斌; 王 保国; 呉 志強; 高 旻東 |
| 67 | coil | JP2010182794 | 2010-08-18 | JP5534442B2 | 2014-07-02 | 修一 菊地; 文仁 目黒; 佳之 畑山 |
| 68 | 電子回路チップ、及び電子回路チップの製造方法 | JP2012527667 | 2011-07-26 | JPWO2012017857A1 | 2013-10-03 | 直博 菊川 |
| この電子回路チップは、ガラス又は半導体からなる基体と;前記基体の内部に配され、第1端部と第2端部がそれぞれ前記基体の特定面に露呈され、螺旋状のインダクタを含む回路と;を備える。 | ||||||
| 69 | Three-dimensional coil structure by photolithographic patterning | JP2001584945 | 2001-05-10 | JP4813739B2 | 2011-11-09 | シュイレンバーグ コーエンラード エフ ヴァン; ディケイ サン; ドナルド エル スミス; クリストファー エル チュア; エリック ピーターズ; デイビッド ケイ フォーク; ジェン ピン ルウ; フランチェスコ レミ; リンダ ティー ロマノ |
| An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers. | ||||||
| 70 | coil | JP2010182794 | 2010-08-18 | JP2011103439A | 2011-05-26 | KIKUCHI SHUICHI; MEGURO FUMIHITO; HATAYAMA YOSHIYUKI |
| <P>PROBLEM TO BE SOLVED: To provide a coil in which one of a winding start end and a winding completion end of a coil winding wire is wound from an inner circumferential side toward an outer circumferential side and the other end of the winding start end and the winding completion end of the coil winding wire is drawn forth from the inner circumferential side to the outer circumferential side, wherein a significant increase in a winding height at crossing portions of the winding start end-side winding wire and the winding completion end-side winding wire compared to a winding height in other portions is prevented. <P>SOLUTION: In the winding wire 1 at the winding completion end side, two wires are piled up vertically and wound together from the inner circumferential side towards the outer circumferential side. The winding wire 1 at the winding start end side that has remained on the inner circumferential side is drawn forth from the inner circumferential side to the outer circumferential side so as to form a curve along the end surface 3 of the coil 10. In the crossing portions 4 of the winding wire 1 at the winding completion end side and the winding wire 1 at the winding start end side, the two wires of each winding wire 1 are superimposed and caused to cross each other in a state in which the wires are laid down transversely. <P>COPYRIGHT: (C)2011,JPO&INPIT | ||||||
| 71 | Wideband rejection filter | JP2001398563 | 2001-12-27 | JP4569885B2 | 2010-10-27 | 宮 邦 文 小 |
| 72 | Power transmission transformer of the non-contact power transmission apparatus | JP2007105526 | 2007-04-13 | JP4451463B2 | 2010-04-14 | 秀樹 小島 |
| The present invention provides a power transmission transformer of which workability in implementing and reliability of connection are considered in a noncontact power transfer device using individual self-oscillation circuits. The power transmission transformer for a noncontact power transfer device including a transmitting coil L 1 and a drive coil L 2 for self-oscillation on a power transmission device side includes a bobbin in which the transmitting coil and the drive coil L 2 are disposed, in which the transmitting coil and the drive coil L 2 are configured by an air-core coil using self-bonding wire, and the bobbin 1 includes a winder spindle 1 a, 1 b on both surfaces opposed to each other across a collar 2 formed of a flat plate, and a mating portion 3 for mating with an external portion in an end portion of the winder spindle 1 b, and the drive coil L 2 is mounted on the winder spindle 1 b and the transmitting coil L 1 is mounted on the other, opposed winder spindle 1 a across the collar. | ||||||
| 73 | Inductor and a method of manufacturing the same. | JP2005210618 | 2005-07-20 | JP4383392B2 | 2009-12-16 | ▲ヒョン▼ 崔; 文 ▲チョル▼ 李 |
| 74 | High inductance of the out-of-plane inductor | JP2009518208 | 2007-06-25 | JP2009543341A | 2009-12-03 | パラド，フラヴィオ |
| 例えばポリマー膜である平坦な可撓性ベースを、例えば熱を加えることによってカールさせると、導電素子も同様にカールされ、異なる導電素子の対向端部が導電接触状態にされ、少なくとも２つの導電素子を使用して導電コイルを形成するようなパターンで配置された導電素子を平坦な可撓性ベース上に形成することによって、高インダクタンスの面外インダクタが達成される。 出来上がった導電コイルに接続するためのワイヤとして機能するために可撓性ベース上に付加的なコンダクタを形成してもよい。 例えばコイルを越えて延在する可撓性ベースの部分は、例えばフリップフロップ実装の１つまたは複数のチップ、またはその他の構成部品がその上に取り付けられるベースとして機能することができる。 | ||||||
| 75 | Semiconductor device and method with wire bond inductor | JP2004535363 | 2002-09-10 | JP4255442B2 | 2009-04-15 | アンダーソン，ハロルド; ウェン，イェンティン; カーニー，フランシス; ナップ，ジェームズ; ンゴ，キャン |
| A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L50) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading. | ||||||
| 76 | High q value, low volume air core inductor | JP2008003771 | 2008-01-11 | JP2008177566A | 2008-07-31 | DE ROOIJ MICHAEL ANDREW; BURDICK WILLIAM EDWARD JR; ROSE JAMES W |
| <P>PROBLEM TO BE SOLVED: To provide an inductor that combines high Q value and/or lower volume to a predetermined inductance. <P>SOLUTION: A spirally wound inductor (58) has a tapered conductor (60). In the inductor, the height of the conductor (60) is increased from the lower position close to a center (68) of the inductor (58) to the higher position on an external edge portion of the inductor (58). Further, a spherical inductor (88) and a method of manufacturing the spherical inductor (88) are also provided. The spherical inductor includes a series of coils (96) each of which diameter is increased facing in a direction from each edge portion to the center thereof. <P>COPYRIGHT: (C)2008,JPO&INPIT | ||||||
| 77 | Coil structure, its manufacturing method, and semiconductor package | JP2005238936 | 2005-08-19 | JP2007053311A | 2007-03-01 | YAMAZAKI TOMOO; HORIKAWA YASUYOSHI |
| <P>PROBLEM TO BE SOLVED: To provide a chip coil which can contribute to miniaturization of a semiconductor device or the like, be used as a component of a coil only and readily control and increase an inductance value. <P>SOLUTION: The coil structure has a form of a chip, and comprises a rectangular base consisting of an insulating resin material and a coil having a solenoid structure wherein at least a part thereof is buried inside the base and adjacent coils are insulated by the base. The resin material comprises a magnetic filler, and the thickness is at most 50 μm. <P>COPYRIGHT: (C)2007,JPO&INPIT | ||||||
| 78 | Flat air core coil and its manufacturing method | JP2002340933 | 2002-11-25 | JP2004180367A | 2004-06-24 | ABE TATSUO; YASUKAWA JUNICHI |
| <P>PROBLEM TO BE SOLVED: To provide a flat air core coil improved in the electric insulation of the coil and prevented in deformation caused by the secondary heating of the coil. <P>SOLUTION: The flat air core coil comprises a first coil 8 wound with a flat copper wire and a second coil 9 wound with the flat copper wire in the reverse direction relative to the first coil 8. In the flat air core coil, the first coil 8 and the second coil 9 are electrically connected, and an insulating film 18 is interposed between the first coil and the second coil. <P>COPYRIGHT: (C)2004,JPO | ||||||
| 79 | Three-dimensional coil structure and manufacturing method according to the photolithographic patterning | JP2001584945 | 2001-05-10 | JP2003533897A | 2003-11-11 | シュイレンバーグ コーエンラード エフ ヴァン; ディケイ サン; ドナルド エル スミス; クリストファー エル チュア; エリック ピーターズ; デイビッド ケイ フォーク; ジェン ピン ルウ; フランチェスコ レミ; リンダ ティー ロマノ |
| (57)【要約】 高Ｑインダクタと変成器のオンチップ集積化に使用できる立体マイクロ構造は高アスペクト比の加工を必要とせずに磁界方向を基板（１４）面に平行に配置する。 フォトリソグラフィックパターン形成によるコイル構造は固有応力プロファイルを有する弾性部材（６１ａ）を含む。 この固有応力プロファイルはループ巻線（１４２）を形成する基板から自由部分（１１）を離して偏らせる。 アンカ部分（１２）は基板（１４）に固定されたままである。 この自由部分端部は半田付けやメッキにより基板（１４）に接続される第二アンカ部分（６１ｃ）になる。 一連の個々のコイル構造（１４０）はアンカ部分経由で接合されてインダクタと変成器を形成できる。 | ||||||
| 80 | JPH0462164B2 - | JP23302283 | 1983-12-09 | JPH0462164B2 | 1992-10-05 | HASHIMOTO KOZO; KORESAWA SABURO |
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