子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 101 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE | EP15155491.2 | 2015-02-18 | EP2919265A2 | 2015-09-16 | Hsu, Wen-Sung; Yu, Ta-Jen |
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
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| 102 | Thin film coil and electronic device having the same | EP12275087.0 | 2012-06-06 | EP2645385A2 | 2013-10-02 | Lim, Dae Ki; Sung, Jae Suk; Kim, Tae Sung; Nam, Hyeon Gil; An, Chan Gwang; Lee, Hyun Seok; Chang, Ki Won; Han, Chang Mok; Bae, Sang Woo; Cho, Sung Eun |
There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
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| 103 | Electromagnetic interference filter | EP11152845.1 | 2011-02-01 | EP2357727B1 | 2013-07-10 | Ho, Ho Yan |
| A differential mode and common mode combination choke (DCCC) includes: a theta-shaped magnetic core including an essentially round magnetic ring and a magnetic plate engaged with magnetic ring across the area surrounded by the magnetic ring; and two common mode coils with the same number of turns and the same winding direction being wound around the magnetic ring. An EMI (electromagnetic interference) filter and an EMI filter module including the DCCC are also provided. | ||||||
| 104 | INDUCTOR COMPOSED OF CAPACITOR ARRAY | EP11771932.8 | 2011-04-14 | EP2562776A1 | 2013-02-27 | SAHU Satyajit; BANDYOPADHYAY Anirban; FUJITA Daisuke |
A spiral capacitor-inductor device in which an array of unit capacitors 101 is arranged in a loop along the length is provided as the fourth circuit element. An input signal is applied to one end of the array of the unit capacitors, an output signal is taken out from the other end, an electric charge stored in each unit capacitor increases or decreases in accordance with increase or decrease in the bias applied to the device, the increase or decrease in the electric charge causes the current of the loop to increase or decrease, and ,as a result, the magnetic flux 103 generated in the device varies. Accordingly, the fourth circuit element is provided that follows after an inductor, a capacitor, and a resistor is provided in which the electric charge stored determines the magnitude of its magnetic flux. |
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| 105 | SYSTEM AND METHOD FOR WIRELESS POWER TRANSFER IN IMPLANTABLE MEDICAL DEVICES | EP10751119.8 | 2010-03-09 | EP2406655A1 | 2012-01-18 | DERBAS, Justin, R.; SINGH, Vinit |
| A resonator is provided for use in a system for energy transfer between a first device and a second device. The resonator includes a coil having multiple layers, each layer including inductive and insulative layers. The thickness of a conductor layer may be relative to the skin depth of the conductor. | ||||||
| 106 | Composant électronique inductif pour le report à plat | EP84401338.3 | 1984-06-26 | EP0130902B1 | 1987-11-19 | Granjean, Daniel; Larue, Henri |
| 107 | ELEKTRISCHER ÜBERTRAGER | EP85902961.0 | 1985-06-11 | EP0187771A1 | 1986-07-23 | PFIZENMAIER, Heinz; SCHMIDT, Ewald |
| Le transformateur à haute fréquence proposé dans la technique des circuits imprimés présente des inductances et des capacités. Les inductances consistent ici en un agencement de bobine (9, 17; 10, 18) présentant un noyau (5) de ferrite fermé et réalisé sous forme de pistes conductrices sur un support isolant (1). Les capacités sont constituées par un revêtement conducteur (28), l'agencement de bobine (9, 17; 10, 18) étant couplé capacitivement au revêtement conducteur (28) par un diélectrique (27). | ||||||
| 108 | POWER INDUCTOR | US16326185 | 2017-08-30 | US20190189338A1 | 2019-06-20 | Gyeong Tae KIM; Tae Geun SEO; Sang Jun PARK |
| Provided is a power inductor. The power inductor includes a body including metal powder and an insulation material, at least one base provided in the body, at least one coil pattern disposed on at least one surface of the base, and an external electrode disposed on each of at least two side surfaces of the body. At least a portion of the external electrode is made of the same material as the coil pattern. | ||||||
| 109 | INDUCTOR COMPONENT AND POWER SUPPLY MODULE | US16269587 | 2019-02-07 | US20190189334A1 | 2019-06-20 | Munetake MIYASHITA; Takayuki TANGE; Hideaki HASHI |
| An inductor component includes cores, a coil disposed in the cores, and terminal electrodes. The coil includes first metal plates disposed on an upper surface of the cores, second metal plates disposed on a lower surface of the cores, and a plurality of metal pins each passing through one of the cores in a thickness direction. The coil has a helical shape by connecting the first metal plates to the second metal plates, with the plurality of metal pins therebetween. The terminal electrodes are spaced apart along a direction in which the helical shape extends, and are connected to the coil. | ||||||
| 110 | INTEGRATED CIRCUIT INCLUDING A PLURALITY OF COMPONENTS INCLUDING A TRANSFORMER | US16046191 | 2018-07-26 | US20190109612A1 | 2019-04-11 | Sebastien Robert; Guy Le Moal |
| An integrated circuit comprising a transceiver including a transformer. The transformer includes an input coupled to one or more primary windings. The transformer also includes a first differential output coupled to a first set of one or more secondary windings. The transformer further includes a second differential output coupled to a second, different set of one or more secondary windings. A method of making an integrated circuit comprising a transceiver. The method includes forming a plurality of components on and/or in a semiconductor substrate. At least one of the components comprises a transformer. The method includes forming the transformer by forming one or more primary windings coupled to an input, forming a first set of one or more secondary windings coupled to a first differential output, and forming a second, different set of one or more secondary windings coupled to a second differential output. | ||||||
| 111 | LC FILTER AND METHOD OF MANUFACTURING LC FILTER | US16030106 | 2018-07-09 | US20180316331A1 | 2018-11-01 | Toshiyuki Nakaiso |
| An LC filter having a multilayer body, coil conductor patterns, a thin-film capacitor, and input/output terminal conductors. The multilayer body is formed by stacking a plurality of resin sheets. At least a portion of the coil conductor pattern is embedded in a resin sheet. The thin-film capacitor is at least partially embedded in the resin sheet, is disposed in the coil opening of the coil conductor pattern, which is spiral-shaped, and is connected to the coil conductor pattern. The thickness of the coil conductor patterns is smaller than the thickness of the resin sheets, and the thickness of the thin-film capacitor is smaller than the thickness of the resin sheets. | ||||||
| 112 | Thin Film Inductor and Power Conversion Circuit | US16015930 | 2018-06-22 | US20180301270A1 | 2018-10-18 | Heqian Yang; Yongfa Zhu; Xiaolong Luo |
| A thin film inductor is disclosed, which includes a thin film magnetic core. The thin film magnetic core includes at least one magnetic thin film. In each magnetic thin film, at least one type-1 gap is provided. A length direction of the type-1 gap is parallel to a direction of hard magnetization of the magnetic thin film. If the thin film magnetic core comprises at least two magnetic thin films, the at least two magnetic thin films are laminated and overlap each other. A sum of widths of all type-1 gaps in each magnetic thin film is the same. | ||||||
| 113 | Thin film coil and electronic device having the same | US15653725 | 2017-07-19 | US10103554B2 | 2018-10-16 | Dae Ki Lim; Tae Sung Kim; Hyeon Gil Nam; Chan Gwang An; Hyun Seok Lee; Ki Won Chang; Chang Mok Han; Sang Woo Bae; Sung Eun Cho; Jae Suk Sung |
| There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates. | ||||||
| 114 | LAMINATED COIL | US15990857 | 2018-05-29 | US20180277293A1 | 2018-09-27 | Shingo ITO; Takumi TANAKA |
| A laminate of a laminated coil includes first and second sections in a stacking direction from a first surface toward a second surface. The number of windings of each of coil conductor patterns on insulation resin layers, respectively, in the first region is equal to or more than the number of windings of a coil conductor pattern on an insulation resin layer in the second section, and is more than the number of windings of the coil conductor pattern closest to the second surface in the second section. The number of main conductor portions per unit distance in the first section is more than the number of main conductor portions per unit distance in the second section. The outermost main conductor portion of the coil conductor pattern in the second section has a width more than a width of the main conductor portion of the coil conductor pattern in the first section. | ||||||
| 115 | Electronic component and electronic component built-in board | US15473670 | 2017-03-30 | US10085344B2 | 2018-09-25 | Masaki Hirota; Yoshikazu Sasaoka; Yasunori Taseda; Shinichiro Kuroiwa |
| An electronic component includes an inner electrode inside of a main body and exposed at a surface of the main body, and an outer electrode on a surface of the main body and electrically connected to the inner electrode, wherein a plurality of recesses are provided in a surface of the outer electrode, and each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess. | ||||||
| 116 | Common mode filter | US15311918 | 2014-05-27 | US10038421B2 | 2018-07-31 | Masaaki Kameya |
| A common mode filter suppressing a reflection of a common mode noise and sufficiently removing the common mode noise of 2 GHz or less includes: a signal coil spirally formed in a dielectric layer of a multilayer structure, and serially inserted and connected to one of the differential signal lines; a signal coil inserted and connected to the other differential signal line and formed in the dielectric layer so as to face the signal coil through the dielectric layer; a control coil formed in the dielectric layer so as to be sandwiched between the first and second signal coils interposing the dielectric layer and wound in the same direction as the signal coil; and an embedded resistor connected to at least one of an outer peripheral end or an inner peripheral end of the control coil, thus forming a feedback loop circuit by the control coil and the embedded resistor. | ||||||
| 117 | Apparatus with 3D wirewound inductor integrated within a substrate | US15160776 | 2016-05-20 | US10026546B2 | 2018-07-17 | Changhan Hobie Yun; Chengjie Zuo; Daeik Daniel Kim; Mario Francisco Velez; Niranjan Sunil Mudakatte; Jonghae Kim; David Francis Berdy |
| An apparatus includes a substrate and a three-dimensional (3D) wirewound inductor integrated within the substrate. The apparatus further includes a capacitor coupled to the 3D wirewound inductor. | ||||||
| 118 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE | US15893527 | 2018-02-09 | US20180166297A1 | 2018-06-14 | Wen-Sung Hsu; Ta-Jen Yu |
| The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface. | ||||||
| 119 | INDUCTOR | US15725729 | 2017-10-05 | US20180166198A1 | 2018-06-14 | Jin Seong KIM; Jae Hyun KWON |
| An inductor includes a body having a coil portion disposed therein, and a protective layer disposed on a surface of the body. The body includes an active portion in which a coil portion is disposed, and a cover portion disposed on upper and lower surfaces of the coil portion. A grain size in the protective layer is greater than a grain size in the body. | ||||||
| 120 | LC FILTER | US15849938 | 2017-12-21 | US20180115295A1 | 2018-04-26 | Hiroshi MASUDA |
| An LC filter includes a laminate including insulating layers laminated in a lamination direction, an inductor having a spiral or helical shape around an axis parallel or substantially parallel to the lamination direction, and a capacitor in which capacitor conductors face each other. The inductor and the capacitor do not overlap as viewed from the lamination direction and all directions orthogonal or substantially orthogonal to the lamination direction. | ||||||
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