| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 41 | Coil | EP10179433.7 | 2010-09-24 | EP2312595A3 | 2013-04-24 | Kikuchi, Shuichi; Meguro, Fumihito; Hatayama, Yoshiyuki |
In the winding wire at the winding completion end side, two wires are piled up vertically and wound together from the inner circumferential side towards the outer circumferential side. The winding wire at the winding start end side that has remained on the inner circumferential side is drawn forth from the inner circumferential side to the outer circumferential side so as to form a curve along the flat surface of the coil. In the crossing portions of the winding wire at the winding completion end side and the winding wire at the winding start end side, the two wires of each winding wire are superimposed and caused to cross each other in a state in which the wires are laid down transversely.
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| 42 | Coil | EP10179433.7 | 2010-09-24 | EP2312595A2 | 2011-04-20 | Kikuchi, Shuichi; Meguro, Fumihito; Hatayama, Yoshiyuki |
In the winding wire at the winding completion end side, two wires are piled up vertically and wound together from the inner circumferential side towards the outer circumferential side. The winding wire at the winding start end side that has remained on the inner circumferential side is drawn forth from the inner circumferential side to the outer circumferential side so as to form a curve along the flat surface of the coil. In the crossing portions of the winding wire at the winding completion end side and the winding wire at the winding start end side, the two wires of each winding wire are superimposed and caused to cross each other in a state in which the wires are laid down transversely.
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| 43 | Photolithographically-patterned out-of-plane coil structures and method of making | EP06016933.1 | 2001-05-10 | EP1729174B1 | 2010-07-28 | Chua, Christopher L.; Lemmi, Francesco; Schuylenbergh, Koenraad F.; Lu, Jeng Ping; Fork, David K.; Peeters, Eric; Sun, Decai; Smith, Donald L.; Romano, Linda T. |
| An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers. | ||||||
| 44 | Inverter filter structure | EP08155266.3 | 2008-04-28 | EP2113928A1 | 2009-11-04 | Kinnunen, Henri; Mikkola, Juha |
An filter structure for an inverter, where the filter structure comprises at least one choke per phase (U, V, W) and each choke is an air-core choke. The air-core chokes of the structure are arranged on the same axis such that the magnetic axis of each air core choke corresponds to each other.
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| 45 | INDUCTIVE-SYSTEM | EP04737200.8 | 2004-06-28 | EP1647036B1 | 2007-11-21 | LIM, Kui Yong; LEE, Su Hwei |
| Inductive-systems (1,2) comprising a first part in the form of a printed coil (11,21) and a second part in the form of a non-printed coil (12,22) coupled serially to each other may have a relatively large inductive-value and still be relatively small in size. The nonprinted coil (12,22) comprises an air coil. The total inductance of the inductive-system (1,2) is substantially equal to an inductance of the printed coil (11,21) plus an inductance of the air coil plus a mutual inductance, which depends on an overlapping area between the printed coil (11,21) and the air coil. One end of the non-printed coil (12) is coupled to a center end of the printed coil (11), and the other end of the nonprinted coil (12) and an outer end of the printed coil (11) constitute ends of the inductive-system (1), to couple both coils (11,12) compactly. | ||||||
| 46 | Filtre passe-bande | EP06380182.3 | 2006-06-29 | EP1791140A1 | 2007-05-30 | Campo Pablos, Miguel Angel; San José Damboriena, Jesús María |
Filtre passe-bande, de ceux qui comprennent une inductance et une capacitance, se caractérisant par le fait qu'il présente une inductance variable, qui se compose d'une bobine hélicoïdale (1), d'un élément mobile (4) en contact avec la masse, ayant un déplacement à l'intérieur ou à l'extérieur de la bobine hélicoïdale (1), court-circuitant plus ou moins de spires de la bobine, en fonction de ce déplacement, de sorte que l'inductance varie avec le déplacement, et d'une capacitance fixe.
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| 47 | Photolithographically-patterned out-of-plane coil structures and method of making | EP06016933.1 | 2001-05-10 | EP1729174A1 | 2006-12-06 | Chua, Christopher L.; Lemmi, Francesco; Schuylenbergh, Koenraad F.; Lu, Jeng Ping; Fork, David K.; Peeters, Eric; Sun, Decai; Smith, Donald L.; Romano, Linda T. |
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
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| 48 | Spule für automatisierte Montage | EP01000072.7 | 2001-03-28 | EP1143461A1 | 2001-10-10 | Marbach, Detlef Horst, Philips Corp.Int.Prop.GmbH; van der Wijst, Henk, Philips Corp.Int.Prop.GmbH; Spee, Günther, Philips Corp.Int.Prop.GmbH |
Die vorliegende Erfindung betrifft eine Spule (1) mit mehreren Windungen (2). Die Erfindung zeichnet sich dadurch aus, dass die Windungen (2) magnetisches Material enthalten oder dass die Windungen (2) eine äußere Lage zur Führung eines elektrischen Stroms und im Innem magnetisches Material enthalten. |
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| 49 | ELEKTRISCHES BAUTEIL, INSBESONDERE SPULE, VORZUGSWEISE FÜR SMD-MONTAGETECHNIK | EP95941585.0 | 1995-12-15 | EP0799487A1 | 1997-10-08 | Hagn, Erwin |
| The invention concerns an electric component which is in particular in the form of a coil and is preferably provided for an SMD assembly technique. In order to facilitate assembly, a mass point (4) is applied to one face of the component, in particular the top thereof, this mass point having a flat surface and not projecting laterally beyond the component. | ||||||
| 50 | Elektronisches Bauteil, insbesondere für eine Chip-Induktivität | EP84115156.6 | 1984-12-11 | EP0157927B1 | 1989-03-22 | Autenrieth, Lothar, Ingenieur grad.; Marth, Kurt, Dilp.-Physiker; Schindler, Josef, Ingenieur |
| 51 | コイル部品 | JP2016194642 | 2016-09-30 | JP2018056524A | 2018-04-05 | 瀬在 勇司; 安原 克志 |
| 【課題】磁気飽和を抑制でき、直流重畳特性に優れるコイル部品を提供する。 【解決手段】磁性体粉末と樹脂とを有するコア部に円筒状空芯コイル部を埋設したコイル部品であって、空芯コイル部の外径をa1、内径をa2とし、巻回軸方向に垂直なコア部の面と空芯コイル部の端部との距離をhとした場合に、断面積SA1〜SA5のCV値が0.55以下である。SA1:コア部外周が形成する面積から空芯コイル部外周が形成する面積を引いた面積。SA2:下記式で表される面積。SA3:空芯コイル部内周が形成する面積。SA4:コア部外周が形成する面積から空芯コイル部外周が形成する面積を引いた面積の1/2とπa1h/2との和。SA5:空芯コイル部の内周が形成する面積の1/2とπa2h/2との和。 【選択図】なし |
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| 52 | 巻鉄芯車両用主変圧器 | JP2016559222 | 2015-04-20 | JP2017517871A | 2017-06-29 | 仕斌 高; 保国 王; 志強 呉; 旻東 高 |
| 【課題】巻鉄芯車両用主変圧器であり、アニール処理された二つの対称的な鉄芯閉口シングルフレーム1−1を接合して構成された鉄芯1を含む、そしてそれぞれの鉄芯閉口シングルフレーム1−1は順次に巻きつけられた連続的な珪素鋼板から構成され、同鉄芯閉口シングルフレーム1−1は二つの鉄芯柱単体1−1−1を接合して構成された断面が半円近似の鉄芯柱を有し、鉄芯1は二つの鉄芯柱単体1−1−1を接合して構成された断面が半円近似の鉄芯柱1−2を有し、前記のそれぞれの鉄芯柱1−2には中から外まで順次に低圧T巻線6、低圧F巻線5と高圧巻線4が設置され、それぞれ高圧巻線4の両側に第一分接合区と第二分接合区が設置され、第一分接合区に低圧側高圧引き出し線16が敷設され、第二分接合区に高圧側高圧引き出し線18が敷設され、低圧両側高圧引き出し線16は無負荷電圧調整スイッチ9を通じて接続して、高圧両側高圧引き出し線18は別の無負荷電圧調整スイッチを通じて接続する。【解決手段】同変圧器は無負荷損失を減らし、無負荷電流を抑え、騒音を抑え、抗短絡が強くなっているばかりでなく、さらに突然短絡が発生する時の電気的変動を低下させ、変圧器の抗短絡能力を向上させることが出来る。【選択図】図2 | ||||||
| 53 | Coupled inductor to facilitate integrated power delivery | JP2012053192 | 2012-03-09 | JP2012216784A | 2012-11-08 | NICHOLAS P COWLEY; ISAAC ALI; STEPHEN J SPINKS |
| PROBLEM TO BE SOLVED: To provide an efficient inductor component to facilitate integration of switched mode buck voltage regulators into system-on-chips (SOCs).SOLUTION: At least two counter wound aircoils are formed on a surface mounted device (SMD) inductor former. The aircoils are connected to three terminals on the SMD former. A single terminal is connected to a common node of both windings with two independent terminals accessing the other winding node. | ||||||
| 54 | Surface-mount air-core coil | JP2009131018 | 2009-05-29 | JP2010278348A | 2010-12-09 | SAKUMA YUJI; YAMADA TOSHIYUKI; FURUTA TOSHIRO; AOKI KAZUHARU |
| PROBLEM TO BE SOLVED: To provide a surface-mount air-core coil that is mounted by an automatic mounter with high position precision and superior absorbent by self-alignment effects, which is high in mechanical strength in a mounting state. SOLUTION: An air-core coil 1 is configured of a cylindrical coil winding part 2 molded in such a shape that the upper face side is flat, and that the lower face side is curved and a pair of terminals 3 continuously formed at both the ends of the coil winding part 2. The coil winding part 2 is formed by winding a conductive wire 1b covered with an insulating coating 1a like a spiral, and the conductive wire 1b extended from both the ends of the coil winding part 2 is bent at an almost right angle, and extended in a horizontal direction so that a terminal 3 can be formed. This air-core coil 1 is face-mounted on a circuit board 10 by soldering each terminal 3 to a corresponding electrode land 11 in such a state that a low face side curved section 2b of the coil winding part 2 is loaded on the circuit board 10. COPYRIGHT: (C)2011,JPO&INPIT | ||||||
| 55 | Inductance component | JP2007022689 | 2007-02-01 | JP2008192673A | 2008-08-21 | YAMAMOTO KENICHI; OBA MICHIO; MATSUTANI SHINYA |
| <P>PROBLEM TO BE SOLVED: To improve shock reliability in an inductance component having an element body. <P>SOLUTION: The inductance component has: an element body 4; a coil 5 formed in the element body 4; and an electrode 6 electrically connected to the coil 5. A shock absorption layer 7 is provided between the electrode 6 and the element body 4. With such a configuration, even if shock is applied to the element body 4, the element body 4 can be deflected by utilizing the shock absorption layer 7, thus obtaining high shock reliability. <P>COPYRIGHT: (C)2008,JPO&INPIT | ||||||
| 56 | Coil with pad and its process for fabrication | JP2006342080 | 2006-12-20 | JP2007243151A | 2007-09-20 | HUANG RU-KUEN; CHEN CHIEH-CHENG |
| PROBLEM TO BE SOLVED: To provide a coil with a pad, along with its process for fabrication, which is applied for mass production, with good jointing strength and reliability at the connection part between a coil body and a pad. SOLUTION: The process for fabrication of a coil with a pad includes following steps. At least one conductive bump S is formed on a substrate 1 comprising at least one pad 11. At least one end of at least one coil body C is placed on the pad 11, and the end of the coil body C is made to contact the corresponding conductive bump S. Then, the shape of the conductive bump S is changed so that the conductive bump S connects the coil body C to the pad 11. COPYRIGHT: (C)2007,JPO&INPIT | ||||||
| 57 | Inducible system | JP2006518423 | 2004-06-28 | JP2007519218A | 2007-07-12 | ウェイ リー，スー; ヨン リム，クォイ |
| 互いに直列に結合されたプリントコイルの形をした第一の部分（１１，１２）及び非プリントコイルの形をした第二の部分（１２，２２）を有する誘導性システム（１，２）は、比較的大きなインダクタンスを有し、それでも比較的小さなサイズでありうる。 非プリントコイルはエアコイルを有する。 誘導性システム（１，２）の全インダクタンスは、プリントコイル（１１，１２）のインダクタンスと、エアコイルのインダクタンスと、プリントコイル（１１，１２）とエアコイルとの間の重なり領域に依存する相互インダクタンスとを足し合わせたものにほぼ等しい。 両コイル（１１，１２）をコンパクトに結合するように、非プリントコイル（１２）の一端は、プリントコイル（１１）の中心端に結合され、非プリントコイル（１２）の他方の端及びプリントコイル（１１）の外端は、誘導性システム（１）の端を構成する。 | ||||||
| 58 | Small impedance conversion circuit | JP2006520952 | 2004-07-13 | JP2006528854A | 2006-12-21 | イゴル アイ ブレドノヴ |
| 本発明は、基板(20)において隔置されて形成される第１接触パッド(51)及び第２接触パッド(52)を具えるインピーダンス変換回路(10;11a;11b;12)に関する。 前記インピーダンス変換回路は、少なくとも第１回路要素(40)を具え、第１回路要素(40)は、前記基板(20)において形成される接触領域(41)を提供すると共に前記第１(51)及び前記第２(52)接触パッド間に隣接して配置される。 第１ワイヤ要素(31)は、基板(20)の上方に延在し、第１接触パッド(51)と第１回路要素(40)の接触領域の第１端部(41a)とを接続する一方で、少なくとも第２ワイヤ要素(32)は、基板の上方に延在し、第２接触パッド(52)と第１回路要素(40)の接触領域の第２端部(41b)とを接続する。 第１回路要素(40)の接触領域は、接触領域と固定参照電位との間において所定のキャパシタンスを有する容量性結合を提供するように形成される。 回路全体の詰め込み密度は、第１ワイヤ要素(31)及び少なくとも第２ワイヤ要素(32)を同一形状にし、かつこれらを互いにほぼ並列に配置させ、更に、前記第１接触パッド(51)及び前記第２接触パッド(52)を、少なくとも第１回路要素(40)の接触領域の対峙する側において位置させることによって、有利に増加されることが可能である。 本発明に従う多重インピーダンス変換回路は、多重結合ワイヤ・インピーダンス変換回路(12)に有利に組み合わせられ得る。 | ||||||
| 59 | Inductor and its manufacturing method | JP2005210618 | 2005-07-20 | JP2006032976A | 2006-02-02 | LEE MOON-CHUL; CHOI HYUNG |
| PROBLEM TO BE SOLVED: To provide an inductor which is integrated on a substrate with high formation accuracy, and which secures a sufficiently high Q-value and an inductance especially in a high frequency band, by providing an air gap between a conductor and the substrate to suppress a parasitic capacity between both. SOLUTION: An opening is formed in the substrate by dry etching. A first and a second conductor are formed symmetrically on a front and rear side of the substrate, preferably, in spiral form to the substrate, respectively. Especially, two conductors mutually face the opening of the substrate, and float in a space of the opening. Thereby a big air gap is formed between respective conductors and the substrate. Since a connection part connects both conductors, two conductors constitute an inductor in a dual structure. The first and the second conductor, and the space around them are sealed with a first and a second protector from the outside. COPYRIGHT: (C)2006,JPO&NCIPI | ||||||
| 60 | 半導体装置及びその製造方法並びに半導体製造装置 | JP2002553199 | 2001-03-21 | JPWO2002052589A1 | 2004-04-30 | 京極 敏彦; 神津 正; 望月 清春; 菊池 栄; 石津 昭夫; 小林 義彦; 丸山 昌志; 神代 岩道; 佐藤 勧 |
| 高周波電力増幅装置は二つの増幅系を有する。増幅系は、複数の増幅段を従続接続した構成になり、電源電圧端子は2端子となり、一方の電源電圧端子は一方の増幅系の初段増幅段と他方の増幅系の残りの増幅段にそれぞれ接続され、他方の電源電圧端子は他方の増幅系の初段増幅段と一方の増幅系の残りの増幅段にそれぞれ接続されている。各増幅系の最終増幅段と電源電圧端子との間には、0.1mm程度の直径の銅線を螺旋状に密に巻いた直流抵抗が小さい空芯コイルが直列に接続されている。各増幅系は最終増幅段からの初段増幅段への信号の漏れがないことと、空芯コイルの直流抵抗が小さいことから発振マージンが改善される。空芯コイルは安価であり高周波電力増幅装置の低コスト化が図れる。空芯コイルはバルクフィーダで供給されてモジュール基板に搭載される。 | ||||||
